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F12F4
Public Made by Adomby adom
TLC Electronic Disposable Fuses, 1206. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownF12F4
TLC Electronic · Disposable Fuses · 1206
F12F4 from TLC Electronic, in a 1206. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TLC Electronic |
| Package | 1206 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Time to open at 1.0In (rated current 4A) | 4 | hour | Rated current 4A; 1.0In | 2 | |||
| Time to open at 2.5In (rated current 4A) | 5 | sec | Rated current 4A; 2.5In | 2 | |||
| Operating temperature | -55 | 125 | ℃ | With proper correction factor applied | 5 | ||
| Preheat and soak temperature min. (Tsmin) | Tsmin | 150 | ℃ | Lead (Pb) free solder reflow profile | 4 | ||
| Preheat and soak temperature max. (Tsmax) | Tsmax | 200 | ℃ | Lead (Pb) free solder reflow profile | 4 | ||
| Time (Tsmin to Tsmax) | tS | 60 | 120 | Seconds | Lead (Pb) free solder reflow profile | 4 | |
| Average ramp up rate Tsmax to Tp | 3 | ℃ / Second | Max.; Lead (Pb) free solder reflow profile | 5 | |||
| Time at liquidous (tL) | tL | 60 | 150 | Seconds | Liquidous temperature (TL) 217℃; Lead (Pb) free solder reflow profile | 5 | |
| Peak package body temperature (TP) | TP | 260 | ℃ | Lead (Pb) free solder reflow profile | 5 | ||
| Average ramp-down rate (TP to Tsmax) | 6 | ℃ / Second | Max.; Lead (Pb) free solder reflow profile | 5 | |||
| Time (25℃ to Peak Temperature) | 8 | Minutes | Max.; Lead (Pb) free solder reflow profile | 5 | |||
| Wave solder reservoir temperature | 260 | ℃ | Wave solder | 4 | |||
| Wave solder time in reservoir | 10 | seconds | Wave solder; time in reservoir, maximum | 4 | |||
| Infrared reflow temperature | 260 | ℃ | Infrared reflow | 4 | |||
| Infrared reflow time | 30 | seconds | Infrared reflow; maximum | 4 | |||
| DC Interrupting Rating (Breaking Capacity) | 50 | A | @72Vdc; measured at rated voltage, time constant of less than 50 microseconds, battery source | 2 | |||
| Rated Voltage (DC) | 72 | V | DC | 2 | |||
| Rated Current | 4 | A | 2 | ||||
| Typical Cold Resistance | 35 | mOhms | Measured at <10% of rated current in ambient temperature of 25℃ | 2 | |||
| Typical Voltage Drop | 173 | mV | 2 | ||||
| Typical Pre-arcing I2t | I2t | 1.73 | A2Sec | Measured at 10In current | 2 |
CAD (KiCad official)
- Symbol:
F12F4 - Footprint:
Fuse:Fuse_1206_3216Metric - 3D model: 1206 (KiCad packages3D, STEP)
- 3D model files:
f12f4-etched.step/f12f4-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);f12f4.step/f12f4.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: TLC Electronic datasheet (5 pp, sha256
85bdc9f51b5e82b1, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarytwo-terminal convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).