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Contents

README

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KNF7650A

KIA Semicon Tech · MOSFETs · TO-220F

KNF7650A from KIA Semicon Tech, in a TO-220F. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Gate input Gate terminal of the MOSFET; the gate-to-source voltage rating is ±30 V.
2 Drain passive Drain terminal of the MOSFET; the drain-to-source voltage rating VDSS is 500 V.
3 Source passive Source terminal of the MOSFET; the gate-to-source voltage rating VGSS is ±30 V.

Key specifications

Parameter Value
Manufacturer KIA Semicon Tech
Package TO-220F
Category Transistors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-source breakdown voltage BVDSS 500 V VGS=0V,ID=250μA 3
Drain-to-source leakage current IDSS 1 μA VDS=500V, VGS=0V 3
Drain-to-source leakage current at TC=125ºC IDSS 125 μA VDS=400V, VGS=0V, TC=125ºC 3
Gate-body leakage current (positive) IGSS 100 nA VGS=30V, VDS=0V 3
Gate-body leakage current (negative) IGSS -100 nA VGS=-30V, VDS=0V 3
Static drain-source on-resistance RDS(on) 170 210 mΩ VGS=10V, ID=14A 3
Gate threshold voltage VGS(th) 2 4 V VDS=VGS, ID=250μA 3
Drain-source diode forward voltage VSD 1.5 V VGS=0V, Is=18A 3
Continuous drain-source current (integral pn-diode) ISD 25 A Integral pn-diode in MOSFET 3
Pulsed drain-source current ISM 100 A 3
Drain-to-source voltage VDSS 500 V TC=25 ºC unless otherwise specified 2
Gate-to-source voltage VGSS -30 30 V TC=25 ºC unless otherwise specified 2
Continuous drain current ID 25 A TC=25 ºC 2
Continuous drain current ID 16 A TC=100 ºC 2
Pulsed drain current IDM 100 A VGS=10V 2
Single pulse avalanche energy EAS 1800 mJ 2
Peak diode recovery dv/dt dv/dt 5 V/ns 2
Power dissipation (TO-220F) PD 105 W TC=25 ºC 2
Derating factor above 25 ºC (TO-220F) 0.84 W/ºC above 25 ºC 2
Maximum temperature for soldering, leads TL 300 ºC Leads at 0.063in (1.6mm) from case for 10 seconds 2
Maximum temperature for soldering, package body TPAK 260 ºC Package body for 10 seconds 2
Operating and storage temperature range TJ&TSTG -55 150 ºC 2
Thermal resistance, junction-ambient (TO-220F) RθJA 100 ºC/W 2
Thermal resistance, junction-case (TO-220F) RθJC 1.19 ºC/W 2

CAD (KiCad official)

  • Symbol: KNF7650A
  • Footprint: Package_TO_SOT_THT:TO-220F-3_Vertical
  • 3D model: TO-220F (KiCad packages3D, STEP)

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: KIA Semicon Tech datasheet (8 pp, sha256 f42aba9f1b974cc0, retrieved 2026-10-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF