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Contents

README

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ST10100

MDD(Microdiode Electronics) · Schottky Barrier Diodes (SBD) · TO-277

ST10100 from MDD(Microdiode Electronics), in a TO-277. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A passive Anode, the left pin of the TO-277 package, internally connected to the right pin; the schematic on page 1 shows both pins as the anode side of the diode.
2 A passive Anode, the right pin of the TO-277 package, internally connected to the left pin; the schematic on page 1 shows both pins as the anode side of the diode.
3 K passive Cathode, the bottomside heat sink of the TO-277 package, where the diode symbol points; the part is rated 100 V reverse and 10 A average forward current.

Key specifications

Parameter Value
Manufacturer MDD(Microdiode Electronics)
Package TO-277
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Forward voltage drop (10A, TA=25℃) vF 0.6 0.65 V at 10A, TA=25℃ 1
Forward voltage drop (10A, TA=125℃) vF 0.54 0.59 V at 10A, TA=125℃ 1
Peak reverse current at rated DC blocking voltage (TA=25℃) IR 25 70 uA at rated DC blocking voltage, TA=25℃ 1
Peak reverse current at rated DC blocking voltage (TA=125℃) IR 10 50 mA at rated DC blocking voltage, TA=125℃ 1
Maximum repetitive peak reverse voltage VRRM 100 V 1
RMS reverse voltage VRMS 70 V 1
Average rectified output current I(O) 10 A 1
Non-repetitive peak forward surge current IFSM 240 A 8.3ms single half sine-wave superimposed on rated load (JEDEC method) 1
Operating junction and storage temperature range TJ,TSTG -55 150 ℃ 1
Typical junction capacitance CJ 240 PF 4.0 V, 1 MHz 1
Typical thermal resistance, junction to ambient RθJA 102 ℃/W Junction to ambient 1

CAD (KiCad official)

  • Symbol: ST10100
  • Footprint: Package_TO_SOT_SMD:TO-277A
  • 3D model: TO-277 (KiCad packages3D, STEP)
  • 3D model files: st10100-etched.step / st10100-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); st10100.step / st10100.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MDD(Microdiode Electronics) datasheet (3 pp, sha256 4d3eccb90311019b, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF