component
MAX17261METD+
Public Made by Adomby adom
Analog Devices Inc Maxim Integrated Battery Management, TDFN-14(3x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownMAX17261METD+
Analog Devices Inc Maxim Integrated · Battery Management · TDFN-14(3x3)
MAX17261METD+ from Analog Devices Inc Maxim Integrated, in a TDFN-14(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | TH | input | Thermistor input: connect a thermistor from TH to GND; TH also provides battery insertion/removal detection, and should be connected to BATT if not used. |
| 2 | NC | unconnected | No Connection. |
| 3 | SW | output | Gate switch signal used to control an optional FET in the resistor divider circuit for low-power operation. |
| 4 | NC | unconnected | No Connection. |
| 5 | NC | unconnected | No Connection. |
| 6 | BATT | power_in | IC power supply: connect to a 3 to 5 volt supply and bypass with a 0.1µF capacitor to GND. |
| 7 | CSN | input | Sense resistor negative sense point, Kelvin connected to the system side of the sense resistor. |
| 8 | GND | power_in | IC ground. |
| 9 | CSPL | input | Sense resistor positive sense point, Kelvin connected to the cell side of the sense resistor. |
| 10 | CELLX | input | Voltage measurement point for multiple-series cell applications, connected to an external voltage divider to measure a fraction of the cell voltage. |
| 11 | REG | power_out | Internal 1.8V regulator output: bypass with an external 0.47µF capacitor to GND and do not load externally. |
| 12 | ALRT | output | Open-drain active-low alert output indicating fuel-gauge alerts; connect to GND if not used. |
| 13 | SDA | bidirectional | Serial data input/output of the 2-wire I2C interface; open-drain output driver with an internal pulldown for disconnection sensing. |
| 14 | SCL | input | Serial clock input of the 2-wire I2C interface; input only, with an internal pulldown for disconnection sensing. |
| 15 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Analog Devices Inc Maxim Integrated |
| Package | TDFN-14(3x3) |
| Category | Power Management (PMIC) |
| Pins | 15 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Shutdown Supply Current | IDD0 | 0.5 | 0.9 | μA | TA ≤ +50ºC | 7 | |
| Hibernate Supply Current | IDD1 | 5.1 | 12 | μA | TA ≤ +50ºC, average current | 7 | |
| Active Supply Current | IDD2 | 15 | 30 | μA | TA ≤ +50ºC, average current not including thermistor measurement current | 7 | |
| Supply Voltage | VBATT | 2.3 | 4.9 | V | 7 | ||
| Regulation Voltage | VREG | 1.8 | V | 7 | |||
| Startup Voltage | VBATTSU | 3 | V | 7 | |||
| CELLX Measurement Error | VXGERR | -0.2 | 0.2 | % of Reading | TA = +25ºC | 7 | |
| CELLX Measurement Error | VXGERR | -0.5 | 0.5 | % of Reading | -40ºC ≤ TA ≤ 85ºC | 7 | |
| CELLX Measurement Range | VXFS | 0.92 | 2 | V | 7 | ||
| Current Measurement Offset Error | IOERR | -1.5 | 1.5 | μV | Long-term average without load current | 7 | |
| Current Measurement Error | IGERR | -1 | 1 | % of Reading | 7 | ||
| Current Measurement Range | IFS | -51.2 | 51.2 | mV | 7 | ||
| Internal Temperature Measurement Error | TIGERR | -1 | 1 | ºC | -40ºC ≤ TA ≤ +85ºC | 7 | |
| External Thermistance Resistance (Config.R100 = 0) | REXT10 | 10 | kΩ | Config.R100 = 0 | 7 | ||
| External Thermistance Resistance (Config.R100 = 1) | REXT100 | 100 | kΩ | Config.R100 = 1 | 7 | ||
| Output Drive Low, ALRT, SDA | VOL | 0.4 | V | IOL = 4mA, VBATT = 2.3V | 7 | ||
| Input Logic High, ALRT, SCL, SDA | VIH | 1.5 | V | 7 | |||
| Input Logic Low, ALRT, SCL, SDA | VIL | 0.5 | V | 7 | |||
| Battery-Detach Detection Threshold | VDET | 91 | 96.2 | 99 | % | Measured as a fraction of VBATT on TH rising | 7 |
| Battery-Detach Detection Threshold Hysteresis | VDET-HYS | 1 | % | Measured as a fraction of VBATT on TH falling | 8 | ||
| Battery-Detach Comparator Delay | tTOFF | 100 | μs | TH step from 70% to 100% of VBATT (Alrtp = 0, EnAIN = 1, FTHRM = 1) | 8 | ||
| Leakage Current, CSN, ALRT | ILEAK | -1 | 1 | μA | VALRT < 15V | 8 | |
| Leakage Current, CELLX | ILEAK_CELLX | -60 | 60 | nA | VCELLX < 2.0V | 8 | |
| Input Pulldown Current | IPD | 0.05 | 0.2 | 0.4 | μA | VSDA = 0.4V, VSCL = 0.4V | 8 |
| SCL Clock Frequency | fSCL | 0 | 400 | kHz | Note 2 | 8 | |
| Bus Free Time Between a STOP and START Condition | tBUF | 1.3 | μs | 8 | |||
| Hold Time (Repeated) START Condition | tHD:STA | 0.6 | μs | Note 3 | 8 | ||
| Low Period of SCL Clock | tLOW | 1.3 | μs | 8 | |||
| High Period of SCL Clock | tHIGH | 0.6 | μs | 8 | |||
| Setup Time for a Repeated START Condition | tSU:STA | 0.6 | μs | 8 | |||
| Data Hold Time | tHD:DAT | 0 | 0.9 | μs | Notes 4, 5 | 8 | |
| Data Setup Time | tSU:DAT | 100 | ns | Note 4 | 8 | ||
| Rise Time of Both SDA and SCL Signals | tR | 5 | 300 | ns | 8 | ||
| Fall Time of Both SDA and SCL Signals | tF | 5 | 300 | ns | 8 | ||
| Setup Time for STOP Condition | tSU:STO | 0.6 | μs | 8 | |||
| Spike Pulse Width Suppressed by Input Filter | tSP | 50 | ns | Note 6 | 8 | ||
| Capacitive Load for Each Bus Line | CB | 400 | pF | Note 7 | 8 | ||
| SCL, SDA Input Capacitance | CBIN | 6 | pF | 8 | |||
| Time-Base Accuracy | tERR | -1 | 1 | % | TA = +25°C | 8 | |
| TH Precharge Time | tPRE | 8.48 | ms | 9 | |||
| BATT to GND | -0.3 | 6 | V | 6 | |||
| ALRT to GND | -0.3 | 17 | V | 6 | |||
| REG to GND | -0.3 | 2.2 | V | 6 | |||
| TH to GND | -0.3 | V | 6 | ||||
| CELLX to GND | -0.3 | V | 6 | ||||
| CSN to GND | -0.3 | V | 6 | ||||
| CSPL to GND | -0.3 | 0.3 | V | 6 | |||
| SDA, SCL to GND | -0.3 | 6 | V | 6 | |||
| SW to GND | -0.3 | V | 6 | ||||
| Operating Temperature Range | -40 | 85 | °C | 6 | |||
| Junction Temperature | 150 | °C | 6 | ||||
| Storage Temperature Range | -55 | 125 | °C | 6 | |||
| Soldering Temperature (reflow) | 260 | °C | 6 | ||||
| Continuous Source Current for TH | 1 | mA | 6 | ||||
| Lead Temperature (soldering 10s) | 300 | ºC | soldering 10s | 6 | |||
| Junction to Ambient, Single-Layer Board (TDFN) | θJA | 54 | ºC/W | JESD51-7, single-layer board | 6 | ||
| Junction to Case, TDFN | θJC | 8 | ºC/W | JESD51-7, single-layer board | 6 | ||
| Junction to Ambient, Four-Layer Board (TDFN) | θJA | 41 | ºC/W | JESD51-7, four-layer board | 6 | ||
| Junction to Case, TDFN (four-layer) | θJC | 8 | ºC/W | JESD51-7, four-layer board | 6 |
CAD (KiCad official)
- Symbol:
MAX17261METD+ - Footprint:
Package_DFN_QFN:DFN-14-1EP_3x3mm_P0.4mm_EP1.78x2.35mm - 3D model: TDFN-14(3x3) (KiCad packages3D, STEP)
- 3D model files:
max17261metd-etched.step/max17261metd-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);max17261metd.step/max17261metd.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Analog Devices Inc Maxim Integrated datasheet (32 pp, sha256
fb34c45047a3412b, retrieved 2026-10-19, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).