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Contents

README

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M95512-RMN6P

STMicroelectronics · Pre-ordered Chips · SOIC-8

M95512-RMN6P from STMicroelectronics, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S input Chip select: when high the device is deselected, Q is high impedance and the device is in Standby Power mode; driving it low selects the device, and a falling edge is required after power-up before any instruction.
2 Q output Serial data output: data is shifted out on the falling edge of Serial clock (C), and the pin is high impedance when deselected or during Hold.
3 W input Write protect: freezes the size of the memory area protected by BP1/BP0 (with SRWD, low enters Hardware Protected mode); must be driven high or low and stable during all Write instructions.
4 VSS power_in Ground: the reference for all signals, including the VCC supply voltage.
5 D input Serial data input: receives instructions, addresses and data to be written, latched on the rising edge of Serial clock (C).
6 C input Serial clock: provides the timing of the serial interface, with inputs latched on the rising edge and Q changing from the falling edge, up to 16 MHz.
7 HOLD input Hold: pauses serial communication without deselecting the device; during Hold Q is high impedance and D and C are Don't Care.
8 VCC power_in Supply voltage: 2.5 V to 5.5 V for M95512-W, 1.8 V to 5.5 V for M95512-R, 1.7 V to 5.5 V for M95512-DF; must be stable during operation and decoupled with 10 to 100 nF close to the pins.

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package SOIC-8
Category Interface ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VCC 1.8 5.5 V M95512-R, device grade 6 33
Ambient operating temperature TA -40 85 °C M95512-R, device grade 6 33
Ambient operating temperature (absolute max) TAMB -40 130 °C 32
Storage temperature TSTG -65 150 °C 32
Output voltage VO -0.5 V Max is VCC+0.6 32
Input voltage VI -0.5 6.5 V 32
Supply voltage (absolute max) VCC -0.5 6.5 V 32
DC output current (Q = 0) IOL 5 mA Q = 0 32
DC output current (Q = 1) IOH 5 mA Q = 1 32
Electrostatic discharge voltage (HBM) VESD 4000 V Human body model; 3000 V for devices identified by process letters KA 32
Input leakage current ILI -2 2 µA VIN = VSS or VCC 37
Output leakage current ILO -2 2 µA S = VCC, voltage applied on Q = VSS or VCC 37
Supply current (Read) ICC 2.5 mA C = 0.1 VCC / 0.9 VCC at max clock frequency, VCC = 1.8 V, Q = open 37
Supply current (Write) ICC0 1.5 mA During tW, S = VCC, 1.8 V < VCC < 2.5 V 37
Supply current (Standby Power mode) ICC1 1 µA S = VCC, VCC = 1.8 V, VIN = VSS or VCC 37
Input low voltage VIL -0.45 V Max is 0.3 VCC 37
Output low voltage VOL 0.3 V IOL = 0.15 mA, VCC = 1.8 V 37
Output capacitance (Q) COUT 8 pF VOUT = 0 V, TA = 25 °C, 5 MHz 34
Input capacitance (D) CIN 8 pF VIN = 0 V, TA = 25 °C, 5 MHz 34
Input capacitance (other pins) CIN 6 pF VIN = 0 V, TA = 25 °C, 5 MHz 34
Write cycle endurance Ncycle 4e+06 Write cycle TA ≤ 25 °C, VCC(min) < VCC < VCC(max) 34
Write cycle endurance Ncycle 1.2e+06 Write cycle TA = 85 °C, VCC(min) < VCC < VCC(max) 34
Data retention 200 Year TA = 55 °C 34
Clock frequency fC 5 MHz Current products; min is D.C. 41
S active setup time tSLCH 60 ns Current products 41
S not active setup time tSHCH 60 ns Current products 41
S deselect time tSHSL 90 ns Current products 41
S active hold time tCHSH 60 ns Current products 41
S not active hold time tCHSL 60 ns Current products 41
Clock high time tCH 80 ns Current products 41
Clock low time tCL 80 ns Current products 41
Clock rise time tCLCH 2 µs Current products; characterized only 41
Clock fall time tCHCL 2 µs Current products; characterized only 41
Data in setup time tDVCH 20 ns Current products 41
Data in hold time tCHDX 20 ns Current products 41
Clock low hold time after HOLD not active tHHCH 60 ns Current products 41
Clock low hold time after HOLD active tHLCH 60 ns Current products 41
Clock low setup time before HOLD active tCLHL 0 ns Current products 41
Clock low setup time before HOLD not active tCLHH 0 ns Current products 41
Output disable time tSHQZ 80 ns Current products; characterized only 41
Clock low to output valid tCLQV 80 ns Current products 41
Output hold time tCLQX 0 ns Current products 41
Output rise time tQLQH 80 ns Current products; characterized only 41
Output fall time tQHQL 80 ns Current products; characterized only 41
HOLD high to output valid tHHQV 80 ns Current products 41
HOLD low to output High-Z tHLQZ 80 ns Current products; characterized only 41
Write time tW 5 ms Current products 41

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin TLEAD Lead temperature during soldering See note (1) 1. Compliant with JEDEC standard J-STD-020D (for small-body, Sn-Pb or Pb free assembly), the ST 32

CAD (KiCad official)

  • Symbol: M95512-RMN6P
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: m95512-rmn6p-etched.step / m95512-rmn6p-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); m95512-rmn6p.step / m95512-rmn6p.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (54 pp, sha256 46546a73b781e404, retrieved 2026-10-27, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF