Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

RT6362GSP

Richtek Tech · DC-DC Converters · SOP-8-EP

RT6362GSP from Richtek Tech, in a SOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 BOOT passive Bootstrap capacitor connection node to supply the high-side gate driver; connect a 0.1µF ceramic capacitor between this pin and the SW pin.
2 VIN power_in Power input with an input voltage range of 4V to 60V; connect a suitable input capacitor between this pin and GND, usually two 2.2µF or larger ceramic capacitors with one typical capacitance of 4.7µF.
3 EN input Enable control pin with internal pull-up current source; floating or a logic-high (≥1.25V) enables the converter, and a logic-low forces the device into shutdown mode.
4 RT/SYNC input Frequency setting and external synchronization input; connect a resistor from this pin to GND to set the switching frequency, or tie it to a clock source to synchronize to an external frequency.
5 FB input Output voltage sense input through a resistive divider, with a feedback reference voltage of 0.8V typically.
6 COMP passive Compensation node; external compensation elements connected to this pin stabilize the control loop.
7 GND power_in Ground; provides the ground return path for the control circuitry.
8 SW power_out Switch node that supplies power to the output; connect the output LC filter from SW to the output load.
9 PAD passive Exposed pad is internally unconnected and must be soldered to a large PCB copper area for maximum power dissipation.

Key specifications

Parameter Value
Manufacturer Richtek Tech
Package SOP-8-EP
Category Power Supply Chip
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Operating Voltage VIN 4 60 V After soft-start is finished 11
VIN Under-Voltage Lockout Threshold (rising) VUVLOH 4.1 4.3 4.5 V VIN rising 11
VIN Under-Voltage Lockout Threshold (falling) VUVLOL 3.8 3.9 4 V VIN falling 11
Shutdown Current ISHDN 1.3 4 μA VEN = 0V 11
Quiescent Current IQ 90 110 μA VEN = 2V, VFB = 0.83V, not switching 11
Enable Threshold Voltage VTH_EN 1.15 1.25 1.36 V 11
Reference Voltage VREF 0.788 0.8 0.812 V 11
High-Side Switch On-Resistance RDS(ON)_H 150 260 mΩ VIN = 12V, VBOOT-VSW = 5V 11
Current Limit ILIM 3.825 4.5 5.175 A fSW = 580kHz, VOUT = 5V 11
Minimum On-Time tON_MIN 100 130 ns IOUT = 1A 12
Switching Frequency 1 fSW1 85 100 115 kHz RRT/SYNC = 1.2M 12
Switching Frequency 2 fSW2 520 580 640 kHz RRT/SYNC = 200k 12
Switching Frequency 3 fSW3 2250 2500 2750 kHz RRT/SYNC = 44.2k 12
SYNC Frequency Range fSYNC 0.3 2.2 MHz External clock 12
SYNC Threshold Voltage (high) VIH_SYNC 1.9 2.2 V 12
SYNC Threshold Voltage (low) VIL_SYNC 0.5 0.7 V 12
Soft-Start Period (10% to 90%) tSS 1.4 2 2.6 ms 10% to 90%, RT6362GSP 12
Input Voltage Absolute Maximum VIN -0.3 65 V Supply voltage 10
Enable Voltage Absolute Maximum EN -0.3 65 V 10
Switch Voltage Absolute Maximum SW -0.6 65 V 10
Switch Voltage Absolute Maximum (transient) SW -5 70 V t ≤ 100ns 10
Switch Voltage Absolute Maximum (transient) SW -7 70 V t ≤ 5ns 10
BOOT to SW Voltage Absolute Maximum BOOT-SW -0.3 6 V 10
All Other Pins Voltage Absolute Maximum -0.3 6 V All other pins 10
Lead Temperature 260 °C Soldering, 10 sec. 10
Junction Temperature TJ 150 °C 10
Storage Temperature Range TSTG -65 150 °C 10
Supply Input Voltage VIN 4 60 V 10
Output Voltage VOUT 0.8 V Upper limit is VIN 10
Junction Temperature Range TJ -40 125 °C 10
Junction-to-ambient thermal resistance (JEDEC standard), SOP-8 (Exposed pad) θJA 31.8 °C/W JEDEC standard 10
Junction-to-case (top) thermal resistance, SOP-8 (Exposed pad) θJC(Top) 74.1 °C/W 10
Junction-to-case (bottom) thermal resistance, SOP-8 (Exposed pad) θJC(Bottom) 4.9 °C/W 10
Junction-to-ambient thermal resistance (specific EVB), SOP-8 (Exposed pad) θJA(EVB) 31.4 °C/W Specific EVB 10
Junction-to-top characterization parameter, SOP-8 (Exposed pad) ψJT 5.1 °C/W 10
Junction-to-board characterization parameter, SOP-8 (Exposed pad) ψJB 14.7 °C/W 10

CAD (KiCad official)

  • Symbol: RT6362GSP
  • Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm
  • 3D model: SOP-8-EP (KiCad packages3D, STEP)
  • 3D model files: rt6362gsp-etched.step / rt6362gsp-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); rt6362gsp.step / rt6362gsp.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Richtek Tech datasheet (38 pp, sha256 b92f7b4ec3be0cd1, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF