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Contents

README

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MCP14700-E

Microchip Tech · Pre-ordered Chips · SOIC-8

MCP14700-E from Microchip Tech, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 PHASE passive Switch node that returns the high-side gate driver current and connects the high-side MOSFET source to the low-side MOSFET drain; VPHASE is limited to VBOOT - 7V to VBOOT + 0.3V.
2 PWMHI input High-side PWM control input where a logic high drives HIGHDR high; the rising threshold is 1.40V to 1.80V and the falling threshold is 1.10V to 1.30V at VCC = 5.0V, and the pin is internally pulled low.
3 PWMLO input Low-side PWM control input where a logic high drives LOWDR high; the rising threshold is 1.40V to 1.80V and the falling threshold is 1.10V to 1.30V at VCC = 5.0V, and the pin is internally pulled low.
4 GND power_in Ground for the MCP14700 circuitry, which should have a low-impedance connection to the bias supply return because high peak currents flow out of this pin when the low-side MOSFET turns off.
5 LOWDR output Low-side gate drive output that controls the low-side MOSFET, with VLOWDR limited to -0.3V to VCC + 0.3V and 2.0A typical source and 3.5A typical sink peak current.
6 VCC power_in Supply input with an operating range of 4.5V to 5.5V (5.0V typical) and an absolute maximum of +7.0V, requiring a bypass capacitor placed as close as possible to this pin and GND.
7 BOOT power_in Floating bootstrap supply for the high-side driver, rated to a maximum of +36.0V, with a bootstrap capacitor connected between this pin and PHASE.
8 HIGHDR output High-side gate drive output that controls the high-side MOSFET, with VHIGHDR limited to VPHASE - 0.3V to VBOOT + 0.3V and 2.0A typical source and 2.0A typical sink peak current.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package SOIC-8
Category Interface ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VCC VCC -0.3 7 V 5
Boot voltage VBOOT VBOOT -0.3 36 V 5
PWM input voltage VPWM VPWM -0.3 V Maximum printed as VCC + 0.3V 5
LOWDR output voltage VLOWDR VLOWDR -0.3 V Maximum printed as VCC + 0.3V 5
VCC Operating Range VCC 4.5 5 5.5 V 5
Specified Temperature Range TA -40 125 °C 6
Maximum Junction Temperature TJ 150 °C 6
Storage Temperature TA -65 150 °C 6
UVLO (Rising VCC) VUVLO 3.5 4 V 5
PWM Input Current IPWM 7 10 µA VPWM = 3.0V 5
PWMHI Rising Threshold PWMHI_TH 1.4 1.6 1.8 V VCC = 5.0V 5
PWMLO Falling Threshold PWMLO_TH 1.1 1.2 1.3 V VCC = 5.0V 5
Low Output Voltage (HIGHDR and LOWDR) VOL 0.025 V VCC = 5.0V 5
High Drive Source Resistance RHI_SRC 1 2.5 Ω 500 mA source current, Note 1 5
High Drive Sink Resistance RHI_SINK 1 2.5 Ω 500 mA sink current, Note 1 5
High Drive Source Current IHI_SRC 2 A Note 1 5
High Drive Sink Current IHI_SINK 2 A Note 1 5
Low Drive Source Resistance RLO_SRC 1 2.5 Ω 500 mA source current, Note 1 5
Low Drive Sink Resistance RLO_SINK 0.5 1 Ω 500 mA sink current, Note 1 5
Low Drive Source Current ILO_SRC 2 A Note 1 5
Low Drive Sink Current ILO_SINK 3.5 A Note 1 5
HIGHDR Turn-off Propagation Delay tPDLH 20 27 36 ns No Load, Note 1, Note 2 6
LOWDR Turn-off Propagation Delay tPDLL 10 17 25 ns No Load, Note 1, Note 2 6
HIGHDR Turn-on Propagation Delay tPDHH 20 27 36 ns No Load, Note 1, Note 2 6
LOWDR Turn-on Propagation Delay tPDHL 10 17 25 ns No Load, Note 1, Note 2 6
Thermal Resistance, 8L-SOIC junction-to-ambient JA 163 °C/W 6
Thermal Resistance, 8L-SOIC junction-to-case JC 42 °C/W 6

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin Package: MF = Plastic Dual Flat, No Lead (3x3 DFN), 8-lead SN = Plastic Small Outline, (3.90 mm), 8-lead 25

CAD (KiCad official)

  • Symbol: MCP14700-E
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: mcp14700-e-etched.step / mcp14700-e-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mcp14700-e.step / mcp14700-e.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (28 pp, sha256 084e557d6c8178d6, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF