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Contents

README

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BAW56-HF

Comchip · Switching Diodes · SOT-23

BAW56-HF from Comchip, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K1 passive Cathode of diode 1 in the BAW56-HF dual common-anode switching diode (VR 70 V, IO 200 mA per the maximum ratings).
2 K2 passive Cathode of diode 2 in the BAW56-HF dual common-anode switching diode (VR 70 V, IO 200 mA per the maximum ratings).
3 A passive Common anode of both diodes in the BAW56-HF (VR 70 V, IFSM 2 A at tp=1 ms).

Key specifications

Parameter Value
Manufacturer Comchip
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse voltage VR 70 V 1
Power dissipation PD 225 mW 1
Average rectified current Io 200 mA 1
Non-repetitive peak forward current (as printed, symbol IFM) IFM 400 mA 1
Peak forward surge current IFSM 2 A tp=1ms, TA=25°C 1
Operating junction temperature Tj 150 °C 1
Storage temperature range TSTG -65 150 °C 1
Typical thermal resistance, junction to ambient RθJA 500 °C/W Valid provided that electrodes are kept at ambient temperature 1
Reverse voltage VRB 70 V IB = 100µA 2
Reverse leakage current IR 2.5 µA VR = 70V 2
Capacitance between terminals CT 1.5 pF VR = 0V, f = 1 MHz 2
Reverse recovery time TRR 6 nS IF = IR = 10mA, RL = 100Ω, Irr = 0.1 x IR 2
Forward voltage VF 0.715 V IF = 1mA 2
Forward voltage VF 0.855 V IF = 10mA 2
Forward voltage VF 1 V IF = 50mA 2
Forward voltage VF 1.25 V IF = 150mA 2

CAD (KiCad official)

  • Symbol: BAW56-HF
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: baw56-hf-etched.step / baw56-hf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); baw56-hf.step / baw56-hf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Comchip datasheet (4 pp, sha256 6db4c6f46e08c356, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF