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Contents

README

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SI8641BA-B-IU

Skyworks Solutions · Digital Isolators · QSOP-16

SI8641BA-B-IU from Skyworks Solutions, in a QSOP-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD1 power_in Side 1 power supply, 2.375 V to 5.5 V recommended operating range, with a 0.1 µF bypass capacitor to GND1 placed close to the package.
2 GND1 power_in Side 1 ground, which must be externally connected to side 1 ground on narrow-body style packages.
3 A1 input Side 1 digital input, passed to output B1 across the isolation barrier.
4 A2 input Side 1 digital input, passed to output B2 across the isolation barrier.
5 A3 input Side 1 digital input, passed to output B3 across the isolation barrier.
6 A4 output Side 1 digital output carrying the side 2 B4 input, driven to high impedance when EN1 is low.
7 EN1 input Side 1 active-high enable for output A4, internally pulled up to VDD1 so it can be left floating or tied to a logic level.
8 GND1 power_in Side 1 ground, which must be externally connected to side 1 ground on narrow-body style packages.
9 GND2 power_in Side 2 ground, which must be externally connected to side 2 ground on narrow-body style packages.
10 EN2 input Side 2 active-high enable for outputs B1, B2 and B3, internally pulled up to VDD2 so it can be left floating or tied to a logic level.
11 B4 input Side 2 digital input, passed to output A4 across the isolation barrier.
12 B3 output Side 2 digital output following input A3, driven to high impedance when EN2 is low.
13 B2 output Side 2 digital output following input A2, driven to high impedance when EN2 is low.
14 B1 output Side 2 digital output following input A1, driven to high impedance when EN2 is low.
15 GND2 power_in Side 2 ground, which must be externally connected to side 2 ground on narrow-body style packages.
16 VDD2 power_in Side 2 power supply, 2.375 V to 5.5 V recommended operating range, with a 0.1 µF bypass capacitor to GND2 placed close to the package.

Key specifications

Parameter Value
Manufacturer Skyworks Solutions
Package QSOP-16
Category Signal Isolation Devices
Pins 16

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PC 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 35

CAD (KiCad official)

  • Symbol: SI8641BA-B-IU
  • Footprint: Package_SO:QSOP-16_3.9x4.9mm_P0.635mm
  • 3D model: QSOP-16 (KiCad packages3D, STEP)
  • 3D model files: si8641ba-b-iu-etched.step / si8641ba-b-iu-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); si8641ba-b-iu.step / si8641ba-b-iu.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Skyworks Solutions datasheet (46 pp, sha256 032aeb8b1ade5e14, retrieved 2026-10-27, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF