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Contents

README

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FH3704B

XIN FEI HONG · MOSFETs · TO-263

FH3704B from XIN FEI HONG, in a TO-263. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; gate-source voltage limited to ±20 V (VGSS), threshold 1.3 to 2.5 V.
2 D passive Drain (center pin, also the tab); 40 V VDSS, 170 A continuous at TC=25°C (package limited), 590 A pulsed.
3 S passive Source; continuous source current 170 A and pulsed 590 A through the body diode.

Key specifications

Parameter Value
Manufacturer XIN FEI HONG
Package TO-263
Category Triode/MOS Tube/Transistor
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDSS 40 V 1
Continuous drain current (TC = 25°C) ID 170 A TC = 25°C 1
Continuous drain current (TC = 100°C) ID 114 A TC = 100°C 1
Pulsed drain current IDM 590 A 1
Gate-Source voltage VGSS -20 20 V 1
Avalanche energy EAS 544 mJ 1
Power Dissipation PD 186 W TC = 25°C 1
Storage Temperature Range TSTG -55 150 °C 1
Operating Junction Temperature Range TJ -55 150 °C 1
Drain-source breakdown voltage BVDSS 40 V VGS=0 V, ID=250uA 2
Gate threshold voltage VGS(th) 1.3 2.5 V VDS=VGS, D=250uA 2
Drain-source leakage current IDSS 1 μA VDS=40 V, VGS=0 V, TJ = 25°C 2
Drain-source leakage current IDSS 5 μA VDS=40 V, VGS=0 V, TJ = 125°C 2
Gate leakage current Forward IGSSF 100 nA VGS=20 V, VDS=0 V 2
Gate leakage current Reverse IGSSR -100 nA VGS=-20 V, VDS=0 V 2
Drain-source on-state resistance RDS(on) 2.5 3.5 mΩ VGS=10 V, ID=20 A 2
Drain-source on-state resistance RDS(on) 3.5 6 mΩ VGS=4.5 V, D=10 A 2
Forward transconductance gfs 26 S VDS =5 V , ID=50A 2
Continuous Source Current IS 170 A 2
Pulsed Source Current ISM 590 A 2
Diode Forward Voltage VSD 1.2 V VGS=0V, IS=50A, TJ=25℃ 2
Thermal Resistance, Junction-to-Case RθJC 0.88 °C/W 1
Thermal Resistance, Junction-to-Ambient RθJA 62.5 °C/W 1

CAD (KiCad official)

  • Symbol: FH3704B
  • Footprint: Package_TO_SOT_SMD:TO-263-2
  • 3D model: TO-263 (KiCad packages3D, STEP)
  • 3D model files: fh3704b-etched.step / fh3704b-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); fh3704b.step / fh3704b.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: XIN FEI HONG datasheet (6 pp, sha256 6bedeea31540a5fb, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF