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Contents

README

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BLM15PX121BH1D

MURATA MANUFACTURING · Global Sourcing Parts · 0402

BLM15PX121BH1D from MURATA MANUFACTURING, in a 0402. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Terminal 1 of an unpolarised inductor or ferrite bead; either orientation.
2 2 passive Terminal 2 of an unpolarised inductor or ferrite bead; either orientation.

Key specifications

Parameter Value
Manufacturer MURATA MANUFACTURING
Package 0402
Category Global Sourcing Parts
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Impedance at 100 MHz (nominal) Z 120 Ω at 100 MHz 1
Impedance tolerance Z -25 25 % at 100 MHz, printed ±25% 1
Rated current, ambient 85°C 2000 mA ambient temperature 85°C 1
Rated current, ambient 125°C 1100 mA ambient temperature 125°C 1
Rated current, ambient 150°C (value as printed in table) 10 mA ambient temperature 150°C 1
DC resistance, initial value DCR 0.055 Ω initial value (max.) 1
DC resistance, value after testing DCR 0.07 Ω value after testing (max.) 1
Operating temperature range Top -55 150 °C 1
Storage temperature range Tstg -55 150 °C 1
Impedance change rate after high temperature exposure Z -30 30 % 1000 h at 150°C, measured after 24 h at room condition 3
Impedance change rate after temperature cycling Z -50 50 % 1000 cycles, -55°C to +150°C 3
Impedance change rate after biased humidity Z -50 50 % 1000 h at 85°C, 85% (RH), max rated voltage and rated current applied 3
Impedance change rate after operational life Z -50 50 % 1000 h at 150°C 3
Impedance change rate after mechanical shock Z -30 30 % 1500 g's, 0.5 ms, half sine 3
Impedance change rate after vibration Z -30 30 % 5 g's for 20 min, 12 cycles each of 3 orientations, 10 Hz to 2000 Hz 3
Impedance change rate after resistance to soldering heat Z -30 30 % Solder temperature 260°C±5°C, immersion time 10 s 3
Impedance change rate after ESD Z -30 30 % Per AEC-Q200-002 3
Impedance change rate after board flex Z -30 30 % Epoxy-PCB 1.6 mm, 60 s minimum holding time 4
Board flex deflection 2 mm Epoxy-PCB (1.6 mm), 60 s minimum holding time 4
Peak reflow temperature, limit profile 260 °C limit soldering profile, 260°C/10 s; standard profile peak 245°C±3°C 7

CAD (KiCad official)

  • Symbol: BLM15PX121BH1D
  • Footprint: Inductor_SMD:L_0402_1005Metric
  • 3D model: 0402 (KiCad packages3D, STEP)
  • 3D model files: blm15px121bh1d-etched.step / blm15px121bh1d-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); blm15px121bh1d.step / blm15px121bh1d.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MURATA MANUFACTURING datasheet (10 pp, sha256 f91d50575531bfba, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary two-terminal convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF