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Contents

README

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SI3019-F-FT

SILICON LABS · Telecommunication Interface ICs · TSSOP-16

SI3019-F-FT from SILICON LABS, in a TSSOP-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 QE passive Transistor emitter that connects to the emitter of Q3.
2 DCT passive DC termination that provides dc termination to the telephone network.
3 RX input Receive input that serves as the receive-side input from the telephone network.
4 IB passive Internal bias that provides a bias voltage to the device.
5 C1B passive Isolation capacitor 1B that connects to one side of isolation capacitor C1 and is used to communicate with the system-side device.
6 C2B passive Isolation capacitor 2B that connects to one side of isolation capacitor C2 and is used to communicate with the system-side device.
7 VREG passive Voltage regulator that connects to an external capacitor to provide bypassing for an internal power supply.
8 RNG1 passive Ring 1 that connects through a resistor to the TIP lead of the telephone line and provides the ring and caller ID signals to the DAA.
9 RNG2 passive Ring 2 that connects through a resistor to the RING lead of the telephone line and provides the ring and caller ID signals to the DAA.
10 VREG2 passive Voltage regulator 2 that connects to an external capacitor to provide bypassing for an internal power supply.
11 SC passive SC connection that enables the external transistor network and should be tied through a 0 resistor to IGND.
12 QE2 passive Transistor emitter 2 that connects to the emitter of Q4.
13 QB passive Transistor base that connects to the base of transistor Q4.
14 DCT3 passive DC termination 3 that provides dc termination to the telephone network.
15 IGND power_in Isolated ground that connects to ground on the line-side interface.
16 DCT2 passive DC termination 2 that provides dc termination to the telephone network.

Key specifications

Parameter Value
Manufacturer SILICON LABS
Package TSSOP-16
Category Interface ICs
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Ambient Temperature (F-Grade) TA 0 25 70 °C F-Grade 5
DC Termination Voltage VTR 6 V IL = 20 mA, ILIM = 0; DCV = 00, MINI = 11, DCR = 0 6
DC Termination Voltage VTR 9 V IL = 120 mA, ILIM = 0; DCV = 00, MINI = 11, DCR = 0 6
DC Termination Voltage VTR 7.5 V IL = 20 mA, ILIM = 0; DCV = 11, MINI = 00, DCR = 0 6
DC Termination Voltage VTR 40 V IL = 60 mA, ILIM = 1; DCV = 11, MINI = 00, DCR = 0 6
DC Termination Voltage VTR 40 V IL = 50 mA, ILIM = 1; DCV = 11, MINI = 00, DCR = 0 6
On-Hook Leakage Current ILK 5 µA VTR = -48 V 6
Operating Loop Current ILP 10 120 mA MINI = 00, ILIM = 0 6
Operating Loop Current ILP 10 60 mA MINI = 00, ILIM = 1 6
DC Ring Current 1.5 3 µA dc current flowing through ring detection circuitry 6
Ring Detect Voltage VRD 13.5 15 16.5 Vrms RT2 = 0, RT = 0 6
Ring Detect Voltage VRD 19.35 21.5 23.65 Vrms RT2 = 0, RT = 1 6
Ring Detect Voltage VRD 40.5 45 49.5 Vrms RT2 = 1, RT = 1 6
Ring Frequency FR 13 68 Hz 6
Ringer Equivalence Number REN 0.2 6
Sample Rate Fs 8 16 kHz 8
PCLK Input Frequency PCLK 256 8192 kHz 8
Gain Accuracy -0.5 0 0.5 dB 2-W to DTX, TXG2, RXG2, TXG3, and RXG3 = 0000 9
Transhybrid Balance 20 dB 300-3.4 kHz, ZACIM = ZLINE 9
Two-Wire Return Loss 25 dB 300-3.4 kHz, all ac terminations 9
DC Supply Voltage VD -0.5 3.6 V 9
Input Current, Digital Input Pins (Si3050) IIN -10 10 mA 9
Digital Input Voltage VIND -0.3 V printed as (VD + 0.3) 9
Ambient Operating Temperature Range TA -40 100 °C 9
Storage Temperature Range TSTG -65 150 °C 9
Thermal Resistance, Junction-to-Ambient (Si3011/18/19) JA 89 °C/W TSSOP-16 package 5

CAD (KiCad official)

  • Symbol: SI3019-F-FT
  • Footprint: Package_SO:TSSOP-16_4.4x5mm_P0.65mm
  • 3D model: TSSOP-16 (KiCad packages3D, STEP)
  • 3D model files: si3019-f-ft-etched.step / si3019-f-ft-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); si3019-f-ft.step / si3019-f-ft.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: SILICON LABS datasheet (128 pp, sha256 c48c98a604cb0cd7, retrieved 2026-10-30, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF