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Contents

README

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AP7583AQ-MP-13

Diodes Incorporated · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · MSOP-8-EP

AP7583AQ-MP-13 from Diodes Incorporated, in a MSOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIN power_in Input voltage with a recommended supply range of 3.0V to 42V and an absolute maximum rating of -0.3V to 45V; a 10µF ceramic capacitor is recommended between IN and GND.
2 EN input Active-high enable input with VIL of 0V to 0.3V and VIH of 1.7V to VIN; tying it to VIN keeps the output on at all times.
3 NC unconnected Not connected internally; the datasheet recommends connecting it to GND to maximize PCB copper for thermal dissipation.
4 GND power_in Ground reference for the regulator; both GND pins (4 and 5) should be connected together on the PCB.
5 GND power_in Ground reference for the regulator; both GND pins (4 and 5) should be connected together on the PCB.
6 FB input Adjustable-version feedback pin where a resistor divider from FB to VOUT and GND sets the output, with VFB between 1.183V and 1.231V (typ 1.207V) and FB leakage between -10nA and 20nA.
7 PG output Open-drain power-good output with one internal pull-up resistor that is driven low when VOUT falls below the PG threshold and goes high-impedance above it, with a sinking voltage of at most 0.4V at 5mA.
8 VOUT power_out Regulated output voltage with an absolute maximum rating of -0.3V to 7V and an adjustable output range of 1.2V to 5.0V.
9 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package MSOP-8-EP
Category Power Management (PMIC)
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output Voltage Variation from Specified VOUT VOUT 98.5 101.5 % of VOUT 5
Input Voltage VIN 3 42 V 5
Feedback Reference Voltage VFB 1.183 1.207 1.231 V 5
Current Limit ILIMIT 310 510 690 mA VOUT short to 90% x VOUT 5
Line Regulation ΔVOUT/ΔVIN -10 10 mV VIN = VOUT + 1V to 40V, IOUT = 1mA 5
Load Regulation ΔVOUT/VOUT -20 20 mV 1mA ≤ IOUT ≤ 300mA 5
Dropout Voltage at VOUT = 3.3V VDROP 450 700 mV IOUT = 300mA @VOUT = 3.3V 5
Dropout Voltage at VOUT = 5V VDROP 320 500 mV IOUT = 300mA @VOUT = 5V 5
Quiescent Current (AP7583AQ) IQ 3 6 µA IOUT = 0 5
Shutdown Current ISHUTDOWN 0.3 0.5 µA EN = 0 5
EN Input Logic-Low Voltage VIL 0 0.3 V 5
EN Input Logic-High Voltage VIH 1.7 V 5
Output Voltage Temperature Coefficient ΔVOUT/(VOUT×ΔT) -100 100 ppm/°C IOUT = 100µA, -40°C ≤ TJ ≤ +125°C 5
UVLO VIN Undervoltage Detection (ramp VIN up) UVLO 2.1 2.4 2.7 V Ramp VIN up until the output turns on 5
FB Leakage Current (Adjustable Version) IFB -10 20 nA FB = 0 5
PG Rising Threshold VPGR 90 94 % VFB rising 5
PG Falling Threshold VPGF 88 92 % VFB falling 5
PG Sinking Voltage VPGS 0.4 V Sinking current = 5mA 5
Input Supply Voltage (absolute maximum) VIN -0.3 45 V 4
Regulated Output Voltage (absolute maximum) VOUT -0.3 7 V 4
Output Current IOUT 300 mA 4
Lead Temperature (Soldering, 10 sec) TLEAD 260 ºC Soldering, 10 sec 4
Operating Junction Temperature (absolute maximum) TJ 150 ºC 4
Storage Temperature Range TSTG -40 150 °C 4
CDM ESD (Charged Device Model) CDM -1500 1500 V 4
HBM ESD (Human Body Model) HBM -2000 2000 V 4
Supply Input Voltage (recommended) VIN 3 42 V 4
Supply Output Voltage (recommended) VOUT 1.2 5 V 4
Operating Junction Temperature (recommended) TJ -40 125 °C 4
Thermal Shutdown Temperature TOTSD 175 °C 5
Thermal Shutdown Hysteresis THYOTSD 20 °C 5
Power-Supply Rejection Ratio PSRR 70 dB V(Ripple) = 0.5VPP, IOUT = 10mA, frequency = 100Hz, COUT = 2.2µF 5
UVLO Hysteresis UVLO 0.2 V 5
Output Voltage Turn-On Delay Time tD 0.8 ms VEN high to VOUT rising 10% 5
Output Voltage Ramp Up Time tSS 200 µs VOUT rising 10% to 90% 5
PG React Time tPG 30 µs VOUT 90% to PG active 5
PG Off Deglitch Time tPGF 3 µs VFB falling to PG low 5
Thermal Resistance Junction to Ambient (MSOP-8EP) θJA 36.1 °C/W JEDEC STD.51 High-K board 4
Thermal Resistance Junction to Case (MSOP-8EP) θJC 6.532 °C/W 4

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing Abs HBM ESD (Human Body Model) ±2000 V Notes: 4. a). Stresses beyond those listed under Absolute Maximum Ratings can cause permanent damage to the device. These are stress ratings only and 4
contacts copper reduce noise. For PCB layout, a wide copper trace is required for both IN and GND pins. A lower ESR capacitor type allows the use of less 12

CAD (KiCad official)

  • Symbol: AP7583AQ-MP-13
  • Footprint: Package_SO:MSOP-8-1EP_3x3mm_P0.65mm_EP1.5x1.8mm
  • 3D model: MSOP-8-EP (KiCad packages3D, STEP)
  • 3D model files: ap7583aq-mp-13-etched.step / ap7583aq-mp-13-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ap7583aq-mp-13.step / ap7583aq-mp-13.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (21 pp, sha256 236be72831d65721, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF