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Contents

README

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SN74AUC1G126DCKR

Texas Instruments · Buffers / Drivers · SC-70-5

SN74AUC1G126DCKR from Texas Instruments, in a SC-70-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OE input Output enable; the output is disabled when OE is low, and OE should be tied to GND through a pulldown resistor to ensure high-impedance during power up or power down.
2 A input Logic input; the device is 3.6-V I/O tolerant and is designed specifically for 1.65-V to 1.95-V VCC operation, with operation from 0.8-V to 2.7-V VCC.
3 GND power_in Ground reference for the device; OE should be tied to GND through a pulldown resistor when the high-impedance state is required at power up or power down.
4 Y output Single line driver output with a tri-state buffer that is disabled (high-impedance) when OE is low, with ±20-mA continuous output current.
5 VCC power_in Positive supply; the device is operational at 0.8 V to 2.7 V VCC and is designed specifically for 1.65 V to 1.95 V VCC operation.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SC-70-5
Category Logic ICs
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VCC -0.5 3.6 V 4
Input voltage VI -0.5 3.6 V 4
Voltage applied to any output in high-impedance or power-off state VO -0.5 3.6 V 4
Input clamp current IIK -50 mA VI < 0 4
Output clamp current IOK -50 mA VO < 0 4
Continuous output current IO -20 20 mA 4
Continuous current through VCC or GND -100 100 mA 4
Junction temperature TJ 150 °C 4
Storage temperature Tstg -65 150 °C 4
Supply voltage VCC 0.8 2.7 V 5
Input voltage VI 0 3.6 V 5
Output voltage VO 0 V max = VCC 5
High-level input voltage VIH 1.7 V VCC = 2.3 V to 2.7 V 5
Low-level input voltage VIL 0.7 V VCC = 2.3 V to 2.7 V 5
High-level output current IOH -8 mA VCC = 1.65 V 5
Low-level output current IOL 8 mA VCC = 1.65 V 5
Input transition rise or fall rate Δt/Δv 10 ns/V VCC = 1.65 V to 1.95 V 5
Operating free-air temperature TA -40 85 °C 5
Junction-to-ambient thermal resistance RθJA 252 °C/W DCK (SC70), 5 pins 5
High-level output voltage VOH 0.55 V IOH = -0.7 mA, VCC = 0.8 V 6
High-level output voltage VOH 1.2 V IOH = -8 mA, VCC = 1.65 V 6
Low-level output voltage VOL 0.45 V IOL = 8 mA, VCC = 1.65 V 6
Input current II -5 5 µA A or OE input: VI = VCC or GND, VCC = 0 to 2.7 V 6
Off-state current Ioff -10 10 µA VI or VO = 2.7 V, VCC = 0 6
High-impedance-state output current IOZ -10 10 µA VO = VCC or GND, VCC = 2.7 V 6
Supply current ICC 10 µA VI = VCC or GND, VCC = 0.8 V to 2.7 V, IO = 0 6
Input capacitance Ci 2.5 pF VI = VCC or GND, VCC = 2.5 V 6
Output capacitance Co 5.5 pF VO = VCC or GND, VCC = 2.5 V 6
Propagation delay time A-to-Y tpd 0.6 1 1.6 ns VCC = 1.8 V ± 0.15 V, CL = 15 pF 7
Enable time OE-to-Y ten 0.3 0.9 1.9 ns VCC = 1.8 V ± 0.15 V, CL = 15 pF 7
Disable time OE-to-Y tdis 1.6 2.4 3.5 ns VCC = 1.8 V ± 0.15 V, CL = 15 pF 7
Propagation delay time A-to-Y tpd 1 1.5 2.5 ns VCC = 1.8 V ± 0.15 V, CL = 30 pF 7
Enable time OE-to-Y ten 1.1 1.6 2.5 ns VCC = 1.8 V ± 0.15 V, CL = 30 pF 7
Disable time OE-to-Y tdis 1.3 2.6 3.1 ns VCC = 1.8 V ± 0.15 V, CL = 30 pF 7
Power dissipation capacitance, inputs disabled Cpd 15 pF TA = 25°C, f = 10 MHz, VCC = 1.8 V 7

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing Abs • Updated body size of YZP package. ..................................................................................................................................... 1 • Added junction temperature 2

CAD (KiCad official)

  • Symbol: SN74AUC1G126DCKR
  • Footprint: Package_TO_SOT_SMD:SOT-353_SC-70-5
  • 3D model: SC-70-5 (KiCad packages3D, STEP)
  • 3D model files: sn74auc1g126dckr-etched.step / sn74auc1g126dckr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sn74auc1g126dckr.step / sn74auc1g126dckr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (31 pp, sha256 fd5cb7424b0d6c55, retrieved 2026-10-23, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF