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Contents

README

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MCP1700T-2502E

MSKSEMI · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-23

MCP1700T-2502E from MSKSEMI, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground pin; the input and output capacitor ground connections must return to this pin using short, wide traces.
2 VOUT power_out Regulated output; an output capacitor of 1uF to 22uF with ESR above 1mΩ should be placed close to the VOUT and GND pins.
3 VIN power_in Power input with a recommended operating range of 1.2V to 5.5V; an input capacitor of 1uF or greater should be placed close to the VIN and GND pins.

Key specifications

Parameter Value
Manufacturer MSKSEMI
Package SOT-23
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input voltage VIN 1.2 5.5 V 7
Input voltage (recommended operating) VIN 1.2 5.5 V 6
Output voltage accuracy -2 2 % ILOAD = 0.1mA 7
Output current limit ILIM 301 600 mA VOUT = 0V 7
Absolute max VIN to GND VIN -0.3 7 V VIN to GND 6
Absolute max VOUT, EN to GND VOUT, EN -0.3 6 V VOUT, EN to GND 6
Absolute max VOUT to VIN VOUT-VIN -6 0.3 V VOUT to VIN 6
Junction temperature (absolute max) TJ 150 °C 6
Storage temperature range TSTG -60 150 °C 6
Lead soldering temperature 260 °C Soldering, 10 sec. 6
ESD HBM 2 KV Human body model 6
ESD MM 200 V Machine model 6
ESD CDM 2 KV Charged device model 6
Application junction temperature range TJ -40 125 °C 6
Application ambient temperature range TA -40 85 °C 6
Load regulation ΔLOAD 0.2 % 10mA ≤ ILOAD ≤ 0.3A 7
Line regulation ΔLINE 0.2 % ILOAD = 30mA, 1.5V ≤ VIN ≤ 5.5V or (VOUT + 0.2V) ≤ VIN ≤ 5.5V 7
Quiescent current IQ 2 μA ILOAD = 0mA 7
Dropout voltage (VOUT = 2.5V) VDROP_2.5V 0.23 V ILOAD = 300mA; VOUT = 2.5V 7
Thermal shutdown temperature TSD 155 °C ILOAD = 10mA 7
Thermal shutdown hysteresis ΔTSD 15 °C 7
Thermal resistance, junction to ambient θJA 250 °C/W TA = 25°C, EVB board (Note 2) 6

CAD (KiCad official)

  • Symbol: MCP1700T-2502E
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: mcp1700t-2502e-etched.step / mcp1700t-2502e-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mcp1700t-2502e.step / mcp1700t-2502e.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MSKSEMI datasheet (13 pp, sha256 5eab501db03ec28d, retrieved 2026-10-18, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF