component
KND8606B
Public Made by Adomby adom
KIA Semicon Tech MOSFETs, TO-252. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownKND8606B
KIA Semicon Tech · MOSFETs · TO-252
KND8606B from KIA Semicon Tech, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Gate | input | Gate terminal of the N-channel MOSFET, with a gate-source voltage rating of ±20 V and threshold voltage of 1 V to 2.5 V. |
| 2 | Drain | passive | Drain terminal, rated for 60 V drain-source voltage and 35 A continuous drain current at TC=25°C. |
| 3 | Source | passive | Source terminal of the MOSFET, carrying up to 35 A continuous current at TC=25°C. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | KIA Semicon Tech |
| Package | TO-252 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDSS | 60 | V | TC=25℃ | 2 | ||
| Drain Current | ID | 35 | A | TC=25°C | 2 | ||
| Drain Current | ID | 22 | A | TC=100°C | 2 | ||
| Drain Current Pulsed | IDM | 80 | A | Note 1 | 2 | ||
| Gate-Source Voltage | VGSS | -20 | 20 | V | ±20 V | 2 | |
| Single Pulsed Avalanche Energy | EAS | 450 | mJ | Note 2 | 2 | ||
| Avalanche Current | IAR | 35 | A | Note 1 | 2 | ||
| Repetitive Avalanche Energy | EAR | 12 | mJ | Note 1 | 2 | ||
| Peak Diode Recovery dv/dt | dv/dt | 4.5 | V/ns | Note 3 | 2 | ||
| Power Dissipation | PD | 60 | W | TC=25°C | 2 | ||
| Power Dissipation Derating | PD | 0.8 | W/°C | Derate above 25°C | 2 | ||
| Operating and Storage Temperature Range | TJ, TSTG | -55 | 175 | °C | 2 | ||
| Maximum lead temperature for soldering | TL | 300 | °C | 1/8" from case for 5 seconds | 2 | ||
| Thermal Resistance, Junction-to-Case | RθJC | 2.5 | °C/W | 2 | |||
| Thermal Resistance, Junction-to-Ambient | RθJA | 62.5 | °C/W | 2 | |||
| Drain-Source Breakdown Voltage | BVDSS | 60 | V | VGS=0V,ID=250uA | 3 | ||
| Zero Gate Voltage Drain Current | IDSS | 1 | uA | VDS=60V,VGS=0V | 3 | ||
| Zero Gate Voltage Drain Current | IDSS | 10 | uA | VDS=48V,TC=150℃ | 3 | ||
| Gate-Body Leakage Current, Forward | IGSSF | 100 | nA | VGS=20V,VDS=0V | 3 | ||
| Gate-Body Leakage Current, Reverse | IGSSR | -100 | nA | VGS=-20V,VDS=0V | 3 | ||
| Gate Threshold Voltage | VGS(th) | 1 | 1.8 | 2.5 | V | VDS=VGS,ID=250uA | 3 |
| Static Drain-Source On-Resistance | RDS(on) | 15 | 20 | mΩ | VGS=10V,ID=20A | 3 | |
| Maximum Continuous Drain-Source Diode Forward Current | IS | 35 | A | 3 | |||
| Maximum Pulsed Drain-Source Diode Forward Current | ISM | 80 | A | 3 | |||
| Drain-Source Diode Forward Voltage | VSD | 1.4 | V | VGS=0V, IS=35A | 3 | ||
| Breakdown Voltage Temperature Coefficient | △BVDSS/△TJ | 0.06 | V/℃ | ID=250uA, Referenced to 25°C | 3 | ||
| Forward Transconductance | gFS | 22 | S | VDS=25V,ID=25A (Note 4) | 3 | ||
| Input Capacitance | Ciss | 2800 | pF | VDS=25V,VGS=0V, f=1.0MHz | 3 | ||
| Output Capacitance | Coss | 200 | pF | VDS=25V,VGS=0V, f=1.0MHz | 3 | ||
| Reverse Transfer Capacitance | Crss | 100 | pF | VDS=25V,VGS=0V, f=1.0MHz | 3 | ||
| Turn-On Delay Time | td(on) | 15 | ns | VDD=30V,ID=25A, RG=25Ω (Note 4,5) | 3 | ||
| Turn-On Rise Time | tr | 105 | ns | VDD=30V,ID=25A, RG=25Ω (Note 4,5) | 3 | ||
| Turn-Off Delay Time | td(off) | 60 | ns | VDD=30V,ID=25A, RG=25Ω (Note 4,5) | 3 | ||
| Turn-Off Fall Time | tf | 65 | ns | VDD=30V,ID=25A, RG=25Ω (Note 4,5) | 3 | ||
| Total Gate Charge | Qg | 33 | nC | VDS=48V,ID=25A, VGS=10V (Note 4,5) | 3 | ||
| Gate-Source Charge | Qgs | 8.5 | nC | VDS=48V,ID=25A, VGS=10V (Note 4,5) | 3 | ||
| Gate-Drain Charge | Qgd | 14 | nC | VDS=48V,ID=25A, VGS=10V (Note 4,5) | 3 | ||
| Reverse Recovery Time | trr | 60 | ns | VGS=0V,IS=35A, dIF/dt=100A/us (Note 4) | 3 | ||
| Reverse Recovery Charge | Qrr | 80 | nC | VGS=0V,IS=35A, dIF/dt=100A/us (Note 4) | 3 |
CAD (KiCad official)
- Symbol:
KND8606B - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files:
knd8606b-etched.step/knd8606b-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);knd8606b.step/knd8606b.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: KIA Semicon Tech datasheet (7 pp, sha256
cf43a4d3e6c07af5, retrieved 2026-10-30, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).