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STM32F303K6T6
Public Made by Adomby adom
STMicroelectronics Microcontrollers (MCU/MPU/SOC), LQFP-32(7x7). Pinout checked against ST's open pin data, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownSTM32F303K6T6
STMicroelectronics · Microcontrollers (MCU/MPU/SOC) · LQFP-32(7x7)
STM32F303K6T6 from STMicroelectronics, in a LQFP-32(7x7). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model, then checked against ST open pin data); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VDD | power_in | Digital power supply for the device (VDD and VDDA range 2.0 to 3.6 V per the features list). |
| 2 | PF0 / OSC_IN | bidirectional | 5 V tolerant (FT) I/O with TIM1_CH3N alternate function; also serves as the OSC_IN input for the external oscillator. |
| 3 | PF1 / OSC_OUT | bidirectional | 5 V tolerant (FT) I/O; also serves as the OSC_OUT output for the external oscillator. |
| 4 | NRST | bidirectional | Bi-directional device reset input / internal reset output (active low) with embedded weak pull-up resistor. |
| 5 | VDDA/VREF+ | power_in | Analog power supply and positive reference voltage for the ADC, DAC, comparators and op-amp (VDDA 2.0 to 3.6 V per the features list). |
| 6 | PA0 | bidirectional | 3.3 V tolerant I/O directly connected to ADC (TTa); alternates TIM2_CH1/TIM2_ETR, TSC_G1_IO1, USART2_CTS, EVENTOUT; additional ADC1_IN1 (fast channel), RTC_TAMP2/WKUP1. |
| 7 | PA1 | bidirectional | 3.3 V tolerant I/O directly connected to ADC (TTa); alternates TIM2_CH2, TSC_G1_IO2, USART2_RTS_DE, TIM15_CH1N, EVENTOUT; additional ADC1_IN2 (fast channel), RTC_REFIN. |
| 8 | PA2 | bidirectional | 3.3 V tolerant I/O directly connected to ADC (TTa); alternates TIM2_CH3, TSC_G1_IO3, USART2_TX, COMP2_OUT, TIM15_CH1, EVENTOUT; additional ADC1_IN3 (fast channel), COMP2_INM. |
| 9 | PA3 | bidirectional | 3.3 V tolerant I/O directly connected to ADC (TTa); alternates TIM2_CH4, TSC_G1_IO4, USART2_RX, TIM15_CH2, EVENTOUT; additional ADC1_IN4 (fast channel). |
| 10 | PA4 | bidirectional | 3.3 V tolerant I/O directly connected to ADC (TTa) with reduced touch sensing sensitivity (sampling capacitor I/O recommended); alternates TIM3_CH2, TSC_G2_IO1, SPI1_NSS, USART2_CK, EVENTOUT; additional ADC2_IN1 (fast channel), DAC1_OUT1, COMP2_INM, COMP4_INM, COMP6_INM. |
| 11 | PA5 | bidirectional | 3.3 V tolerant I/O directly connected to ADC (TTa) with reduced touch sensing sensitivity; alternates TIM2_CH1/TIM2_ETR, TSC_G2_IO2, SPI1_SCK, EVENTOUT; additional ADC2_IN2 (fast channel), DAC1_OUT2, OPAMP2_VINM. |
| 12 | PA6 | bidirectional | 3.3 V tolerant I/O directly connected to ADC (TTa) with reduced touch sensing sensitivity; alternates TIM16_CH1, TIM3_CH1, TSC_G2_IO3, SPI1_MISO, TIM1_BKIN, EVENTOUT; additional ADC2_IN3 (fast channel), DAC2_OUT1, OPAMP2_VOUT. |
| 13 | PA7 | bidirectional | 3.3 V tolerant I/O directly connected to ADC (TTa); alternates TIM17_CH1, TIM3_CH2, TSC_G2_IO4, SPI1_MOSI, TIM1_CH1N, EVENTOUT; additional ADC2_IN4 (fast channel), COMP2_INP, OPAMP2_VINP. |
| 14 | PB0 | bidirectional | 3.3 V tolerant I/O directly connected to ADC (TTa); alternates TIM3_CH3, TSC_G3_IO2, TIM1_CH2N, EVENTOUT; additional ADC1_IN11, COMP4_INP, OPAMP2_VINP. |
| 15 | PB1 | bidirectional | 3.3 V tolerant I/O directly connected to ADC (TTa); alternates TIM3_CH4, TSC_G3_IO3, TIM1_CH3N, COMP4_OUT, EVENTOUT; additional ADC1_IN12. |
| 16 | VSS | power_in | Digital ground. |
| 17 | VDD | power_in | Digital power supply. |
| 18 | PA8 | bidirectional | 5 V tolerant (FT) I/O; alternates MCO, TIM1_CH1, USART1_CK, EVENTOUT. |
| 19 | PA9 | bidirectional | 5 V tolerant (FT) I/O; alternates TSC_G4_IO1, TIM1_CH2, USART1_TX, TIM15_BKIN, TIM2_CH3, EVENTOUT. |
| 20 | PA10 | bidirectional | 5 V tolerant (FT) I/O; alternates TIM17_BKIN, TSC_G4_IO2, TIM1_CH3, USART1_RX, COMP6_OUT, TIM2_CH4, EVENTOUT. |
| 21 | PA11 | bidirectional | 5 V tolerant (FT) I/O; alternates TIM1_CH1N, USART1_CTS, CAN_RX, TIM1_CH4, TIM1_BKIN2, EVENTOUT. |
| 22 | PA12 | bidirectional | 5 V tolerant (FT) I/O; alternates TIM16_CH1, TIM1_CH2N, USART1_RTS_DE, COMP2_OUT, CAN_TX, TIM1_ETR, EVENTOUT. |
| 23 | PA13 | bidirectional | 5 V tolerant (FT) I/O; default function JTMS/SWDAT, also TIM16_CH1N, TSC_G4_IO3, IR_OUT, USART3_CTS, EVENTOUT. |
| 24 | PA14 | bidirectional | 5 V tolerant I/O with FM+ capability (FTf); default function JTCK/SWCLK, also TSC_G4_IO4, I2C1_SDA, TIM1_BKIN, USART2_TX, EVENTOUT. |
| 25 | PA15 | bidirectional | 5 V tolerant I/O with FM+ capability (FTf); default function JTDI, also TIM2_CH1/TIM2_ETR, TSC_SYNC, I2C1_SCL, SPI1_NSS, USART2_RX, TIM1_BKIN, EVENTOUT. |
| 26 | PB3 | bidirectional | 5 V tolerant (FT) I/O; default function JTDO/TRACESWO, also TIM2_CH2, TSC_G5_IO1, SPI1_SCK, USART2_TX, TIM3_ETR, EVENTOUT. |
| 27 | PB4 | bidirectional | 5 V tolerant (FT) I/O; default function NJTRST, also TIM16_CH1, TIM3_CH1, TSC_G5_IO2, SPI1_MISO, USART2_RX, TIM17_BKIN, EVENTOUT. |
| 28 | PB5 | bidirectional | 5 V tolerant (FT) I/O; alternates TIM16_BKIN, TIM3_CH2, I2C1_SMBA, SPI1_MOSI, USART2_CK, TIM17_CH1, EVENTOUT. |
| 29 | PB6 | bidirectional | 5 V tolerant I/O with FM+ capability (FTf); alternates TIM16_CH1N, TSC_G5_IO3, I2C1_SCL, USART1_TX, EVENTOUT. |
| 30 | PB7 | bidirectional | 5 V tolerant I/O with FM+ capability (FTf); alternates TIM17_CH1N, TSC_G5_IO4, I2C1_SDA, USART1_RX, TIM3_CH4, EVENTOUT. |
| 31 | BOOT0 | input | Dedicated BOOT0 pin used to select the boot configuration. |
| 32 | VSS | power_in | Digital ground. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | STMicroelectronics |
| Package | LQFP-32(7x7) |
| Category | Embedded Processors & Controllers |
| Pins | 32 |
CAD (KiCad official)
- Symbol:
STM32F303K6T6 - Footprint:
Package_QFP:LQFP-32_7x7mm_P0.8mm - 3D model: LQFP-32(7x7) (KiCad packages3D, STEP)
- 3D model files:
stm32f303k6t6-etched.step/stm32f303k6t6-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);stm32f303k6t6.step/stm32f303k6t6.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: STMicroelectronics datasheet (124 pp, sha256
a2ef8412ae529745, retrieved 2026-10-08, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).