component
SMBJP6KE300A-TP
Public Made by Adomby adom
MCC(Micro Commercial Components) TVS, SMB. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownSMBJP6KE300A-TP
MCC(Micro Commercial Components) · TVS · SMB
SMBJP6KE300A-TP from MCC(Micro Commercial Components), in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Cathode | passive | Cathode of the unidirectional TVS, marked by the color band/cathode mark and taken as the positive end; the part is stand-off rated for VWM 256V with 285-315V breakdown at 1mA. |
| 2 | Anode | passive | Anode of the unidirectional TVS (SMBJP6KE300A), the end opposite the cathode band, with a maximum forward voltage of 1.5V at 1A. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | MCC(Micro Commercial Components) |
| Package | SMB |
| Category | TVS/Fuse/Board Level Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Stand-Off Voltage | VWM | 256 | V | 2 | |||
| Breakdown Voltage | V(BR) | 285 | 315 | V | @ IT = 1 mA | 2 | |
| Test Current | IT | 1 | mA | Breakdown voltage test current | 2 | ||
| Maximum Clamping Voltage | VC | 414 | V | @ IPP | 2 | ||
| Peak Pulse Current | IPP | 1.5 | A | 10/1000μs waveform | 2 | ||
| Maximum Reverse Leakage | ID | 1 | μA | @ VWM | 2 | ||
| Maximum Instantaneous Forward Voltage (unidirectional only) | VF | 1.5 | V | at 1A | 1 | ||
| Peak Pulse Power Dissipation | PPP | 600 | W | Non-repetitive current pulse, 10/1000μs, TA=25°C | 1 | ||
| Operating Junction Temperature | TJ | -65 | 150 | °C | 1 | ||
| Storage Temperature | TSTG | -65 | 150 | °C | 1 | ||
| Maximum Soldering Temperature | 260 | °C | 10 seconds | 1 | |||
| Thermal Resistance Junction to Lead | RθJL | 20 | °C/W | Junction to Lead | 1 | ||
| Thermal Resistance Junction to Case | RθJC | 25 | °C/W | Junction to Case | 1 |
CAD (KiCad official)
- Symbol:
SMBJP6KE300A-TP - Footprint:
Diode_SMD:D_SMB - 3D model: SMB (KiCad packages3D, STEP)
- 3D model files:
smbjp6ke300a-tp-etched.step/smbjp6ke300a-tp-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);smbjp6ke300a-tp.step/smbjp6ke300a-tp.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: MCC(Micro Commercial Components) datasheet (5 pp, sha256
5588e94db609218f, retrieved 2026-10-23, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).