component
ESP32-C6-WROOM-1U-N4
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Espressif Systems RF and Wireless, 37-SMD Module. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownESP32-C6-WROOM-1U-N4
Espressif Systems · RF and Wireless · 37-SMD Module
ESP32-C6-WROOM-1U-N4 from Espressif Systems, in a 37-SMD Module. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground connection for the module. |
| 2 | 3V3 | power_in | Module power supply input; the datasheet gives a recommended operating voltage of 3.0 to 3.6 V (typical 3.3 V). |
| 3 | EN | input | Chip enable: high turns the chip on and low powers it off, and the pin must not be left floating. |
| 4 | IO4 | bidirectional | GPIO4 with alternate functions MTMS, LP_GPIO4, LP_UART_RXD, ADC1_CH4 and FSPIHD; the pin is also an SDIO sampling-edge strapping pin (MTMS). |
| 5 | IO5 | bidirectional | GPIO5 with alternate functions MTDI, LP_GPIO5, LP_UART_TXD, ADC1_CH5 and FSPIWP; the pin is also an SDIO sampling-edge strapping pin (MTDI). |
| 6 | IO6 | bidirectional | GPIO6 with alternate functions MTCK, LP_GPIO6, LP_I2C_SDA, ADC1_CH6 and FSPICLK. |
| 7 | IO7 | bidirectional | GPIO7 with alternate functions MTDO, LP_GPIO7, LP_I2C_SCL and FSPID. |
| 8 | IO0 | bidirectional | GPIO0 with alternate functions XTAL_32K_P, LP_GPIO0, LP_UART_DTRN and ADC1_CH0. |
| 9 | IO1 | bidirectional | GPIO1 with alternate functions XTAL_32K_N, LP_GPIO1, LP_UART_DSRN and ADC1_CH1. |
| 10 | IO8 | bidirectional | GPIO8, which is also a boot-mode and ROM-message strapping pin. |
| 11 | IO10 | bidirectional | GPIO10 general-purpose I/O. |
| 12 | IO11 | bidirectional | GPIO11 general-purpose I/O. |
| 13 | IO12 | bidirectional | GPIO12 with alternate function USB_D- (USB Serial/JTAG). |
| 14 | IO13 | bidirectional | GPIO13 with alternate function USB_D+ (USB Serial/JTAG). |
| 15 | IO9 | bidirectional | GPIO9, which is also a boot-mode strapping pin (weak pull-up by default). |
| 16 | IO18 | bidirectional | GPIO18 with alternate functions SDIO_CMD and FSPICS2. |
| 17 | IO19 | bidirectional | GPIO19 with alternate functions SDIO_CLK and FSPICS3. |
| 18 | IO20 | bidirectional | GPIO20 with alternate functions SDIO_DATA0 and FSPICS4. |
| 19 | IO21 | bidirectional | GPIO21 with alternate functions SDIO_DATA1 and FSPICS5. |
| 20 | IO22 | bidirectional | GPIO22 with alternate function SDIO_DATA2. |
| 21 | IO23 | bidirectional | GPIO23 with alternate function SDIO_DATA3. |
| 22 | NC | unconnected | Not connected; no internal connection is specified for this pin. |
| 23 | IO15 | bidirectional | GPIO15, which is also the JTAG signal-source strapping pin (no internal pull resistors; must be driven by an external circuit that is not high-impedance). |
| 24 | RXD0 | bidirectional | UART0 receive (U0RXD) with alternate functions GPIO17 and FSPICS1. |
| 25 | TXD0 | bidirectional | UART0 transmit (U0TXD) with alternate functions GPIO16 and FSPICS0. |
| 26 | IO3 | bidirectional | GPIO3 with alternate functions LP_GPIO3, LP_UART_CTSN and ADC1_CH3. |
| 27 | IO2 | bidirectional | GPIO2 with alternate functions LP_GPIO2, LP_UART_RTSN, ADC1_CH2 and FSPIQ. |
| 28 | GND | power_in | Ground connection for the module. |
| 29 | EPAD | power_in | Exposed thermal pad connected to ground; soldering it to the base-board ground is optional and improves thermal performance. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Espressif Systems |
| Package | 37-SMD Module |
| Category | RF and Wireless |
| Pins | 29 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Power supply voltage | VDD33 | 3 | 3.3 | 3.6 | V | 26 | |
| Power supply voltage | VDD33 | -0.3 | 3.6 | V | 26 | ||
| Storage temperature | TSTORE | -40 | 105 | °C | 26 | ||
| Current delivered by external power supply | IVDD | 0.5 | A | 26 | |||
| Operating ambient temperature | TA | -40 | 85 | °C | 85 °C version | 26 | |
| Low-level input voltage | VIL | -0.3 | V | 26 | |||
| High-level input current | IIH | 50 | nA | 26 | |||
| Low-level input current | IIL | 50 | nA | 26 | |||
| Chip reset voltage | VIL_nRST | -0.3 | V | CHIP_PU voltage is within the specified range | 27 | ||
| Power supply voltage (3.3 V) | VCC | 2.7 | 3.3 | 3.6 | V | Flash, power supply voltage (3.3 V) | 28 |
| Maximum clock frequency | FC | 80 | MHz | 28 | |||
| Program/erase cycles | 100000 | cycles | 28 | ||||
| Data retention time | TRET | 20 | years | 28 | |||
| Page program time | TPP | 0.8 | 5 | ms | 28 | ||
| Sector erase time (4 KB) | TSE | 70 | 500 | ms | 29 | ||
| Block erase time (32 KB) | TBE1 | 0.2 | 2 | s | 29 | ||
| Block erase time (64 KB) | TBE2 | 0.3 | 3 | s | 29 | ||
| Chip erase time | TCE | 20 | 60 | s | Chip erase time (32 Mb) | 29 | |
| RF transmit power range (Bluetooth LE) | -16 | 19 | dBm | Bluetooth LE RF transmit power range | 33 | ||
| Sensitivity | -98 | dBm | Bluetooth LE 1 Mbps, @30.8% PER | 34 | |||
| Maximum received signal | 8 | dBm | Bluetooth LE 1 Mbps, @30.8% PER | 34 | |||
| Sensitivity | -95 | dBm | Bluetooth LE 2 Mbps, @30.8% PER | 35 | |||
| Maximum received signal | 8 | dBm | Bluetooth LE 2 Mbps, @30.8% PER | 35 | |||
| Sensitivity | -105.5 | dBm | Bluetooth LE 125 Kbps, @30.8% PER | 36 | |||
| Maximum received signal | 8 | dBm | Bluetooth LE 125 Kbps, @30.8% PER | 36 | |||
| Sensitivity | -101.5 | dBm | Bluetooth LE 500 Kbps, @30.8% PER | 36 | |||
| RF transmit power range (802.15.4) | -16 | 19 | dBm | 802.15.4 250 Kbps | 37 | ||
| Sensitivity | -104 | dBm | 802.15.4 250 Kbps, @1% PER | 37 | |||
| Maximum received signal | 8 | dBm | 802.15.4 250 Kbps, @1% PER | 37 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | Solder: Sn-Ag-Cu (SAC305) lead-free solder Temperature (°C) | 46 |
CAD (KiCad official)
- Symbol:
ESP32-C6-WROOM-1U-N4 - Footprint:
PCM_Espressif:ESP32-C6-WROOM-1U - 3D model: 37-SMD Module (KiCad packages3D, STEP)
- 3D model files:
esp32-c6-wroom-1u-n4-etched.step/esp32-c6-wroom-1u-n4-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);esp32-c6-wroom-1u-n4.step/esp32-c6-wroom-1u-n4.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Espressif Systems datasheet (52 pp, sha256
163020762fa6d499, retrieved 2026-10-28, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).