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Contents

README

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M93C56-WMN6TP

STMicroelectronics · EEPROM · SOIC-8

M93C56-WMN6TP from STMicroelectronics, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S input Chip Select input. Active high; enables the MICROWIRE serial interface. Must be pulled low (to VSS) during power-up/power-down and while deselected.
2 C input Serial Clock input (MICROWIRE clock, up to 2 MHz). Latches data on D on rising edge; shifts data out on Q on rising edge. Should be held low via an external pull-down when the bus master's outputs go high impedance.
3 D input Serial Data Input. Instructions, addresses, and write data are shifted in on this pin, synchronous with the rising edge of C.
4 Q tri_state Serial Data Output. Read data is shifted out on this pin synchronous with the rising edge of C. High-impedance when the device is not selected or during internal write cycle; also carries the READY/BUSY status while S is high after a program command.
5 VSS power_in Ground reference (0 V) for the device.
6 ORG input Organization Select input. Tie to VCC (or leave unconnected) for x16 (word) organization; tie to VSS for x8 (byte) organization. To minimize standby current, ORG should be driven to VCC or VSS and not left floating in standby.
7 DU unconnected Don't Use. Reserved by STMicroelectronics for internal test. May be left unconnected or tied to VCC or VSS; does not affect normal device operation.
8 VCC power_in Supply voltage input. 2.5 V to 5.5 V for M93Cx6-W variants (1.8 V to 5.5 V for -R variants). Decouple with 10 nF to 100 nF close to the VCC/VSS pins.

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package SOIC-8
Category Memory
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • M93C56-WMN6TP
  • M93C56-WMN6TPMN6P
  • M93C56-WMN6TPBN6
  • M93C56-WMN6TPBN6TP
  • M93C56-WMN6TPDW6TP
  • M93C56-WMN6TPMC6TP

CAD (KiCad official)

  • Symbol: M93C56-WMN6TP
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: m93c56-wmn6tp-etched.step / m93c56-wmn6tp-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); m93c56-wmn6tp.step / m93c56-wmn6tp.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (35 pp, sha256 7b1f76e6c602697a, retrieved 2026-08-17, tier: manufacturer)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF