component
XL833
Public Made by Adomby adom
XINLUDA Operational Amplifier, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownXL833
XINLUDA · Operational Amplifier · SOIC-8
XL833 from XINLUDA, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUT1 | output | Output of amplifier 1. |
| 2 | IN1- | input | Inverting input of amplifier 1; input current limited to ±10 mA. |
| 3 | IN1+ | input | Non-inverting input of amplifier 1; input voltage must not exceed the supply voltage magnitude. |
| 4 | VCC- | power_in | Negative supply, -5 V to -18 V recommended (absolute maximum -18 V). |
| 5 | IN2+ | input | Non-inverting input of amplifier 2; input voltage must not exceed the supply voltage magnitude. |
| 6 | IN2- | input | Inverting input of amplifier 2; input current limited to ±10 mA. |
| 7 | OUT2 | output | Output of amplifier 2. |
| 8 | VCC+ | power_in | Positive supply, 5 V to 18 V recommended (absolute maximum 18 V). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | XINLUDA |
| Package | SOIC-8 |
| Category | Amplifiers/Comparators |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input offset voltage | VIO | 0.15 | 2 | mV | TA = 25°C, Vo = 0, Rs = 10 Ω, Vcm = 0 | 4 | |
| Input offset voltage | VIO | 3 | mV | TA = -40°C to 85°C, Vo = 0, Rs = 10 Ω, Vcm = 0 | 4 | ||
| Input bias current | IIB | 300 | 750 | nA | TA = 25°C, Vo = 0, Vcm = 0 | 4 | |
| Input bias current | IIB | 800 | nA | TA = -40°C to 85°C, Vo = 0, Vcm = 0 | 4 | ||
| Input offset current | IIO | 25 | 150 | nA | TA = 25°C, Vo = 0, Vcm = 0 | 4 | |
| Input offset current | IIO | 175 | nA | TA = -40°C to 85°C, Vo = 0, Vcm = 0 | 4 | ||
| Common-mode input voltage range | VICR | -13 | 14 | V | ΔVIO = 5 mV, Vo = 0 | 4 | |
| Large-signal differential voltage amplification | AVD | 90 | 110 | dB | TA = 25°C, RL ≥ 2 kΩ, Vo = ±10 V | 4 | |
| Large-signal differential voltage amplification | AVD | 85 | dB | TA = -40°C to 85°C, RL ≥ 2 kΩ, Vo = ±10 V | 4 | ||
| Maximum output voltage swing, positive | VOM+ | 13.2 | 13.8 | V | VID = ±1 V, RL = 2 kΩ | 4 | |
| Maximum output voltage swing, negative | VOM- | -13.2 | -13.7 | V | VID = ±1 V, RL = 2 kΩ | 4 | |
| Maximum output voltage swing, positive | VOM+ | 13.5 | 14.1 | V | VID = ±1 V, RL = 10 kΩ | 4 | |
| Maximum output voltage swing, negative | VOM- | -14 | -14.6 | V | VID = ±1 V, RL = 10 kΩ | 4 | |
| Common-mode rejection ratio | CMMR | 80 | 100 | dB | VIN = ±13 V | 4 | |
| Supply-voltage rejection ratio | KSVR | 80 | 105 | dB | VCC+ = 5 V to 15 V, VCC- = -5 V to -15 V | 4 | |
| Output short-circuit current, source | IOS | 15 | 29 | mA | /VID/ = 1 V, Output to GND | 4 | |
| Output short-circuit current, sink | IOS | -20 | -37 | mA | /VID/ = 1 V, Output to GND | 4 | |
| Supply current (per channel) | ICC | 2.05 | 2.5 | mA | VO = 0, TA = 25°C | 4 | |
| Supply current (per channel) | ICC | 2.75 | mA | VO = 0, TA = -40°C to 85°C | 4 | ||
| Slew rate at unity gain | SR | 5 | 7 | V/ms | AVD = 1, VIN = -10 V to 10 V, RL = 2 kΩ, CL = 100 pF | 4 | |
| Gain bandwidth product | GBW | 10 | 16 | MHz | f = 100 kHz | 4 | |
| Supply voltage, VCC+ (recommended) | VCC+ | 5 | 18 | V | 3 | ||
| Supply voltage, VCC- (recommended) | VCC- | -5 | -18 | V | 3 | ||
| Operating free-air temperature range | TA | -40 | 85 | °C | 3 | ||
| Supply voltage, VCC+ | VCC+ | 18 | V | 3 | |||
| Supply voltage, VCC- | VCC- | -18 | V | 3 | |||
| Supply voltage, VCC+ - VCC- | VCC+ -VCC- | 36 | V | 3 | |||
| Input current, either input | II | -10 | 10 | mA | 3 | ||
| Package thermal impedance, junction to free air (D package) | θJA | 97 | °C/W | D package, junction to free air | 3 | ||
| Operating virtual junction temperature | TJ | 150 | °C | 3 | |||
| Storage temperature range | Tstg | -65 | 150 | °C | 3 | ||
| ESD Human-Body Model | ESD HBM | 2.5 | kV | 3 | |||
| ESD Charged-Device Model | ESD CDM | 1.5 | kV | 3 |
CAD (KiCad official)
- Symbol:
XL833 - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
xl833-etched.step/xl833-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);xl833.step/xl833.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: XINLUDA datasheet (17 pp, sha256
704964020f93a6a7, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).