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MAX3072EESA+
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Analog Devices Inc Maxim Integrated RS-485 / RS-422 ICs, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownMAX3072EESA+
Analog Devices Inc Maxim Integrated · RS-485 / RS-422 ICs · SOIC-8
MAX3072EESA+ from Analog Devices Inc Maxim Integrated, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | RO | output | Receiver output: with RE low, RO is high when (A - B) is at or above -50mV and low when (A - B) is at or below -200mV. |
| 2 | RE | input | Receiver output enable: drive RE low to enable RO, which is high impedance when RE is high; RE is a hot-swap input. |
| 3 | DE | input | Driver output enable: drive DE high to enable the driver outputs, which are high impedance when DE is low; DE is a hot-swap input. |
| 4 | DI | input | Driver input: with DE high, a low on DI forces the noninverting output low and the inverting output high, and a high on DI forces the reverse. |
| 5 | GND | power_in | Ground. |
| 6 | A | bidirectional | Noninverting receiver input and noninverting driver output; in half-duplex mode the driver outputs serve as receiver inputs. |
| 7 | B | bidirectional | Inverting receiver input and inverting driver output; in half-duplex mode the driver outputs serve as receiver inputs. |
| 8 | VCC | power_in | Positive supply, VCC = 3.3V ±10%; bypass VCC to GND with a 0.1µF capacitor. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Analog Devices Inc Maxim Integrated |
| Package | SOIC-8 |
| Category | Interface |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage | VCC | 6 | V | 2 | |||
| Control Input Voltage (RE, DE, SLR, H/F, TXP, RXP) | -0.3 | 6 | V | 2 | |||
| Driver Input Voltage (DI) | -0.3 | 6 | V | 2 | |||
| Driver Output Voltage (Z, Y, A, B) | -8 | 13 | V | 2 | |||
| Receiver Input Voltage (A, B) | -8 | 13 | V | 2 | |||
| Receiver Output Voltage (RO) | -0.3 | V | 2 | ||||
| Driver Output Current | -250 | 250 | mA | 2 | |||
| Junction Temperature | 150 | °C | 2 | ||||
| Storage Temperature Range | -65 | 150 | °C | 2 | |||
| Lead Temperature (soldering, 10s) | 300 | °C | 10s | 2 | |||
| Operating Temperature Range, MAX307_EE__ | -40 | 85 | °C | 2 | |||
| Differential Driver Output | VOD | 2 | V | RL = 100Ω (RS422), Figure 1 | 2 | ||
| Differential Driver Output | VOD | 1.5 | V | RL = 54Ω (RS485), Figure 1 | 2 | ||
| Change in Magnitude of Differential Output Voltage | ΔVOD | 0.2 | V | RL = 100Ω or 54Ω, Figure 1 (Note 2) | 2 | ||
| Driver Common-Mode Output Voltage | VOC | 3 | V | RL = 100Ω or 54Ω, Figure 1 | 2 | ||
| Change in Magnitude of Common-Mode Voltage | ΔVOC | 0.2 | V | RL = 100Ω or 54Ω, Figure 1 (Note 2) | 2 | ||
| Input High Voltage | VIH | 2 | V | DE, DI, RE, TXP, RXP, H/F | 2 | ||
| Input Low Voltage | VIL | 0.8 | V | DE, DI, RE, TXP, RXP, H/F | 2 | ||
| Input Current | IIN1 | -1 | 1 | µA | DE, DI, RE | 2 | |
| Input Impedance First Transition | 1 | 10 | kΩ | 2 | |||
| Driver Short-Circuit Output Current | IOSD | 40 | 250 | mA | 0 ≤ VOUT ≤ 12V (Note 3) | 3 | |
| Driver Short-Circuit Output Current | IOSD | -250 | -40 | mA | -7V ≤ VOUT ≤ VCC (Note 3) | 3 | |
| Input Current (A and B) | IA, B | 125 | µA | DE = GND, VCC = GND or 3.6V, VIN = +12V | 3 | ||
| Input Current (A and B) | IA, B | -100 | µA | DE = GND, VCC = GND or 3.6V, VIN = -7V | 3 | ||
| Receiver Differential Threshold Voltage | VTH | -200 | -125 | -50 | mV | -7V ≤ VCM ≤ 12V | 3 |
| RO Output Low Voltage | VOL | 0.4 | V | IO = 1mA | 3 | ||
| Three-State Output Current at Receiver | IOZR | -1 | 1 | µA | 0 ≤ VO ≤ VCC | 3 | |
| Receiver Output Short-Circuit Current | IOSR | -80 | 80 | mA | 0V ≤ VRO ≤ VCC | 3 | |
| Supply Current | ICC | 0.8 | 1.5 | mA | No load, RE = 0, DE = VCC | 3 | |
| Supply Current in Shutdown Mode | ISHDN | 0.05 | 10 | µA | RE = VCC, DE = GND | 3 | |
| ESD Protection for Y, Z, A, and B | -15 | 15 | kV | Human Body Model | 3 | ||
| Driver Propagation Delay | tDPLH | 250 | 1500 | ns | CL= 50pF, RL= 54Ω, Figures 2 and 3 | 4 | |
| Driver Differential Output Rise or Fall Time | tDR, tDF | 350 | 1600 | ns | CL= 50pF, RL= 54Ω, Figures 2 and 3 | 4 | |
| Time to Shutdown (driver) | tSHDN | 50 | 200 | 600 | ns | 4 | |
| Time to Shutdown (receiver) | tSHDN | 50 | 200 | 600 | ns | 4 |
CAD (KiCad official)
- Symbol:
MAX3072EESA+ - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
max3072eesa-etched.step/max3072eesa-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);max3072eesa.step/max3072eesa.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Analog Devices Inc Maxim Integrated datasheet (23 pp, sha256
864232a540aeec53, retrieved 2026-10-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).