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Contents

README

markdown

MMBZ5230BW-7-F

Diodes Incorporated · Zener Diodes · SOT-323

MMBZ5230BW-7-F from Diodes Incorporated, in a SOT-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A passive Anode of the zener diode (bottom-left lead in the Device Schematic); 4.7V nominal zener (4.47V to 4.94V at IZT = 20mA) for the MMBZ5230BW.
2 NC unconnected No internal connection; the bottom-right lead is not connected to the diode in the Device Schematic.
3 K passive Cathode of the zener diode (top lead in the Device Schematic); positive with respect to the anode in zener breakdown, 200mW maximum power dissipation.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-323
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener voltage, minimum (MMBZ5230BW, nominal 4.7 V) VZ 4.47 V @ IZT = 20 mA 2
Zener voltage, maximum (MMBZ5230BW, nominal 4.7 V) VZ 4.94 V @ IZT = 20 mA 2
Maximum Zener impedance ZZT 19 Ω @ IZT = 20 mA 2
Maximum Zener impedance (knee) ZZK 1900 Ω @ IZK = 0.25 mA 2
Maximum reverse leakage current IR 5 μA @ VR = 2.0 V 2
Forward voltage (listed under Maximum Ratings) VF 0.9 V @ IF = 10 mA 2
Power dissipation PD 200 mW Note 6: mounted on FR4 PC board with recommended pad layout 2
Thermal resistance, junction to ambient air RθJA 625 °C/W Note 6: mounted on FR4 PC board with recommended pad layout 2
Operating and storage temperature range TJ, TSTG -65 150 °C 2
Nominal Zener voltage VZ 4.7 V @ IZT = 20 mA 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin • Terminals: Matte Tin Finish annealed over Alloy 42 leadframe (Lead Free Plating). Solderable per MIL-STD-202, Method 208 1

CAD (KiCad official)

  • Symbol: MMBZ5230BW-7-F
  • Footprint: Package_TO_SOT_SMD:SOT-323_SC-70
  • 3D model: SOT-323 (KiCad packages3D, STEP)
  • 3D model files: mmbz5230bw-7-f-etched.step / mmbz5230bw-7-f-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mmbz5230bw-7-f.step / mmbz5230bw-7-f.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (5 pp, sha256 e002c9bed5a34a64, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF