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Contents

README

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FH3117

XIN FEI HONG · MOSFETs · SOT-23-3L

FH3117 from XIN FEI HONG, in a SOT-23-3L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; logic-level compatible, gate-source voltage limited to ±20 V with threshold of -1.1 V min to -1.9 V max at ID = -250µA.
2 S passive Source of the P-channel MOSFET; body diode forward current IS is -3.2 A and drain-source voltage is rated -30 V.
3 D passive Drain of the P-channel MOSFET; VDS = -30 V, continuous ID = -6.2 A and pulsed IDM = -24.8 A.

Key specifications

Parameter Value
Manufacturer XIN FEI HONG
Package SOT-23-3L
Category Triode/MOS Tube/Transistor
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS -30 V VGS = 0V, ID = -250µA 2
Gate Threshold Voltage VGS(th) -1.1 -1.9 V VDS = VGS, ID = -250µA 2
Gate-Body Leakage Current IGSS -100 100 nA VDS = 0V, VGS = ±20V 2
Zero Gate Voltage Drain Current IDSS -1 µA VDS = -30V, VGS = 0V 2
Drain-Source On-Resistance RDS(on) 19 22.5 mΩ VGS = -10V, ID = -4.0A 2
Drain-Source On-Resistance RDS(on) 23 29 mΩ VGS = -4.5V, ID = -4.0A 2
Diode Forward Voltage VSD -1.2 V VGS = 0V, IS = -1.0A (Pulse Test: Pulse Width ≤ 300µs, Duty Cycle ≤ 2%) 2
Diode Forward Current IS -3.2 A Note 1: mounted on FR4 board, t ≤ 5sec 2
Drain-Source Voltage VDS -30 V TA = 25°C, unless otherwise specified 1
Gate-Source Voltage VGS -20 20 V TA = 25°C, unless otherwise specified 1
Continuous Drain Current ID -6.2 A TJ = 150°C 1
Pulsed Drain Current IDM -24.8 A 1
Power Dissipation PD 1.25 W TA = 25°C, unless otherwise specified 1
Operating Junction and Storage Temperature Range TJ, TSTG -55 150 °C 1
Thermal Resistance-Junction to Ambient RthJA 100 °C/W Note 1: mounted on FR4 board, t ≤ 5sec 1

CAD (KiCad official)

  • Symbol: FH3117
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3L (KiCad packages3D, STEP)
  • 3D model files: fh3117-etched.step / fh3117-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); fh3117.step / fh3117.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: XIN FEI HONG datasheet (4 pp, sha256 fdfb333d4c663aa9, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF