Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

DAC43204RTER

Texas Instruments · Digital To Analog Converters (DAC) · WQFN-16(3x3)

DAC43204RTER from Texas Instruments, in a WQFN-16(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 FB3 input Voltage feedback pin for channel 3; connect to OUT3 in voltage-output mode and leave unconnected in current-output mode to minimize leakage current.
2 OUT3 output Analog output voltage from DAC channel 3.
3 OUT2 output Analog output voltage from DAC channel 2.
4 FB2 input Voltage feedback pin for channel 2; connect to OUT2 in voltage-output mode and leave unconnected in current-output mode to minimize leakage current.
5 GPIO/SDO bidirectional General-purpose I/O configurable as LDAC, PD, PROTECT, RESET, SDO, and STATUS; for STATUS and SDO use an external pullup to the IO voltage, and if unused tie to VDD or AGND through a resistor.
6 SCL/SYNC bidirectional I2C serial interface clock or SPI chip select input; must be connected to the IO voltage through an external pullup resistor and can ramp up before VDD.
7 A0/SDI input Address configuration pin for I2C (connect to VDD, AGND, SDA, or SCL) or serial data input for SPI; need not be pulled up or down and can ramp up before VDD.
8 SDA/SCLK bidirectional Bidirectional I2C serial data bus or SPI clock input; must be pulled up to the IO voltage in I2C mode and can ramp up before VDD.
9 FB1 input Voltage feedback pin for channel 1; connect to OUT1 in voltage-output mode and leave unconnected in current-output mode to minimize leakage current.
10 OUT1 output Analog output voltage from DAC channel 1.
11 OUT0 output Analog output voltage from DAC channel 0.
12 FB0 input Voltage feedback pin for channel 0; connect to OUT0 in voltage-output mode and leave unconnected in current-output mode to minimize leakage current.
13 CAP power_out External bypass capacitor for the internal LDO; connect approximately 1.5 µF between CAP and AGND (CCAP 0.5 to 15 µF).
14 AGND power_in Ground reference point for all circuitry on the device.
15 VDD power_in Positive supply voltage, 1.7 V to 5.5 V recommended operating range, referenced to AGND.
16 VREF power_in External reference input; connect approximately 0.1 µF to AGND, use a pullup to VDD when unused, and must not ramp up before VDD.
17 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package WQFN-16(3x3)
Category Data Acquisition
Pins 17

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Integral nonlinearity (8-bit) INL -1 1 LSB 5
Differential nonlinearity DNL -1 1 LSB 5
Current output integral nonlinearity INL -1 1 LSB DAC codes between 0d and 255d 7
Current output differential nonlinearity DNL -1 1 LSB DAC codes between 0d and 255d 7
Offset error (VDD 1.7 V to 2.7 V) -0.75 0.3 0.75 %FSR 1.7 V ≤ VDD < 2.7 V, FBx pin shorted to OUTx, DAC code: 32d for 12-bit resolution, 8d for 10-bit resolution, 2d for 8-bit resolution 5
Offset error (VDD 2.7 V to 5.5 V) -0.5 0.25 0.5 %FSR 2.7 V ≤ VDD ≤ 5.5 V, FBx pin shorted to OUTx, DAC code: 32d for 12-bit resolution, 8d for 10-bit resolution, 2d for 8-bit resolution 5
Offset-error temperature coefficient -0.0003 0.0003 %FSR/°C FBx pin shorted to OUTx, DAC code: 32d for 12-bit resolution, 8d for 10-bit resolution, 2d for 8-bit resolution 5
Gain error -0.5 0.25 0.5 %FSR Between end-point codes: 32d to 4064d for 12-bit resolution, 8d to 1016d for 10-bit resolution, 2d to 254d for 8-bit resolution 5
Gain-error temperature coefficient -0.0008 0.0008 %FSR/°C Between end-point codes: 32d to 4064d for 12-bit resolution, 8d to 1016d for 10-bit resolution, 2d to 254d for 8-bit resolution 5
Full-scale error (VDD 1.7 V to 2.7 V) -1 1 %FSR 1.7 V ≤ VDD < 2.7 V, DAC at full-scale 5
Full-scale error (VDD 2.7 V to 5.5 V) -0.5 0.5 %FSR 2.7 V ≤ VDD ≤ 5.5 V, DAC at full-scale 5
Full-scale-error temperature coefficient -0.0008 0.0008 %FSR/°C DAC at full-scale 5
Zero-code error temperature coefficient -10 10 µV/°C Code 0d into DAC 5
Current output offset error -1 1 %FSR DAC at midscale 7
Current output gain error -1.3 1.3 %FSR DAC codes between 0d and 255d 7
DAC output impedance (VFB), internal reference gain 1.5x/2x or external reference gain 1x ZO 400 500 600 kΩ DAC output enabled, internal reference (gain = 1.5x or 2x) or external reference at VDD (gain = 1x), the VREF pin is not shorted to VDD 6
DAC output impedance (VFB), internal VREF gain 3x/4x ZO 325 400 485 kΩ DAC output enabled, internal VREF, gain = 3x or 4x 6
Internal reference initial accuracy 1.1979 1.212 1.224 V TA = 25°C 9
Recommended positive supply voltage VDD VDD 1.7 5.5 V Positive supply voltage to ground (AGND) 4
Recommended external reference voltage VREF VREF 1.7 V External reference to ground (AGND); maximum is VDD 4
Digital input high voltage VIH 1.62 V 1.7 V < VDD ≤ 5.5 V 4
Digital input low voltage VIL 0.4 V 4
External capacitor on CAP pin CCAP 0.5 15 µF 4
Ambient temperature TA -40 125 °C 4
Supply voltage VDD to AGND VDD -0.3 6 V 4
Digital inputs to AGND -0.3 V Maximum is VDD + 0.3 V 4
CAP to AGND -0.3 1.65 V 4
VFBX to AGND -0.3 V Maximum is VDD + 0.3 V 4
VOUTX to AGND -0.3 V Maximum is VDD + 0.3 V 4
VREF external reference to AGND VREF -0.3 V Maximum is VDD + 0.3 V 4
Current into any pin except the OUTx pins -10 10 mA 4
Junction temperature TJ -40 150 °C 4
Storage temperature Tstg -65 150 °C 4
Zero-code error, external reference 6 12 mV Code 0d into DAC, external reference, VDD = 5.5 V 5
Zero-code error, internal reference 6 15 mV Code 0d into DAC, internal VREF, gain = 4x, VDD = 5.5 V 5
Capacitive load, phase margin 30°, RL infinite CL 200 pF RL = infinite, phase margin = 30° 5
Capacitive load, phase margin 30° CL 1000 pF Phase margin = 30° 5
Output voltage range 0 V Reference tied to VDD; maximum is VDD 5
Output voltage settling time tsett 20 µs 1/4 to 3/4 scale and 3/4 to 1/4 scale settling to 10%FSR, VDD = 5.5 V 5
Initial reference temperature coefficient 50 ppm/°C Reference output temperature coefficient 9
VREF input impedance 192 kΩ/ch Impedances for the DAC channels are connected in parallel 9
Junction-to-ambient thermal resistance RθJA 49 °C/W RTE (WQFN) 16 pins 4
Junction-to-case (top) thermal resistance RθJC(top) 50 °C/W RTE (WQFN) 16 pins 4
Junction-to-board thermal resistance RθJB 24.1 °C/W RTE (WQFN) 16 pins 4
Junction-to-case (bottom) thermal resistance RθJC(bot) 8.7 °C/W RTE (WQFN) 16 pins 4
Junction-to-top characterization parameter ΨJT 1.1 °C/W RTE (WQFN) 16 pins 4
Junction-to-board characterization parameter ΨJB 24.1 °C/W RTE (WQFN) 16 pins 4
Supply current per channel, ±25 µA range, full scale IDD 42 50 µA/ch Normal operation, DACs at full scale, ±25-µA output range, digital pins static 7
Supply current per channel, ±50 µA range, full scale IDD 56 70 µA/ch Normal operation, DACs at full scale, ±50-µA output range, digital pins static 7
Supply current per channel, ±125 µA range, full scale IDD 98 120 µA/ch Normal operation, DACs at full scale, ±125-µA output range, digital pins static 7
Supply current per channel, ±250 µA range, full scale IDD 167 200 µA/ch Normal operation, DACs at full scale, ±250-µA output range, digital pins static 7
Supply current per channel, voltage output IDD 150 µA/ch Normal operation, DACs at full scale, digital pins static, external reference at VDD but the VREF pin is not shorted to VDD 6
Power-down current, sleep mode, external reference at 5.5 V IDD 28 µA DAC in sleep mode, internal reference powered down, external reference at 5.5 V 9
Power-down current, sleep mode, internal reference enabled IDD 10 µA DAC in sleep mode, internal reference enabled, additional current through internal reference 9
Power-down current, DAC channels enabled, internal reference per channel IDD 12.5 µA DAC channels enabled, internal reference enabled, additional current through internal reference per DAC channel in voltage-output mode 9
Pin capacitance 10 pF Per pin 9

CAD (KiCad official)

  • Symbol: DAC43204RTER
  • Footprint: Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
  • 3D model: WQFN-16(3x3) (KiCad packages3D, STEP)
  • 3D model files: dac43204rter-etched.step / dac43204rter-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); dac43204rter.step / dac43204rter.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (83 pp, sha256 79cbaf6418c48bb3, retrieved 2026-11-05, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF