component
ES8J
Public Made by Adomby adom
LGE Diodes - Fast Recovery Rectifiers, SMC. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownES8J
LGE · Diodes - Fast Recovery Rectifiers · SMC
ES8J from LGE, in a SMC. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | LGE |
| Package | SMC |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum Repetitive Peak Reverse Voltage | VRRM | 600 | V | 1 | |||
| Maximum RMS Voltage | VRMS | 420 | V | 1 | |||
| Maximum DC Blocking Voltage | VDC | 600 | V | 1 | |||
| Maximum Average Forward Rectified Current | I(AV) | 8 | A | 1 | |||
| Peak Forward Surge Current | IFSM | 125 | A | 8.3ms single half sine-wave superimposed on rated load | 1 | ||
| Maximum Instantaneous Forward Voltage | VF | 1.7 | V | 5.0A | 1 | ||
| Maximum DC Reverse Current | IR | 10 | µA | rated DC Blocking Voltage, TA = 25℃ | 1 | ||
| Maximum DC Reverse Current | IR | 350 | µA | rated DC Blocking Voltage, TA = 125℃ | 1 | ||
| Maximum Reverse Recovery Time | Trr | 35 | ns | IF=0.5A,IR=1A,Irr=0.25A | 1 | ||
| Operating Temperature Range | TJ | -55 | 150 | ℃ | 1 | ||
| Storage Temperature Range | TSTG | -55 | 150 | ℃ | 1 | ||
| Typical Junction Capacitance | CJ | 90 | pF | VR=4V,f=1MHZ | 1 | ||
| Typical Thermal Resistance junction-to-ambient | RθJA | 75 | ℃/W | P.C.B. mounted with 2.0" X 2.0" (5 X 5 cm) copper pad areas | 1 | ||
| Typical Thermal Resistance junction-to-case | RθJC | 20 | ℃/W | P.C.B. mounted with 2.0" X 2.0" (5 X 5 cm) copper pad areas | 1 |
CAD (KiCad official)
- Symbol:
ES8J - Footprint:
Diode_SMD:D_SMC - 3D model: SMC (KiCad packages3D, STEP)
- 3D model files:
es8j-etched.step/es8j-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);es8j.step/es8j.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: LGE datasheet (2 pp, sha256
e4caac315e92e85a, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).