component

LPA4722AQVF

Public Made by Adom

by adom

LOWPOWER Audio Power OpAmps, TQFN-16-EP(3x3). Datasheet-verified pinout, KiCad symbol/footprint/3D.

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Contents

README

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LPA4722AQVF

LOWPOWER · Audio Power OpAmps · TQFN-16-EP(3x3)

LPA4722AQVF from LOWPOWER, in a TQFN-16-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 PVDD power_in Charge-pump power supply (2.5-5.5 V). Powers the charge-pump inverter, charge-pump logic, and oscillator. Bypass to PGND with a 1 µF capacitor placed as close to the pin as possible.
2 C1P passive Flying-capacitor positive terminal. Connect a 1 µF capacitor between C1P (pin 2) and C1N (pin 4) for the charge-pump inverter that generates the negative rail.
3 PGND power_in Power ground for the charge pump. Connect PGND and SGND together at the system ground plane.
4 C1N passive Flying-capacitor negative terminal. Paired with C1P via the 1 µF flying capacitor for the charge-pump inverter.
5 PVSS power_out Charge-pump output (negative supply rail generated internally). Decouple to PGND with a 1 µF capacitor. Also tied to BIAS externally to provide the amplifier's negative supply.
6 SGND power_in Signal ground for the amplifier section. Tie to PGND at the system ground plane to keep charge-pump return current out of the signal ground.
7 INR+ input Noninverting right-channel audio input. AC-coupled through CIN; input differential pair together with INR- sets the right channel gain (typ. −1 V/V with RIN = RF = 20 kΩ).
8 INR- input Inverting right-channel audio input. AC-coupled through CIN; forms the inverting side of the right-channel differential input.
9 SVDD power_in Amplifier positive power supply (2.5-5.5 V). Both SVDD pins (9 and 13) must be connected together to the positive supply. Bypass to SGND with a 1 µF capacitor placed as close to the pin as possible.
10 OUTR output Right-channel headphone output. Ground-referenced (DirectDrive) output, no DC-blocking capacitor required. Drives up to ~215 mW into 16 Ω.
11 BIAS power_in Amplifier negative power supply. Must be connected to PVSS (charge-pump output) to supply the amplifiers' negative rail and enable ground-referenced (DirectDrive) operation.
12 OUTL output Left-channel headphone output. Ground-referenced (DirectDrive) output, no DC-blocking capacitor required. Drives up to ~215 mW into 16 Ω.
13 SVDD power_in Amplifier positive power supply (2.5-5.5 V). Second SVDD bond pad; tie externally to pin 9 and to the positive supply. Bypass to SGND with a 1 µF capacitor as close to the pin as possible.
14 INL- input Inverting left-channel audio input. AC-coupled through CIN; forms the inverting side of the left-channel differential input.
15 INL+ input Noninverting left-channel audio input. AC-coupled through CIN; input differential pair together with INL- sets the left channel gain (typ. −1 V/V with RIN = RF = 20 kΩ).
16 SHDN input Active-low shutdown input. Drive low (VIL ≤ 0.6 V, tied to SGND/PGND) to enter shutdown (ISD ≈ 0.3 µA); drive high (VIH ≥ 1 V) for normal operation. Full operation is reached ~0.5 ms after release.
EP EP passive Exposed thermal pad on package underside. Electrically connect to PGND for best thermal performance, or leave unconnected.

Key specifications

Parameter Value
Manufacturer LOWPOWER
Package TQFN-16-EP(3x3)
Category Op-amp/Cmp
Pins 17

Ordering variants

Same part, different packaging or reel option.

  • LPA4722AQVF

CAD (KiCad official)

  • Symbol: LPA4722AQVF
  • Footprint: Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
  • 3D model: TQFN-16-EP(3x3) (KiCad packages3D, STEP)
  • 3D model files: lpa4722aqvf-etched.step / lpa4722aqvf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lpa4722aqvf.step / lpa4722aqvf.glb are the bare package body.

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
lpa4722aqvf.step 190 KB You want the bare part, or you mark your own boards.
lpa4722aqvf-etched.step 1.6 MB You want the part with LPA4722AQVF already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 438 faces against 110 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: LOWPOWER datasheet (14 pp, sha256 fc52aea35abab63b, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF