Loads on click. Unloads only if this page sits in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads on click. Unloads only if this page sits in the background.

PCB Footprint

Open full view ↗
Loads on click. Unloads only if this page sits in the background.
Loads on click. Unloads only if this page sits in the background.
Download PDF
Contents

README

markdown

TPS76801QPWPRG4Q1

Texas Instruments · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · HTSSOP-20

TPS76801QPWPRG4Q1 from Texas Instruments, in a HTSSOP-20. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND/HSINK power_in Ground and thermal heatsink connection
2 GND/HSINK power_in Ground and thermal heatsink connection
3 GND power_in Low-dropout regulator ground
4 NC unconnected No internal connection
5 EN input Enable input; TTL-compatible logic level control for regulator enable/shutdown
6 IN power_in Input voltage, 2.7 V to 10 V recommended operating range
7 IN power_in Input voltage, 2.7 V to 10 V recommended operating range
8 NC unconnected No internal connection
9 GND/HSINK power_in Ground and thermal heatsink connection
10 GND/HSINK power_in Ground and thermal heatsink connection
11 GND/HSINK power_in Ground and thermal heatsink connection
12 GND/HSINK power_in Ground and thermal heatsink connection
13 OUT power_out Regulated output voltage, 1.2 V to 5.5 V for adjustable version or fixed 1.8 V, 2.5 V, 3.3 V, or 5 V depending on part number
14 OUT power_out Regulated output voltage, 1.2 V to 5.5 V for adjustable version or fixed 1.8 V, 2.5 V, 3.3 V, or 5 V depending on part number
15 FB/NC input Feedback input voltage for adjustable device (TPS76801-Q1) or no connect for fixed-output versions
16 PG output Active-high power-good output for power-on reset or low-battery indication
17 NC unconnected No internal connection
18 NC unconnected No internal connection
19 GND/HSINK power_in Ground and thermal heatsink connection
20 GND/HSINK power_in Ground and thermal heatsink connection
21 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package HTSSOP-20
Category Power Management (PMIC)
Pins 21

CAD (KiCad official)

  • Symbol: TPS76801QPWPRG4Q1
  • Footprint: Package_SO:TSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP2.15x3.35mm
  • 3D model: HTSSOP-20, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.2 mm nominal TSSOP height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: tps76801qpwprg4q1-etched.step / tps76801qpwprg4q1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tps76801qpwprg4q1.step / tps76801qpwprg4q1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (32 pp, sha256 e77b9cc0b627fa86, retrieved 2026-10-07, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF