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AGM30P18S
Public Made by Adomby adom
AGM-Semi MOSFETs, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownAGM30P18S
AGM-Semi · MOSFETs · SOP-8
AGM30P18S from AGM-Semi, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | S | passive | Source of the P-channel MOSFET; the drain-source voltage rating is -30V. |
| 2 | S | passive | Source of the P-channel MOSFET, tied to the other source pins; continuous drain current is -17A (package limited). |
| 3 | S | passive | Source of the P-channel MOSFET, tied to the other source pins. |
| 4 | G | input | Gate of the P-channel MOSFET with a maximum gate-source voltage of ±20V and a threshold of -1.2V to -2.2V. |
| 5 | D | passive | Drain of the P-channel MOSFET; RDS(on) is 7.0mΩ typical at VGS=-10V, ID=-15A. |
| 6 | D | passive | Drain of the P-channel MOSFET, tied to the other drain pins. |
| 7 | D | passive | Drain of the P-channel MOSFET, tied to the other drain pins. |
| 8 | D | passive | Drain of the P-channel MOSFET, tied to the other drain pins; pulsed drain current is -68A. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | AGM-Semi |
| Package | SOP-8 |
| Category | Transistors/Thyristors |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | -30 | V | VGS=0V | 1 | ||
| Gate-Source Voltage | VGS | -20 | 20 | V | VDS=0V | 1 | |
| Drain Current-Continuous | ID | -17 | A | Ta=25℃ | 1 | ||
| Drain Current-Continuous | ID | -10 | A | Ta=100℃ | 1 | ||
| Maximum Power Dissipation | PD | 2.5 | W | Ta=25℃ | 1 | ||
| Maximum Power Dissipation | PD | 1 | W | Ta=100℃ | 1 | ||
| Avalanche energy | EAS | 49 | mJ | 1 | |||
| Operating Junction and Storage Temperature Range | TJ,TSTG | -55 | 150 | ℃ | 1 | ||
| Thermal Resistance Junction-ambient | RθJA | 50 | ℃/W | Steady State | 1 | ||
| Drain-Source Breakdown Voltage | BVDSS | -30 | V | VGS=0V ID=250μA | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | -1 | μA | VDS=-30V,VGS=0V | 2 | ||
| Gate-Body Leakage Current | IGSS | -100 | 100 | nA | VGS=±20V,VDS=0V | 2 | |
| Gate Threshold Voltage | VGS(th) | -1.2 | -1.6 | -2.2 | V | VDS=VGS,ID=-250μA | 2 |
| Forward Transconductance | gFS | 15 | S | VDS=-5V,ID=-10A | 2 | ||
| Drain-Source On-State Resistance | RDS(on) | 7 | 8 | mΩ | VGS=-10V, ID=-15A | 2 | |
| Drain-Source On-State Resistance | RDS(on) | 10 | 12 | mΩ | VGS=-4.5V, ID=-10A | 2 | |
| Source-Drain Current (Body Diode) | ISD | -17 | A | 2 | |||
| Forward on Voltage | VSD | -1.2 | V | VGS=0V,IS=-15A | 2 | ||
| Input Capacitance | Ciss | 3020 | pF | VDS=-15V,VGS=0V,F=1MHZ | 2 | ||
| Output Capacitance | Coss | 365 | pF | VDS=-15V,VGS=0V,F=1MHZ | 2 | ||
| Reverse Transfer Capacitance | Crss | 225 | pF | VDS=-15V,VGS=0V,F=1MHZ | 2 | ||
| Gate resistance | Rg | 2.2 | Ω | VGS=0V, VDS=0V,f=1.0MHz | 2 | ||
| Turn-on Delay Time | td(on) | 16 | nS | VGS=-10V,VDS=-15V, ID=-10A,RGEN=6.8Ω | 2 | ||
| Turn-on Rise Time | tr | 31 | nS | VGS=-10V,VDS=-15V, ID=-10A,RGEN=6.8Ω | 2 | ||
| Turn-Off Delay Time | td(off) | 66 | nS | VGS=-10V,VDS=-15V, ID=-10A,RGEN=6.8Ω | 2 | ||
| Turn-Off Fall Time | tf | 20 | nS | VGS=-10V,VDS=-15V, ID=-10A,RGEN=6.8Ω | 2 | ||
| Total Gate Charge | Qg | 36 | nC | VGS=-10V, VDS=-15V, ID=-10A | 2 | ||
| Gate-Source Charge | Qgs | 6 | nC | VGS=-10V, VDS=-15V, ID=-10A | 2 | ||
| Gate-Drain Charge | Qgd | 10 | nC | VGS=-10V, VDS=-15V, ID=-10A | 2 |
CAD (KiCad official)
- Symbol:
AGM30P18S - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files:
agm30p18s-etched.step/agm30p18s-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);agm30p18s.step/agm30p18s.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: AGM-Semi datasheet (7 pp, sha256
718d78174d4302e6, retrieved 2026-10-23, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).