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Contents

README

markdown

MBR130LSFT1G

onsemi · Schottky Barrier Diodes (SBD) · SOD-123FL

MBR130LSFT1G from onsemi, in a SOD-123FL. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOD-123FL
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Repetitive Reverse Voltage VRRM 30 V 2
Working Peak Reverse Voltage VRWM 30 V 2
DC Blocking Voltage VR 30 V 2
Average Rectified Forward Current IO 1 A At rated VR, TL = 117°C 2
Peak Repetitive Forward Current IFRM 2 A At rated VR, square wave, 100 kHz, TL = 110°C 2
Non-Repetitive Peak Surge Current IFSM 40 A Halfwave, single phase, 60 Hz 2
Storage Temperature Tstg -55 150 °C 2
Operating Junction Temperature TJ -55 125 °C 2
Voltage Rate of Change dv/dt 10000 V/s Rated VR, TJ = 25°C 2
Maximum Instantaneous Forward Voltage VF 0.29 V TJ = 25°C, IF = 0.1 A (Note 3 pulse test) 2
Maximum Instantaneous Forward Voltage VF 0.36 V TJ = 25°C, IF = 0.7 A (Note 3 pulse test) 2
Maximum Instantaneous Forward Voltage VF 0.38 V TJ = 25°C, IF = 1.0 A (Note 3 pulse test) 2
Maximum Instantaneous Forward Voltage VF 0.18 V TJ = 100°C, IF = 0.1 A (Note 3 pulse test) 2
Maximum Instantaneous Forward Voltage VF 0.27 V TJ = 100°C, IF = 0.7 A (Note 3 pulse test) 2
Maximum Instantaneous Forward Voltage VF 0.3 V TJ = 100°C, IF = 1.0 A (Note 3 pulse test) 2
Maximum Instantaneous Reverse Current IR 1 mA TJ = 25°C, VR = 30 V 2
Maximum Instantaneous Reverse Current IR 25 mA TJ = 100°C, VR = 30 V 2
Thermal Resistance, Junction-to-Lead Rtjl 26 °C/W Note 1: mounted with minimum recommended pad size, PC board FR4 2
Thermal Resistance, Junction-to-Lead Rtjl 21 °C/W Note 2: mounted with 1 in. copper pad (Cu area 700 mm2) 2
Thermal Resistance, Junction-to-Ambient Rtja 325 °C/W Note 1: mounted with minimum recommended pad size, PC board FR4 2
Thermal Resistance, Junction-to-Ambient Rtja 82 °C/W Note 2: mounted with 1 in. copper pad (Cu area 700 mm2) 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin • Lead Finish: 100% Matte Sn (Tin) • Lead and Mounting Surface Temperature for Soldering Purposes: 1

CAD (KiCad official)

  • Symbol: MBR130LSFT1G
  • Footprint: Diode_SMD:D_SOD-123F
  • 3D model: SOD-123FL (KiCad packages3D, STEP)
  • 3D model files: mbr130lsft1g-etched.step / mbr130lsft1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mbr130lsft1g.step / mbr130lsft1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (6 pp, sha256 a92297423ed6049e, retrieved 2026-10-21, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF