ADM4850ARMZ from Analog Devices, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	RO	output	Receiver output: high when enabled and (A − B) ≥ −30 mV, low when enabled and (A − B) ≤ −200 mV.
2	RE	input	Receiver output enable: a low level enables RO, a high level places RO into a high impedance state.
3	DE	input	Driver output enable: a high level enables driver outputs A and B, a low level places them into a high impedance state.
4	DI	input	Driver input: with the driver enabled, a logic low forces A low and B high, a logic high forces A high and B low.
5	GND	power_in	Ground.
6	A	bidirectional	Noninverting receiver input A / noninverting driver output A.
7	B	bidirectional	Inverting receiver input B / inverting driver output B.
8	VCC	power_in	5 V power supply.

Key specifications

Parameter	Value
Manufacturer	Analog Devices
Package	MSOP-8
Category	Communication Interface Chip/UART/485/232
Pins	8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Differential Output Voltage	VOD	2		5	V	R = 50 Ω (RS-422), see Figure 19	3
Differential Output Voltage	VOD	1.5		5	V	R = 27 Ω (RS-485), see Figure 19	3
Differential Output Voltage over Common-Mode Range	/VOD3/	1.5		5	V	VTST = −7 V to +12 V, see Figure 20	3
Δ/VOD/ for Complementary Output States	Δ/VOD/			0.2	V	R = 27 Ω or 50 Ω, see Figure 19	3
Common-Mode Output Voltage	VOC			3	V	R = 27 Ω or 50 Ω, see Figure 19	3
Δ/VOC/ for Complementary Output States	Δ/VOC/			0.2	V	R = 27 Ω or 50 Ω, see Figure 19	3
Driver Output Short-Circuit Current, VOUT = High		-200		200	mA	−7 V < VOUT < +12 V	3
Driver Output Short-Circuit Current, VOUT = Low		-200		200	mA	−7 V < VOUT < +12 V	3
CMOS Input Logic Threshold Low				0.8	V		3
CMOS Input Logic Threshold High		2			V		3
CMOS Logic Input Current (DI)		-1		1	µA		3
DE Input Resistance to GND			220		kΩ		3
Differential Input Threshold Voltage	VTH	-200	-125	-30	mV	−7 V < VOC < +12 V	3
Input Hysteresis			20		mV	−7 V < VOC < +12 V	3
Input Resistance (A, B)		96	150		kΩ	−7 V < VOC < +12 V	3
Input Current (A, B)				0.125	mA	VIN = 12 V	3
Input Current (A, B)		-0.1			mA	VIN = −7 V	3
CMOS Logic Input Current (RE)		-1		1	µA		3
CMOS Output Voltage Low				0.4	V	IOUT = 4 mA	3
CMOS Output Voltage High		4			V	IOUT = −4 mA	3
Receiver Output Short-Circuit Current		7		85	mA	VOUT = GND or VCC	3
Three-State Output Leakage Current		-2		2	µA	0.4 V ≤ VOUT ≤ 2.4 V	3
Supply Current, shutdown (115 kbps)				5	µA	DE = 0 V, RE = VCC (shutdown)	3
Supply Current (115 kbps)			36	60	µA	DE = 0 V, RE = 0 V	3
Supply Current (115 kbps)			100	160	µA	DE = VCC	3
Driver Maximum Data Rate		115			kbps		4
Driver Propagation Delay	tPLH, tPHL	600		2500	ns	RLDIFF = 54 Ω, CL1 = CL2 = 100 pF, see Figure 21 and Figure 25	4
Driver Skew	tSKEW			70	ns	RLDIFF = 54 Ω, CL1 = CL2 = 100 pF, see Figure 21 and Figure 25	4
Driver Rise/Fall Times	tR, tF	600		2400	ns	RLDIFF = 54 Ω, CL1 = CL2 = 100 pF, see Figure 21 and Figure 25	4
Driver Enable Time	tZH, tZL			2000	ns	RL = 500 Ω, CL = 100 pF, see Figure 22 and Figure 27	4
Driver Disable Time	tLZ, tHZ			2000	ns	RL = 500 Ω, CL = 15 pF, see Figure 22 and Figure 27	4
Driver Enable Time from Shutdown				4000	ns	RL = 500 Ω, CL = 100 pF, see Figure 22	4
Receiver Propagation Delay	tPLH, tPHL	400		1000	ns	CL = 15 pF, see Figure 23 and Figure 26	4
Receiver Differential Skew	tSKEW			255	ns	CL = 15 pF, see Figure 23 and Figure 26	4
Receiver Enable Time	tZH, tZL		5	50	ns	RL = 1 kΩ, CL = 15 pF, see Figure 24 and Figure 28	4
Receiver Disable Time	tLZ, tHZ		20	50	ns	RL = 1 kΩ, CL = 15 pF, see Figure 24 and Figure 28	4
Receiver Enable Time from Shutdown				4000	ns	RL = 1 kΩ, CL = 15 pF, see Figure 24	4
Time to Shutdown		50	330	3000	ns	ADM4850 only	4
VCC to GND	VCC			6	V		6
Digital Input/Output Voltage (DE, RE, DI, RO)		-0.3			V	to VCC + 0.3 V (max)	6
Driver Output/Receiver Input Voltage		-9		14	V		6
Operating Temperature Range		-40		85	°C		6
Storage Temperature Range		-65		125	°C		6
Thermal Impedance, 8-Lead MSOP	θJA		133.1		°C/W	8-Lead MSOP	6
Lead Temperature, Soldering (10 sec)				300	°C	Soldering (10 sec)	6
Lead Temperature, Vapor Phase (60 sec)				215	°C	Vapor Phase (60 sec)	6
Lead Temperature, Infrared (15 sec)				220	°C	Infrared (15 sec)	6

CAD (KiCad official)

Symbol: ADM4850ARMZ
Footprint: Package_SO:MSOP-8_3x3mm_P0.65mm
3D model: MSOP-8 (KiCad packages3D, STEP)
3D model files: adm4850armz-etched.step / adm4850armz-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); adm4850armz.step / adm4850armz.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Analog Devices datasheet (16 pp, sha256 cdda52bf95925c41, retrieved 2026-10-30, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

ADM4850ARMZ

Verified ADM4850ARMZ

Verification log 1 record

3D Model

Symbol & Footprint

Schematic Symbol

PCB Footprint

Datasheet

README