MAX3078EASA+T from Maxim Integrated, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	RO	output	Receiver output: when RE is low, RO is high if (A - B) ≥ -50mV and low if (A - B) ≤ -200mV; high impedance when RE is high.
2	RE	input	Receiver output enable, active low (drive low to enable RO, high for high-impedance RO); RE high with DE low enters low-power shutdown, and RE is a hot-swap input.
3	DE	input	Driver output enable: drive high to enable driver outputs, low for high impedance; DE low with RE high enters low-power shutdown, and DE is a hot-swap input.
4	DI	input	Driver input: with DE high, a low on DI forces the noninverting output low and inverting output high, and a high on DI does the opposite.
5	GND	power_in	Ground.
6	A	bidirectional	Noninverting receiver input and noninverting driver output.
7	B	bidirectional	Inverting receiver input and inverting driver output.
8	VCC	power_in	Positive supply, VCC = 3.3V ±10%, bypass to GND with a 0.1µF capacitor.

Key specifications

Parameter	Value
Manufacturer	Maxim Integrated
Package	SOIC-8
Category	Interface ICs
Pins	8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Differential Driver Output	VOD	1.5			V	RL = 54Ω (RS485), Figure 1	2
Change in Magnitude of Differential Output Voltage	ΔVOD			0.2	V	RL = 100Ω or 54Ω, Figure 1 (Note 2)	2
Driver Common-Mode Output Voltage	VOC			3	V	RL = 100Ω or 54Ω, Figure 1	2
Change in Magnitude of Common-Mode Voltage	ΔVOC			0.2	V	RL = 100Ω or 54Ω, Figure 1 (Note 2)	2
Input High Voltage	VIH	2			V	DE, DI, RE, TXP, RXP, H/F	2
Input Low Voltage	VIL			0.8	V	DE, DI, RE, TXP, RXP, H/F	2
Input Hysteresis	VHYS		100		mV	DE, DI, RE, TXP, RXP, H/F	2
Input Current	IIN1	-1		1	µA	DE, DI, RE	2
Driver Short-Circuit Output Current	IOSD	40		250	mA	0 ≤ VOUT ≤ 12V (Note 3)	3
Driver Short-Circuit Output Current	IOSD	-250		-40	mA	-7V ≤ VOUT ≤ VCC (Note 3)	3
Input Current (A and B)	IA, B			125	µA	DE = GND, VCC = GND or 3.6V, VIN = +12V	3
Input Current (A and B)	IA, B	-100			µA	DE = GND, VCC = GND or 3.6V, VIN = -7V	3
Receiver Differential Threshold Voltage	VTH	-200	-125	-50	mV	-7V ≤ VCM ≤ 12V	3
RO Output Low Voltage	VOL			0.4	V	IO = 1mA	3
Three-State Output Current at Receiver	IOZR	-1		1	µA	0 ≤ VO ≤ VCC	3
Receiver Input Resistance	RIN	96			kΩ	-7V ≤ VCM ≤ 12V	3
Receiver Output Short-Circuit Current	IOSR	-80		80	mA	0V ≤ VRO ≤ VCC	3
Supply Current	ICC		0.8	1.5	mA	No load, RE = 0, DE = VCC	3
Supply Current in Shutdown Mode	ISHDN		0.05	10	µA	RE = VCC, DE = GND	3
Driver Propagation Delay	tDPLH			50	ns	CL = 50pF, RL= 54Ω, Figures 2 and 3	6
Driver Differential Output Rise or Fall Time	tDR, tDF			15	ns	CL = 50pF, RL= 54Ω, Figures 2 and 3	6
Differential Driver Output Skew	tDSKEW			8	ns	CL = 50pF, RL= 54Ω, Figures 2 and 3	6
Driver Maximum Data Rate		16			Mbps		6
Driver Enable to Output High	tDZH			150	ns	Figure 4	6
Driver Enable to Output Low	tDZL			150	ns	Figure 5	6
Driver Disable Time from Low	tDLZ			100	ns	Figure 5	6
Driver Disable Time from High	tDHZ			100	ns	Figure 4	6
Driver Enable from Shutdown to Output High	tDZH(SHDN)		1250	1800	ns	Figure 4	6
Driver Enable from Shutdown to Output Low	tDZL(SHDN)		1250	1800	ns	Figure 5	6
Time to Shutdown (driver)	tSHDN	50	200	600	ns		6
Receiver Propagation Delay	tRPLH		40	75	ns	CL = 15pF, Figures 6 and 7	6
Receiver Output Skew	tRSKEW			8	ns	CL = 15pF, Figures 6 and 7	6
Receiver Maximum Data Rate		16			Mbps		6
Receiver Enable to Output Low	tRZL			50	ns	Figure 8	6
Receiver Enable to Output High	tRZH			50	ns	Figure 8	6
Receiver Disable Time from Low	tRLZ			50	ns	Figure 8	6
Receiver Disable Time from High	tRHZ			50	ns	Figure 8	6
Receiver Enable from Shutdown to Output High	tRZH(SHDN)			1800	ns	Figure 8	6
Receiver Enable from Shutdown to Output Low	tRZL(SHDN)			1800	ns	Figure 8	6
Supply Voltage	VCC			6	V	All voltages referenced to GND	2
Control Input Voltage		-0.3		6	V	RE, DE, SLR, H/F, TXP, RXP	2
Driver Input Voltage	DI	-0.3		6	V		2
Driver Output Voltage		-8		13	V	Z, Y, A, B	2
Receiver Input Voltage		-8		13	V	A, B	2
Receiver Output Voltage	RO	-0.3		3.6	V	-0.3V to (VCC + 0.3V), with VCC = 3.3V	2
Driver Output Current		-250		250	mA		2
Operating Temperature Range		-40		125	°C	MAX307_EA_ _	2
Junction Temperature				150	°C		2
Storage Temperature Range		-65		150	°C		2
Lead Temperature				300	°C	soldering, 10s	2
Thermal-Shutdown Threshold	TTS		175		°C		3
Thermal-Shutdown Hysteresis	TTSH		15		°C		3
Receiver Input Hysteresis	ΔVTH		15		mV	VA + VB = 0V	3
ESD Protection for Y, Z, A, and B			15		kV	Human Body Model	3

CAD (KiCad official)

Symbol: MAX3078EASA+T
Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
3D model: SOIC-8 (KiCad packages3D, STEP)
3D model files: max3078easa-t-etched.step / max3078easa-t-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); max3078easa-t.step / max3078easa-t.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Maxim Integrated datasheet (23 pp, sha256 ed41de6b57c8e76f, retrieved 2026-10-31, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

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MAX3078EASA+T

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3D Model

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