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README

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MC74LVX4053DTR2G

onsemi · Analog Switches, Multiplexers · TSSOP-16

MC74LVX4053DTR2G from onsemi, in a TSSOP-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Y1 passive Analog input/output Y1 of the Y switch, connected to common Y15 when selected by input B with Enable LOW; the analog signal must stay between VEE and VCC.
2 Y0 passive Analog input/output Y0 of the Y switch, connected to common Y15 when selected by input B with Enable LOW; the analog signal must stay between VEE and VCC.
3 Z1 passive Analog input/output Z1 of the Z switch, connected to common Z4 when selected by input C with Enable LOW; the analog signal must stay between VEE and VCC.
4 Z passive Common analog output/input of the Z switch, connected to Z0 or Z1 according to input C when Enable is LOW.
5 Z0 passive Analog input/output Z0 of the Z switch, connected to common Z4 when selected by input C with Enable LOW; the analog signal must stay between VEE and VCC.
6 Enable input Active-high enable: when HIGH all analog switches are turned off; digital inputs must be held at VCC or GND levels and must be tied to a defined level, not left open (VIN 0 to 6.0 V).
7 VEE power_in Negative DC supply, recommended range −6.0 V to GND; sets the lower limit of the analog signal range (VIS ≥ VEE) and the device supports VEE = GND for single-supply operation.
8 GND power_in Ground reference for the digital control section; digital supply range is VCC − GND = 2.5 V to 6.0 V.
9 C input Channel-select input for the Z switch; drives the Z0/Z1 selection and must be at VCC or GND logic levels.
10 B input Channel-select input for the Y switch; drives the Y0/Y1 selection and must be at VCC or GND logic levels.
11 A input Channel-select input for the X switch; drives the X0/X1 selection and must be at VCC or GND logic levels.
12 X0 passive Analog input/output X0 of the X switch, connected to common X14 when selected by input A with Enable LOW; the analog signal must stay between VEE and VCC.
13 X1 passive Analog input/output X1 of the X switch, connected to common X14 when selected by input A with Enable LOW; the analog signal must stay between VEE and VCC.
14 X passive Common analog output/input of the X switch, connected to X0 or X1 according to input A when Enable is LOW.
15 Y passive Common analog output/input of the Y switch, connected to Y0 or Y1 according to input B when Enable is LOW.
16 VCC power_in Positive DC supply, recommended range 2.5 V to 6.0 V referenced to GND; the analog signal must not exceed VCC.

Key specifications

Parameter Value
Manufacturer onsemi
Package TSSOP-16
Category Interface
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Negative DC supply voltage (referenced to GND), absolute maximum VEE -7 0.5 V Referenced to GND 2
Positive DC supply voltage (referenced to GND), absolute maximum VCC -0.5 7 V Referenced to GND 2
Positive DC supply voltage (referenced to VEE), absolute maximum VCC -0.5 7 V Referenced to VEE 2
Digital input voltage (referenced to GND), absolute maximum VIN -0.5 7 V Referenced to GND 2
DC current into or out of any pin I -20 20 mA 2
Storage temperature range TSTG -65 150 °C 2
Lead temperature TL 260 °C 1 mm from case for 10 seconds 2
Junction temperature under bias TJ 150 °C Under bias 2
Thermal resistance, junction-to-ambient, TSSOP JA 164 °C/W 2
Power dissipation, TSSOP PD 450 mW In still air 2
ESD withstand voltage, Human Body Model VESD 2000 V Human Body Model (Note 1); printed as > 2000 2
ESD withstand voltage, Machine Model VESD 200 V Machine Model (Note 2); printed as > 200 2
ESD withstand voltage, Charged Device Model VESD 1000 V Charged Device Model (Note 3); printed as > 1000 2
Latchup performance ILATCHUP -300 300 mA Above VCC and below GND at 125°C (Note 4) 2
Negative DC supply voltage (referenced to GND), recommended VEE -6 V Referenced to GND 3
Positive DC supply voltage (referenced to GND), recommended VCC 2.5 6 V Referenced to GND 3
Positive DC supply voltage (referenced to VEE), recommended VCC 2.5 6 V Referenced to VEE 3
Digital input voltage, recommended VIN 0 6 V Referenced to GND (Note 5) 3
Operating temperature range, all package types TA -55 125 °C 3
Input rise/fall time (Channel Select or Enable inputs) tr, tf 0 100 ns/V VCC = 3.0 V ± 0.3 V 3
Input rise/fall time (Channel Select or Enable inputs) tr, tf 0 20 ns/V VCC = 5.0 V ± 0.5 V 3
Minimum high-level input voltage, Channel-Select or Enable inputs VIH 1.9 V VCC = 2.5 V; same limit at −55 to 125°C 3
Minimum high-level input voltage, Channel-Select or Enable inputs VIH 2.1 V VCC = 3.0 V; same limit at −55 to 125°C 3
Minimum high-level input voltage, Channel-Select or Enable inputs VIH 3.15 V VCC = 4.5 V; same limit at −55 to 125°C 3
Minimum high-level input voltage, Channel-Select or Enable inputs VIH 4.2 V VCC = 6.0 V; same limit at −55 to 125°C 3
Maximum low-level input voltage, Channel-Select or Enable inputs VIL 0.6 V VCC = 2.5 V; same limit at −55 to 125°C 3
Maximum low-level input voltage, Channel-Select or Enable inputs VIL 0.9 V VCC = 3.0 V; same limit at −55 to 125°C 3
Maximum low-level input voltage, Channel-Select or Enable inputs VIL 1.35 V VCC = 4.5 V; same limit at −55 to 125°C 3
Maximum low-level input voltage, Channel-Select or Enable inputs VIL 1.8 V VCC = 6.0 V; same limit at −55 to 125°C 3
Maximum input leakage current, Channel-Select or Enable inputs IIN -0.1 0.1 µA VIN = 6.0 or GND 0 V to 6.0 V; −55 to 25°C 3
Maximum input leakage current, Channel-Select or Enable inputs IIN -1 1 µA VIN = 6.0 or GND 0 V to 6.0 V; 85°C 3
Maximum quiescent supply current (per package) ICC 4 µA VCC = 6.0 V; Channel Select, Enable and VIS = VCC or GND; −55 to 25°C 3
Maximum quiescent supply current (per package) ICC 40 µA VCC = 6.0 V; Channel Select, Enable and VIS = VCC or GND; 85°C 3
Maximum quiescent supply current (per package) ICC 80 µA VCC = 6.0 V; Channel Select, Enable and VIS = VCC or GND; 125°C 3
Maximum ON resistance RON 86 Ω VCC = 3.0 V, VEE = 0 V; VIN = VIL or VIH; VIS = ½(VCC − VEE); /IS/ = 2.0 mA; −55 to 25°C (Figure 3) 4
Maximum ON resistance RON 108 Ω VCC = 3.0 V, VEE = 0 V; VIN = VIL or VIH; VIS = ½(VCC − VEE); /IS/ = 2.0 mA; 85°C (Figure 3) 4
Maximum ON resistance RON 120 Ω VCC = 3.0 V, VEE = 0 V; VIN = VIL or VIH; VIS = ½(VCC − VEE); /IS/ = 2.0 mA; 125°C (Figure 3) 4
Maximum ON resistance RON 37 Ω VCC = 4.5 V, VEE = 0 V; VIN = VIL or VIH; VIS = ½(VCC − VEE); /IS/ = 2.0 mA; −55 to 25°C (Figure 3) 4
Maximum ON resistance RON 46 Ω VCC = 4.5 V, VEE = 0 V; VIN = VIL or VIH; VIS = ½(VCC − VEE); /IS/ = 2.0 mA; 85°C (Figure 3) 4
Maximum ON resistance RON 55 Ω VCC = 4.5 V, VEE = 0 V; VIN = VIL or VIH; VIS = ½(VCC − VEE); /IS/ = 2.0 mA; 125°C (Figure 3) 4
Maximum ON resistance RON 26 Ω VCC = 3.0 V, VEE = −3.0 V; VIN = VIL or VIH; VIS = ½(VCC − VEE); /IS/ = 2.0 mA; −55 to 25°C (Figure 3) 4
Maximum ON resistance RON 33 Ω VCC = 3.0 V, VEE = −3.0 V; VIN = VIL or VIH; VIS = ½(VCC − VEE); /IS/ = 2.0 mA; 85°C (Figure 3) 4
Maximum difference in ON resistance between any two channels in the same package RON 15 Ω VCC = 3.0 V, VEE = 0 V; VIN = VIL or VIH; VIS = ½(VCC − VEE); /IS/ = 2.0 mA; −55 to 25°C 4
Maximum difference in ON resistance between any two channels in the same package RON 20 Ω VCC = 3.0 V, VEE = 0 V; VIN = VIL or VIH; VIS = ½(VCC − VEE); /IS/ = 2.0 mA; 85°C 4
Maximum difference in ON resistance between any two channels in the same package RON 13 Ω VCC = 4.5 V, VEE = 0 V; VIN = VIL or VIH; VIS = ½(VCC − VEE); /IS/ = 2.0 mA; −55 to 25°C 4
Maximum difference in ON resistance between any two channels in the same package RON 18 Ω VCC = 4.5 V, VEE = 0 V; VIN = VIL or VIH; VIS = ½(VCC − VEE); /IS/ = 2.0 mA; 85°C 4
Maximum difference in ON resistance between any two channels in the same package RON 10 Ω VCC = 3.0 V, VEE = −3.0 V; VIN = VIL or VIH; VIS = ½(VCC − VEE); /IS/ = 2.0 mA; −55 to 25°C 4
Minimum break-before-make time tBBM 1 6.5 ns VCC = 3.0 V, VEE = 0.0 V; VIN = VIL or VIH; VIS = VCC; RL = 300 Ω; CL = 35 pF (Figures 11 and 12) 4
Minimum break-before-make time tBBM 1 5 ns VCC = 4.5 V, VEE = 0.0 V; VIN = VIL or VIH; VIS = VCC; RL = 300 Ω; CL = 35 pF (Figures 11 and 12) 4
Minimum break-before-make time tBBM 1 3.5 ns VCC = 3.0 V, VEE = −3.0 V; VIN = VIL or VIH; VIS = VCC; RL = 300 Ω; CL = 35 pF (Figures 11 and 12) 4
Maximum input capacitance, Channel-Select or Enable inputs CIN 10 pF 4
Maximum capacitance analog I/O CI/O 10 pF All switches off; analog I/O 4
Maximum capacitance common O/I CI/O 10 pF All switches off; common O/I 4
Maximum capacitance feedthrough CI/O 1 pF All switches off; feedthrough 4

CAD (KiCad official)

  • Symbol: MC74LVX4053DTR2G
  • Footprint: Package_SO:TSSOP-16_4.4x5mm_P0.65mm
  • 3D model: TSSOP-16 (KiCad packages3D, STEP)
  • 3D model files: mc74lvx4053dtr2g-etched.step / mc74lvx4053dtr2g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mc74lvx4053dtr2g.step / mc74lvx4053dtr2g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (15 pp, sha256 f3fe07e436a3505a, retrieved 2026-10-20, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF