component
WD1502F-6
Public Made by Adomby adom
WILLSEMI Will Semicon DC-DC Converters, TSOT-23-6L. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownWD1502F-6
WILLSEMI Will Semicon · DC-DC Converters · TSOT-23-6L
WD1502F-6 from WILLSEMI Will Semicon, in a TSOT-23-6L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground pin serving as the ground reference for both the power circuit and the controller circuit. |
| 2 | SW | output | Switch node that connects to the switching end of the inductor; DC voltage range is -0.3 V to VIN(Max) per the absolute maximum ratings. |
| 3 | VIN | power_in | Power supply input with a 4.5 V to 28 V operating range (absolute maximum -0.3 V to 36 V), bypassed with a ceramic capacitor between VIN and GND. |
| 4 | FB | input | Feedback input; an external resistor divider from the output to GND sets the output voltage against the 0.6 V feedback reference (absolute maximum -0.3 V to 7 V). |
| 5 | EN | input | On/off control input: a level above 1.3 V enables the device and a low level disables it into shutdown, with an internal pull-up enabling the device when floating (voltage range -0.3 V to 7 V). |
| 6 | BST | passive | Bootstrap pin for the high-side driver, with a 100 nF capacitor connected between SW and BST; voltage range is (VSW - 0.3 V) to (VSW + 7 V). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | WILLSEMI Will Semicon |
| Package | TSOT-23-6L |
| Category | Power Management (PMIC) |
| Pins | 6 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input Voltage Range | VIN | 4.5 | 28 | V | 4 | ||
| VIN Under Voltage Lockout Threshold, Rising | VUVLO | 4 | 4.3 | V | Rising | 4 | |
| VIN Under Voltage Lockout Threshold, Falling | VUVLO | 3.3 | 3.6 | V | Falling | 4 | |
| Shutdown Supply Current | ISHDN | 2 | 5 | uA | VEN = 0V, Vin=12V | 4 | |
| Feedback reference Voltage | VFB | 0.588 | 0.6 | 0.612 | V | 4 | |
| Inductor Peak Current Limit | ILIM-Peak | 3 | 4 | 4.9 | A | VIN = 12V, VOUT = 5V | 4 |
| Inductor Valley Current Limit | ILIM-Valley | 2.4 | 2.8 | 3.2 | A | 4 | |
| Feedback Leakage Current | IFB | -30 | 30 | nA | VFB=0.65V | 4 | |
| SW Leakage Current | ILSW | -1 | 1 | uA | VIN = 12V, VSW = 0V or 12V | 4 | |
| EN Rising Threshold | VENH | 1.27 | 1.3 | V | 4 | ||
| EN Falling Threshold | VENL | 1.05 | 1.19 | V | 4 | ||
| VIN pin voltage range | VIN | -0.3 | 36 | V | 3 | ||
| EN pin voltage range | -0.3 | 7 | V | 3 | |||
| SW pin voltage range (DC) | VSW | -0.3 | V | Printed as -0.3 to VIN(Max) | 3 | ||
| All Other Pins Voltage | -0.3 | 7 | V | 3 | |||
| Power Dissipation TSOT23-6L | PD | 0.5 | W | Note 1: surface mounted on FR-4, 1 square inch pad, dual side, 1oz copper | 3 | ||
| Maximum Junction Temperature | TJ | 150 | oC | 3 | |||
| Lead temperature (Soldering, 10s) | TL | 260 | oC | Soldering, 10s | 3 | ||
| Operating ambient temperature | Topr | -40 | 85 | oC | 3 | ||
| Storage temperature | Tstg | -65 | 150 | oC | 3 | ||
| ESD HBM | 5000 | V | HBM | 3 | |||
| ESD CDM | 2000 | V | CDM | 3 | |||
| Standby Supply Current | IQ | 60 | uA | VFB = 105%, IOUT = 0A | 4 | ||
| Switching Frequency | fOSC | 650 | kHz | CCM | 4 | ||
| RDS(ON) of HS | RHS | 150 | mΩ | ISW = −100mA | 4 | ||
| RDS(ON) of LS | RLS | 75 | mΩ | ISW = 100mA | 4 | ||
| EN Leakage Current | IEN | 0.7 | uA | VIN = 12V, VEN = 1 | 4 | ||
| EN Leakage Current | IEN | 1.5 | uA | VIN = 12V, VEN = 1.5 V | 4 | ||
| Min On Time | TON-MIN | 110 | nS | 4 | |||
| Soft Start Time | SS | 5 | mS | 4 | |||
| Over Temperature Protection | TOTP | 155 | oC | 4 | |||
| OTP Hysteresis | TOTP_HYS | 30 | oC | 4 | |||
| Thermal resistance junction-to-ambient | RθJA | 250 | oC/W | Note 1 (FR-4, 1 square inch pad) | 3 | ||
| Thermal resistance junction-to-case | RθJC | 110 | oC/W | 3 |
CAD (KiCad official)
- Symbol:
WD1502F-6 - Footprint:
Package_TO_SOT_SMD:TSOT-23-6 - 3D model: TSOT-23-6L (KiCad packages3D, STEP)
- 3D model files:
wd1502f-6-etched.step/wd1502f-6-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);wd1502f-6.step/wd1502f-6.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: WILLSEMI Will Semicon datasheet (13 pp, sha256
684dd9e1e5393beb, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).