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Contents

README

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DX2082EGS

Dersem · LED Drivers · ESOP-8

DX2082EGS from Dersem, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND1 power_in Chip 1 ground pin.
2 REXT1 passive Output current setting pin; external Rext sets IOUT = 0.6V/Rext, with VREXT typically 0.6V and IOUT range 5mA to 100mA.
3 NC unconnected No connection, left floating.
4 NC unconnected No connection, left floating.
5 NC unconnected No connection, left floating.
6 NC unconnected No connection, left floating.
7 OUT1 power_in Chip 1 power input and constant-current output port; voltage rated -0.5V to 500V, current 5mA to 100mA.
8 NC unconnected No connection, left floating.
9 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Dersem
Package ESOP-8
Category LED Drivers
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
OUT input voltage (minimum operating) VOUT_MIN 6.5 V IOUT = 30mA 3
OUT breakdown voltage VOUT_BV 500 V IOUT = 0 3
Output current IOUT 5 100 mA 3
Quiescent current IDD 0.1 0.16 0.25 mA VOUT = 10V, REXT floating 3
REXT pin voltage VREXT 0.576 0.6 0.624 V VOUT = 10V 3
Chip-to-chip output current deviation DIOUT 4 % IOUT = 20mA (printed ±4) 3
Current negative temperature compensation start point TSC 140 ℃ 3
OUT pin voltage VOUT -0.5 500 V TA=25°C 3
OUT pin current IOUT 5 100 mA TA=25°C 3
Power dissipation PD 1.25 W TA=25°C 3
Operating junction temperature range TJ -40 150 °C TA=25°C 3
Storage temperature TSTG -55 150 °C TA=25°C 3
ESD HBM VESD 2 KV HBM, printed >2 3
Junction-to-ambient thermal resistance RθJA 65 ℃/W TA=25°C, natural convection, JEDEC JESD51 single-layer board 3

CAD (KiCad official)

  • Symbol: DX2082EGS
  • Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm
  • 3D model: ESOP-8 (KiCad packages3D, STEP)
  • 3D model files: dx2082egs-etched.step / dx2082egs-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); dx2082egs.step / dx2082egs.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Dersem datasheet (12 pp, sha256 9d658809f56af1c8, retrieved 2026-10-23, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF