component
MP2236GJ-Z
Public Made by Adomby adom
MPS(芯源) DC-DC Converters, TSOT-23-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownMP2236GJ-Z
MPS(芯源) · DC-DC Converters · TSOT-23-8
MP2236GJ-Z from MPS(芯源), in a TSOT-23-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | AGND | power_in | Analog ground; connect AGND to GND using a short and wide PCB trace. |
| 2 | IN | power_in | Supply voltage input for a 3V to 18V input rail; decouple with a ceramic capacitor and connect using a wide PCB trace. |
| 3 | SW | output | Switch output; connect using a wide PCB trace. |
| 4 | GND | power_in | System power ground and reference ground of the regulated output voltage; connect to the ground plane with copper traces and vias. |
| 5 | BST | passive | Bootstrap; connect a 0.1µF capacitor between SW and BST to form a floating supply across the high-side switch driver. |
| 6 | EN | input | Enable; drive high to enable the MP2236, and it has a 2MΩ pull-down resistor to GND. |
| 7 | VCC | power_out | Internal bias supply; decouple with a 1µF capacitor placed close to VCC and GND. |
| 8 | FB | input | Feedback; connect to the tap of an external resistor divider from the output to GND to set the output voltage. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | MPS(芯源) |
| Package | TSOT-23-8 |
| Category | Power Management (PMIC) |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input voltage (VIN) | VIN | -0.3 | 20 | V | 3 | ||
| Switch voltage (VSW) | VSW | -0.3 | V | 3 | |||
| Switch voltage (VSW) transient | VSW | -6.5 | V | <10ns | 3 | ||
| Switch voltage (VSW) transient | VSW | 25 | V | <25ns | 3 | ||
| EN voltage (VEN) | VEN | 20 | V | 3 | |||
| All other pins voltage | -0.3 | 4 | V | 3 | |||
| Continuous power dissipation | PD | 1.89 | W | TA = 25°C, TSOT23-8 | 3 | ||
| Junction temperature | TJ | 150 | °C | 3 | |||
| Lead temperature | 260 | °C | 3 | ||||
| Storage temperature | -65 | 150 | °C | 3 | |||
| Supply voltage (VIN) | VIN | 3 | 18 | V | 3 | ||
| Output voltage (VOUT) | VOUT | 0.6 | 8 | V | or VIN x DMAX (note 4) | 3 | |
| Operating junction temperature (TJ) | TJ | -40 | 125 | °C | 3 | ||
| Supply current (shutdown) | IIN | 1 | μA | VEN = 0V, TJ = 25°C | 4 | ||
| Supply current (quiescent) | IQ | 150 | 210 | μA | VFB = 0.63V, PFM mode | 4 | |
| Low-side valley current limit | ILIMIT_L | 6 | 7.5 | A | 4 | ||
| Switching frequency | fSW1 | 480 | 600 | 720 | kHz | VIN = 12V, VOUT = 3.3V | 4 |
| Reference voltage | VFB | 594 | 600 | 606 | mV | TJ = 25°C | 4 |
| Reference voltage | VFB | 591 | 600 | 609 | mV | TJ = -40°C to +125°C | 4 |
| EN rising threshold | VEN_RISING | 1.12 | 1.2 | 1.28 | V | 4 | |
| VIN under-voltage lockout threshold-rising | INUVVth | 2.7 | 2.8 | 2.95 | V | 4 | |
| FB current | IFB | 10 | 50 | nA | VFB = 0.63V | 4 | |
| Switch leakage | SWLKG | 1 | μA | VEN = 0V, VSW = 0V, TJ = 25°C | 4 | ||
| Soft-start time | tSS | 0.5 | 1 | 1.5 | ms | TJ = 25°C, VOUT from 10% to 90% | 4 |
| HS switch on resistance | HSRDS(ON) | 25 | mΩ | VBST-SW = 3.3V | 4 | ||
| LS switch on resistance | LSRDS(ON) | 12 | mΩ | 4 | |||
| Low-side ZCD threshold | IZCD | 50 | mA | 4 | |||
| Minimum off time | tOFF_MIN | 170 | ns | 4 | |||
| Minimum on time | tON_MIN | 70 | ns | 4 | |||
| EN hysteresis | VEN_HYS | 200 | mV | 4 | |||
| EN to GND pull-down resistor | REN | 2 | MΩ | VEN = 2V | 4 | ||
| VIN under-voltage lockout threshold-hysteresis | INUVHYS | 300 | mV | 4 | |||
| VCC regulator | VCC | 3.5 | V | ICC = 5mA | 4 | ||
| UVP1 threshold | UVTH1 | 80 | % VREF | Hiccup entry | 4 | ||
| Thermal shutdown | TTSD | 150 | °C | 4 | |||
| Thermal hysteresis | TTSD_HYS | 20 | °C | 4 | |||
| Thermal resistance junction-to-ambient (θJA) | θJA | 66 | °C/W | EV2236-J-00A board (note 5) | 3 | ||
| Thermal resistance junction-to-case (θJC) | θJC | 23 | °C/W | EV2236-J-00A board (note 5) | 3 | ||
| Thermal resistance junction-to-ambient (θJA) | θJA | 100 | °C/W | JESD51-7 (note 6) | 3 | ||
| Thermal resistance junction-to-case (θJC) | θJC | 55 | °C/W | JESD51-7 (note 6) | 3 |
CAD (KiCad official)
- Symbol:
MP2236GJ-Z - Footprint:
Package_TO_SOT_SMD:TSOT-23-8 - 3D model: TSOT-23-8 (KiCad packages3D, STEP)
- 3D model files:
mp2236gj-z-etched.step/mp2236gj-z-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mp2236gj-z.step/mp2236gj-z.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: MPS(芯源) datasheet (21 pp, sha256
a363849f222c577f, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).