component

MAX3085ECM

Public Made by Adom

by adom

HGSEMI RS-485 / RS-422 ICs, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentinterfacemax3085ecmfactory-2.0.0extractor-text
Overview Files Discover Packages Releases Dependencies Issues Breadcrumbs Pull Requests Activity

3D Model

Open in new tab ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

Datasheet

Open in new tab ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

MAX3085ECM

HGSEMI · RS-485 / RS-422 ICs · SOP-8

MAX3085ECM from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver output: with RE low, RO is high when A-B is at or above -50mV and low when A-B is at or below -200mV.
2 RE input Receiver output enable: RO is enabled when RE is low and high-impedance when RE is high, and RE high with DE low puts the device into low-power shutdown; RE uses a hot-swap input structure.
3 DE input Driver output enable: the driver outputs are active when DE is high and high-impedance when DE is low, and RE high with DE low puts the device into low-power shutdown; DE uses a hot-swap input structure.
4 DI input Driver input: when DE is high, a low on DI drives A/Y low and B/Z high, and a high on DI drives A/Y high and B/Z low.
5 GND power_in Ground reference for the device.
6 A bidirectional Receiver non-inverting input and driver non-inverting output (A/Y); bus pins are rated -7V to +12V.
7 B bidirectional Receiver inverting input and driver inverting output (B/Z); bus pins are rated -7V to +12V.
8 VCC power_in Positive supply: 4.5V ≤ VCC ≤ 5.5V; decouple with a 0.1µF capacitor to ground.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOP-8
Category Interface
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage (recommended operating) VCC 4.5 5.5 V 5
Operating temperature range (commercial, MAX308_EC) 0 70 °C MAX3085ECM (EC grade) 4
Supply voltage (absolute maximum) VCC 6 V 4
Control input voltage (DE, RE) RE, DE -0.3 6 V 4
Driver input voltage DI -0.3 6 V 4
Driver output voltage A, B, Y, Z -7 12 V 4
Receiver input voltage A, B -7 12 V 4
Receiver output voltage RO -0.3 V 4
Continuous power dissipation, 8-pin SOP PD 500 mW TA=+70°C 4
Storage temperature -65 150 °C 4
Lead temperature (soldering) TLEAD 260 °C 10 s soldering 4
Differential driver output (RS-422 load) VOD 2.7 V Fig.1, RL=100Ω (RS-422) 5
Differential driver output (RS-485 load) VOD 2.1 V Fig.1, RL=54Ω (RS-485) 5
Change in magnitude of differential output voltage ΔVOD 0.2 V Fig.1, RL=100Ω or RL=54Ω 5
Driver common-mode output voltage VOC 3 V Fig.1, RL=100Ω or RL=54Ω 5
Change in magnitude of common-mode output voltage ΔVOC 0.2 V Fig.1, RL=100Ω or RL=54Ω 5
Input high voltage VIH 2 V 5
Input low voltage VIL 0.8 V 5
Input current (DE, DI, RE) IIN -1 1 μA 5
Driver short-circuit output current IOSD 250 mA 0≤VOUT≤12V 5
Driver short-circuit output current IOSD -250 mA -7≤VOUT≤VCC 5
Driver short-circuit foldback output current IOSDF 20 mA VCC-1V≤VOUT≤VCC+0.5V 5
Driver short-circuit foldback output current IOSDF -20 mA -0.5V≤VOUT≤+1V 5
Thermal shutdown temperature TTS 165 °C 5
Receiver differential threshold voltage VTH -200 -125 -50 mV -7V≤VCM≤12V 5
Receiver output low voltage VOL 0.4 V IO=4mA, VID=-200mV 5
Receiver three-state output current IOZR -1 1 μA 0≤VO≤VCC 5
Receiver output short-circuit current IOSR -95 95 mA 0V≤VRO≤VCC 5
Supply current (operating, no load) ICC 530 900 μA No load; RE=VCC; DI=GND or VCC; DE=VCC 6
Supply current (operating, no load) ICC 475 600 μA No load; RE=VCC; DI=GND or VCC; DE=GND 6
Supply current (operating, no load) ICC 530 1000 μA No load; RE=GND; DI=GND or VCC; DE=VCC 6
Supply current (operating, no load) ICC 475 800 μA No load; RE=GND; DI=GND or VCC; DE=GND 6
Shutdown supply current ISHDN 0.05 10 μA DE=GND, RE=VCC 6
ESD IEC 61000-4-2 air-gap discharge (RS-485 pins) -16 16 kV IEC 61000-4-2 air-gap discharge 6
ESD IEC 61000-4-2 contact discharge (RS-485 pins) -16 16 kV IEC 61000-4-2 contact discharge, half-duplex 6
ESD HBM (RS-485 pins to GND) -16 16 kV Human body model, RS-485 pins to GND 6
ESD HBM (all pins) -4 4 kV Human body model, JEDEC JS-001-2010 6
ESD charged device model (all pins) -500 500 V CDM, JESD22-C101E 6
Driver propagation delay (low-to-high) tDPLH 200 1000 ns Fig.2 and 5, RL=54Ω, CL=50pF 8
Driver propagation delay (high-to-low) tDPHL 200 1000 ns Fig.2 and 5, RL=54Ω, CL=50pF 8
Driver differential output skew tDSKEW -140 140 ns Fig.2 and 5, RL=54Ω, CL=50pF 8
Driver rise time tDR 250 900 ns Fig.2 and 5, RL=54Ω, CL=50pF 8
Driver fall time tDF 250 900 ns Fig.2 and 5, RL=54Ω, CL=50pF 8
Driver enable to output high tDZH 2500 ns Fig.3 and 6, CL=100pF, S3 closed 8
Driver enable to output low tDZL 2500 ns Fig.3 and 6, CL=100pF, S2 closed 8
Driver disable time from low tDLZ 100 ns Fig.3 and 6, CL=15pF, S2 closed 8
Driver disable time from high tDHZ 100 ns Fig.3 and 6, CL=15pF, S3 closed 8
Driver enable from shutdown to output high tDZH(SHDN) 5500 ns Fig.3 and 6, CL=15pF, S3 closed 8
Driver enable from shutdown to output low tDZL(SHDN) 5500 ns Fig.3 and 6, CL=15pF, S2 closed 8
Driver shutdown time tSHDN 50 700 ns 8
Receiver propagation delay tRPLH, tRPHL 200 ns Fig.7 and 8, CL=15pF, /VID/≥2.0V, VID≤15ns 8
Receiver differential output skew tRSKEW -30 30 ns Fig.7 and 8, CL=15pF, /VID/≥2.0V, VID≤15ns 8
Receiver enable to output low tRZL 50 ns Fig.4 and 9, S1=-1.5V, S2 to VCC 8
Receiver enable to output high tRZH 50 ns Fig.4 and 9, S1=+1.5V, S2 to GND 8
Receiver disable time from low tRLZ 50 ns Fig.4 and 9, S1=-1.5V, S2 to VCC 8
Receiver disable time from high tRHZ 50 ns Fig.4 and 9, S1=+1.5V, S2 to GND 8
Receiver enable from shutdown to output high tRZH(SHDN) 5500 ns Fig.4 and 9, S1=-1.5V, S2 to VCC 8
Receiver enable from shutdown to output low tRZL(SHDN) 5500 ns Fig.4 and 9, S1=+1.5V, S2 to GND 8
Receiver shutdown time tSHDN 50 700 ns 8

CAD (KiCad official)

  • Symbol: MAX3085ECM
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: max3085ecm-etched.step / max3085ecm-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); max3085ecm.step / max3085ecm.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (28 pp, sha256 a74bdc964ee9cb50, retrieved 2026-10-18, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF