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Contents

README

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B772 B772

LGE · Bipolar (BJT) · SOT-89

B772 B772 from LGE, in a SOT-89. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 BASE input Base terminal of the PNP transistor; the datasheet gives VBE(sat) of -1.5 V max at IC=-2 A, IB=-0.2 A and emitter-base rating VEBO of -5 V.
2 COLLECTOR passive Collector terminal; the datasheet rates it for VCBO of -40 V, VCEO of -30 V and continuous collector current IC of -3 A, with VCE(sat) of -0.5 V max at IC=-2 A, IB=-0.2 A.
3 EMITTER passive Emitter terminal, the reference for the datasheet's VCEO (-30 V) and VEBO (-5 V) ratings; total device dissipation PC is 0.5 W.

Key specifications

Parameter Value
Manufacturer LGE
Package SOT-89
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Collector-Emitter Voltage VCEO -30 V 1
Collector-Base Voltage VCBO -40 V 1
Emitter-Base Voltage VEBO -5 V 1
Collector Current -Continuous IC -3 A 1
Collector Power Dissipation PC 0.5 W 1
Junction Temperature Tj 150 ℃ 1
Storage Temperature Tstg -55 150 ℃ 1
Collector-base breakdown voltage V(BR)CBO -40 V IC=-100μA ,IE=0 1
Collector-emitter breakdown voltage V(BR)CEO -30 V IC= -10mA , IB=0 1
Emitter-base breakdown voltage V(BR)EBO -5 V IE= -100μA,IC=0 1
Collector cut-off current ICBO -1 μA VCB= -40V, IE=0 1
Collector cut-off current ICEO -10 μA VCE=-30V, IB=0 1
Emitter cut-off current IEBO -1 μA VEB=-6V, IC=0 1
DC current gain hFE 60 400 VCE= -2V, IC= -1A 1
Collector-emitter saturation voltage VCE(sat) -0.5 V IC=-2A, IB= -0.2A 1
Base-emitter saturation voltage VBE(sat) -1.5 V IC=-2A, IB= -0.2A 1
Transition frequency fT 80 MHz VCE= -5V, IC=-0.1A, f =10MHz 1

CAD (KiCad official)

  • Symbol: B772 B772
  • Footprint: Package_TO_SOT_SMD:SOT-89-3
  • 3D model: SOT-89 (KiCad packages3D, STEP)
  • 3D model files: b772-b772-etched.step / b772-b772-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); b772-b772.step / b772-b772.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: LGE datasheet (2 pp, sha256 b79f1759410e3bca, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF