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RS3M

Public Made by Adom

by adom

MSKSEMI Diodes - Fast Recovery Rectifiers, SMB. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.

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3D Model

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Symbol & Footprint

Schematic Symbol

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PCB Footprint

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Datasheet

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Contents

README

markdown

RS3M

MSKSEMI · Diodes - Fast Recovery Rectifiers · SMB

RS3M from MSKSEMI, in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer MSKSEMI
Package SMB
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating Temperature Range TJ -55 150 ℃ 2
Storage Temperature Range TSTG -55 150 ℃ 2
Maximum Recurrent Peak Reverse Voltage (RS3M column) VRRM 1000 V 2
Maximum RMS Voltage (RS3M column) VRMS 700 V 2
Maximum DC Blocking Voltage (RS3M column) VDC 1000 V 2
Maximum Average Forward Rectified Current I(AV) 3 A See Fig. 1 @TL=75OC 2
Peak Forward Surge Current, 8.3 ms Single Half Sine-wave Superimposed on Rated Load (JEDEC method) IFSM 100 A 8.3 ms single half sine-wave superimposed on rated load (JEDEC method) 2
Maximum Instantaneous Forward Voltage VF 1.3 V @ 3.0A 2
Maximum DC Reverse Current IR 10 uA @ TA=25℃ at Rated DC Blocking Voltage 2
Maximum DC Reverse Current IR 250 uA @ TA=125℃ at Rated DC Blocking Voltage 2
Maximum Reverse Recovery Time (RS3M column) Trr 500 nS Note 1: IF=0.5A, IR=1.0A, IRR=0.25A 2
Typical Junction Capacitance Cj 60 pF Note 2: measured at 1 MHz and applied VR=4.0 Volts 2
Typical Thermal Resistance, Junction to Ambient RθJA 50 ℃/W Note 3: junction to ambient, mounted on P.C.B. with 0.6x0.6 in (16x16 mm) copper pad areas 2
Typical Thermal Resistance, Junction to Lead RθJL 15 ℃/W Note 3: junction to lead, mounted on P.C.B. with 0.6x0.6 in (16x16 mm) copper pad areas 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts Copper 3. Thermal Resistance from Junction to Ambient and from Junction to Lead Mounted on P.C.B. with 0.6”x0.6” ( 16 x 16 mm ) Copper Pad Areas. 2

CAD (KiCad official)

  • Symbol: RS3M
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB (KiCad packages3D, STEP)
  • 3D model files: rs3m-etched.step / rs3m-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); rs3m.step / rs3m.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MSKSEMI datasheet (5 pp, sha256 4a88d6fa3b254dbe, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF