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HG24C04M

HGSEMI · EEPROM · SOP-8

HG24C04M from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A0 input Device address input A0. Not used on the HG24C04 (only A2 and A1 participate in device addressing); this pin is a no-connect and may be tied to GND.
2 A1 input Device address input A1. Hard-wired to VCC or GND to set one of the device-select bits so that up to four HG24C04 devices can share a single two-wire bus. VIL <= 0.3VCC, VIH >= 0.7VCC.
3 A2 input Device address input A2. Hard-wired to VCC or GND to set one of the device-select bits so that up to four HG24C04 devices can share a single two-wire bus. VIL <= 0.3VCC, VIH >= 0.7VCC.
4 GND power_in Ground reference (0 V) for the device.
5 SDA bidirectional Serial data line for the two-wire interface. Open-drain output, so an external pull-up (typ. 1.3 kOhm at 2.5-5 V, 10 kOhm at 1.8 V) to VCC is required. Bidirectional; may be wire-ORed with other open-drain devices. Input capacitance <= 8 pF.
6 SCL input Serial clock input for the two-wire interface. Positive edge clocks data in, negative edge clocks data out. Supports up to 1 MHz at 5 V and 400 kHz at 1.8/2.5/2.7 V. Input capacitance <= 6 pF.
7 WP input Write Protect. Tie to GND for normal read/write operation; tie to VCC to hardware-protect the full 4 K array against writes.
8 VCC power_in Positive supply input, 1.7 V to 5.5 V (absolute max 6.5 V). Typical ICC = 0.4 mA read / 2.0 mA write at 5.0 V, 100 kHz; standby current <= 2 uA.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOP-8
Category Memory
Pins 8

Ordering variants

  • HG24C04MM
  • HG24C04MM/TR
  • HG24C04MN
  • HG24C04MMM
  • HG24C04MMM/TR
  • HG24C04MDQ
  • HG24C04MDQ/TR
  • HG24C04MDQ3
  • HG24C04MDQ3/TR
  • HG24C04MM5
  • HG24C04MM5/TR
  • HG24C04MM8
  • HG24C04MM8/TR

CAD (KiCad official)

  • Symbol: HG24C04M
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (None pp, sha256 8988082590f5f691, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

Symbol & Footprint

Schematic Symbol

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PCB Footprint

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