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ISL3178EIBZ-T

Public Made by Adom

by adom

RENESAS RS-485 / RS-422 ICs, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Contents

README

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ISL3178EIBZ-T

RENESAS · RS-485 / RS-422 ICs · SOIC-8

ISL3178EIBZ-T from RENESAS, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver output: RO is high if A-B ≥ -50mV, low if A-B ≤ -200mV, and high if A and B are unconnected (floating) or shorted.
2 RE input Receiver output enable: RO is enabled when RE is low and high-impedance when RE is high; connect RE to GND through 1kΩ to 3kΩ if the receiver enable function is not required.
3 DE input Driver output enable: Y and Z are enabled when DE is high and high-impedance when DE is low; connect DE to VCC through 1kΩ to 3kΩ if the driver enable function is not required.
4 DI input Driver input: a low on DI forces Y low and Z high, and a high on DI forces Y high and Z low.
5 GND power_in Ground connection.
6 A/Y bidirectional ±15kV IEC61000 ESD protected RS-485/422 pin: noninverting receiver input when DE = 0 and noninverting driver output when DE = 1.
7 B/Z bidirectional ±15kV IEC61000 ESD protected RS-485/422 pin: inverting receiver input when DE = 0 and inverting driver output when DE = 1.
8 VCC power_in System power supply input, 3.0V to 3.6V.

Key specifications

Parameter Value
Manufacturer RENESAS
Package SOIC-8
Category Interface
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage (test condition range) VCC 3 3.6 V Test conditions: VCC = 3.0V to 3.6V; unless otherwise specified 6
Operating temperature range -40 85 °C 6
VCC to GND VCC 7 V VCC to GND 6
Input voltage DI DI -0.3 7 V 6
Input voltage DE, RE DE, RE -0.3 7 V Note 21 6
Input/output voltage A, B, Y, Z A, B, Y, Z -8 13 V 6
Output voltage RO (min) RO -0.3 V 6
Maximum junction temperature (plastic package) 150 °C 6
Maximum storage temperature range -65 150 °C 6
Driver differential output voltage, RS-422 VOD 2 2.3 V RL = 100Ω (RS-422) (Figure 4A, Note 17) 6
Driver differential output voltage, RS-485 VOD 1.5 2 V RL = 54Ω (RS-485) (Figure 4A) 6
Driver differential output voltage, 60Ω load VOD 1.5 2.2 V RL = 60Ω, -7V ≤ VCM ≤ 12V (Figure 4B) 6
Change in magnitude of driver differential VOUT for complementary output states VOD 0.01 0.2 V RL = 54Ω or 100Ω (Figure 4A) 6
Driver common-mode output voltage VOC 2 3 V RL = 54Ω or 100Ω (Figure 4A) 6
Change in magnitude of driver common-mode VOUT for complementary output states VOC 0.01 0.2 V RL = 54Ω or 100Ω (Figure 4A) 6
Logic input high voltage VIH 2 V DI, DE, RE 6
Logic input low voltage VIL 0.8 V DI, DE, RE 6
Logic input current IIN1 -2 2 µA DI = DE = RE = 0V or VCC (Note 19) 6
Input current (A, B, A/Y, B/Z) IIN2 80 125 µA DE = 0V, VCC = 0V or 3.6V; VIN = 12V 6
Input current (A, B, A/Y, B/Z) IIN2 -100 -50 µA DE = 0V, VCC = 0V or 3.6V; VIN = -7V 6
Driver short-circuit current, VO = High or Low IOSD1 -250 250 mA DE = VCC, -7V ≤ VY or VZ ≤ 12V (Note 8) 6
Receiver differential threshold voltage VTH -200 -125 -50 mV -7V ≤ VCM ≤ 12V 6
Receiver output low voltage VOL 0.17 0.4 V IO = -4mA, VID = -200mV 7
Three-state receiver output current IOZR -1 0.015 1 µA 0.4V ≤ VO ≤ 2.4V 7
Receiver input resistance RIN 96 150 kΩ -7V ≤ VCM ≤ 12V 7
Receiver short-circuit current IOSR -7 30 60 mA 0V ≤ VO ≤ VCC 7
No-load supply current (loaded drivers, DE = VCC) ICC 510 800 µA DI = 0V or VCC; DE = VCC, RE = 0V or VCC 7
No-load supply current (DE = 0V) ICC 480 700 µA DE = 0V, RE = 0V 7
Shutdown supply current ISHDN 0.01 12 µA DE = 0V, RE = VCC, DI = 0V or VCC 7
ESD, RS-485 pins, IEC61000-4-2 air-gap discharge -15 15 kV RS-485 pins (A, Y, B, Z, A/Y, B/Z); 25°C 7
ESD, RS-485 pins, IEC61000-4-2 contact discharge -8 8 kV RS-485 pins; 25°C 7
ESD, Human body model, bus pins to GND -15 15 kV Human body model, from bus pins to GND; 25°C 7
ESD, All pins HBM -7 7 kV All pins HBM, per MIL-STD-883 Method 3015; 25°C 7
Driver maximum data rate fMAX 20 28 Mbps VOD = ±1.5V, CD = 350pF (Figure 7, Note 18) 8
Driver differential output delay tDD 27 40 ns RDIFF = 54Ω, CD = 50pF (Figure 5) 8
Driver differential output skew tSKEW 1 3 ns RDIFF = 54Ω, CD = 50pF (Figure 5) 8
Driver output skew, part-to-part tDSKEW 11 ns RDIFF = 54Ω, CD = 50pF (Figure 5, Note 15) 8
Driver differential rise or fall time tR, tF 9 15 ns RDIFF = 54Ω, CD = 50pF (Figure 5) 8
Driver enable to output high tZH 17 50 ns RL = 500Ω, CL = 50pF, SW = GND (Figure 6, Notes 9, 14) 8
Driver enable to output low tZL 16 40 ns RL = 500Ω, CL = 50pF, SW = VCC (Figure 6, Notes 9, 14) 8
Driver disable from output high tHZ 25 40 ns RL = 500Ω, CL = 50pF, SW = GND (Figure 6, Note 14) 8
Driver disable from output low tLZ 28 50 ns RL = 500Ω, CL = 50pF, SW = VCC (Figure 6, Note 14) 8
Time to shutdown tSHDN 50 200 600 ns Notes 11, 14 8
Driver enable from shutdown to output high tZH(SHDN) 180 700 ns RL = 500Ω, CL = 50pF, SW = GND (Figure 6, Notes 11, 12, 14) 8
Driver enable from shutdown to output low tZL(SHDN) 90 700 ns RL = 500Ω, CL = 50pF, SW = VCC (Figure 6, Notes 11, 12, 14) 8
Receiver maximum data rate, ISL3176E-78E fMAX 20 35 Mbps VID = ±1.5V (Note 18) 8
Receiver input to output delay, ISL3176E-78E tPLH, tPHL 25 33 60 ns Figure 8 8
Receiver skew /tPLH - tPHL/ tSKD 1.5 4 ns Figure 8 8
Receiver skew, part-to-part tRSKEW 15 ns Figure 8, Note 15 8
Receiver enable to output high, ISL3176E-78E tZH 5 11 17 ns RL = 1kΩ, CL = 15pF, SW = GND (Figure 9, Notes 10, 14) 8
Receiver enable to output low, ISL3176E-78E tZL 5 11 17 ns RL = 1kΩ, CL = 15pF, SW = VCC (Figure 9, Notes 10, 14) 8
Receiver disable from output high, ISL3176E-78E tHZ 4 7 15 ns RL = 1kΩ, CL = 15pF, SW = GND (Figure 9, Note 14) 9
Receiver disable from output low, ISL3176E-78E tLZ 4 7 15 ns RL = 1kΩ, CL = 15pF, SW = VCC (Figure 9, Note 14) 9
Time to shutdown (receiver) tSHDN 50 180 600 ns Notes 11, 14 9
Receiver enable from shutdown to output high tZH(SHDN) 240 500 ns RL = 1kΩ, CL = 15pF, SW = GND (Figure 9, Notes 11, 13, 14) 9
Receiver enable from shutdown to output low tZL(SHDN) 240 500 ns RL = 1kΩ, CL = 15pF, SW = VCC (Figure 9, Notes 11, 13, 14) 9
Thermal resistance, junction to ambient, 8 Ld SOIC JA 105 °C/W Typical, Note 5 (free air, high-effective thermal conductivity test board) 6
Thermal shutdown threshold TSD 150 °C Full temperature range 7
Machine model ESD 200 V 7

CAD (KiCad official)

  • Symbol: ISL3178EIBZ-T
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: isl3178eibz-t-etched.step / isl3178eibz-t-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); isl3178eibz-t.step / isl3178eibz-t.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: RENESAS datasheet (21 pp, sha256 535fca45090269b8, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF