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ESP32-H2-MINI-1U-N4

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Espressif Systems RF and Wireless, 61-SMD Module. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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3D Model

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Symbol & Footprint

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Datasheet

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Contents

README

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ESP32-H2-MINI-1U-N4

Espressif Systems · RF and Wireless · 61-SMD Module

ESP32-H2-MINI-1U-N4 from Espressif Systems, in a 61-SMD Module. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground.
2 GND power_in Ground.
3 3V3 power_in Module power supply, 3.0 to 3.6 V (3.3 V typical).
4 NC unconnected No connect.
5 IO2 bidirectional GPIO2 with FSPIWP, ADC1_CH1 and MTMS (JTAG) functions.
6 IO3 bidirectional GPIO3 with FSPIHD, ADC1_CH2 and MTDO (JTAG) functions.
7 NC unconnected No connect.
8 EN input Chip enable: high turns the chip on, low powers it off; do not leave floating.
9 IO0 bidirectional GPIO0 with FSPIQ function.
10 IO1 bidirectional GPIO1 with FSPICS0 and ADC1_CH0 functions.
11 GND power_in Ground.
12 IO13 bidirectional GPIO13, also XTAL_32K_P (32 kHz crystal).
13 IO14 bidirectional GPIO14, also XTAL_32K_N (32 kHz crystal).
14 GND power_in Ground.
15 VBAT power_in Connected to internal 3V3 supply by default, or to an external battery supply of 3.0 to 3.6 V.
16 IO12 bidirectional GPIO12.
17 NC unconnected No connect.
18 IO4 bidirectional GPIO4 with FSPICLK, ADC1_CH3 and MTCK (JTAG) functions.
19 IO5 bidirectional GPIO5 with FSPID, ADC1_CH4 and MTDI (JTAG) functions.
20 IO10 bidirectional GPIO10 with ZCD0 function.
21 IO11 bidirectional GPIO11 with ZCD1 function.
22 IO8 bidirectional GPIO8; strapping pin for boot mode and ROM message printing, floating by default.
23 IO9 bidirectional GPIO9; strapping pin for boot mode, weak pull-up by default (SPI boot).
24 IO22 bidirectional GPIO22.
25 IO25 bidirectional GPIO25 with FSPICS3; strapping pin for JTAG signal source, no internal pull resistors.
26 IO26 bidirectional GPIO26 with FSPICS4 and USB_D- functions.
27 IO27 bidirectional GPIO27 with FSPICS5 and USB_D+ functions.
28 NC unconnected No connect.
29 NC unconnected No connect.
30 RXD0 bidirectional GPIO23 with FSPICS1 and U0RXD (UART0 receive) functions.
31 TXD0 bidirectional GPIO24 with FSPICS2 and U0TXD (UART0 transmit) functions.
32 NC unconnected No connect.
33 NC unconnected No connect.
34 NC unconnected No connect.
35 NC unconnected No connect.
36 GND power_in Ground.
37 GND power_in Ground.
38 GND power_in Ground.
39 GND power_in Ground.
40 GND power_in Ground.
41 GND power_in Ground.
42 GND power_in Ground.
43 GND power_in Ground.
44 GND power_in Ground.
45 GND power_in Ground.
46 GND power_in Ground.
47 GND power_in Ground.
48 GND power_in Ground.
49 GND power_in Ground; shown as EPAD in the schematics, soldering it to board ground is optional but improves thermal performance.
50 GND power_in Ground.
51 GND power_in Ground.
52 GND power_in Ground.
53 GND power_in Ground.

Key specifications

Parameter Value
Manufacturer Espressif Systems
Package 61-SMD Module
Category RF and Wireless
Pins 53

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Power supply voltage VDD33 -0.3 3.6 V 24
Storage temperature TSTORE -40 105 °C 24
Power supply voltage VDD33 3 3.3 3.6 V 24
Current delivered by external power supply IVDD 0.35 A 24
Operating ambient temperature TA -40 105 °C 24
High-level input current IIH 50 nA 24
Low-level input current IIL 50 nA 24
Sensitivity 1 Mbps -98 dBm @30.8% PER 29
Maximum received signal 1 Mbps 8 dBm @30.8% PER 29
Sensitivity 2 Mbps -95 dBm @30.8% PER 29
Maximum received signal 2 Mbps 8 dBm @30.8% PER 29
Sensitivity 125 Kbps -105.5 dBm @30.8% PER 30
Maximum received signal 125 Kbps 8 dBm @30.8% PER 30
Sensitivity 500 Kbps -101.5 dBm @30.8% PER 30
Maximum received signal 500 Kbps 8 dBm @30.8% PER 30
Sensitivity 802.15.4 250 Kbps -101.5 dBm @1% PER 31
Maximum received signal 802.15.4 250 Kbps 8 dBm @1% PER 31
Intermodulation 1 Mbps -35 dBm 29
Intermodulation 2 Mbps -27 dBm 29
Image frequency 1 Mbps -30 dB 29
Image frequency 2 Mbps -26 dB 29
Image frequency 125 Kbps -39 dB 30
Image frequency 500 Kbps -33 dB 30
RF transmit power range Bluetooth LE -24 20 dBm 27
Center frequency range of operating channel Bluetooth LE 2402 2480 MHz 27
Center frequency range of operating channel 802.15.4 2405 2480 MHz 31
RF transmit power range 802.15.4 -24 20 dBm 31
Current consumption Bluetooth LE TX 112 mA Active (RF working), TX, Bluetooth LE @ 18.0 dBm 25
Current consumption Bluetooth LE TX 55 mA Active (RF working), TX, Bluetooth LE @ 7.0 dBm 25
Current consumption Bluetooth LE TX 35 mA Active (RF working), TX, Bluetooth LE @ -2.0 dBm 25
Current consumption Bluetooth LE TX 26 mA Active (RF working), TX, Bluetooth LE @ -24.0 dBm 25
Current consumption Bluetooth LE RX 25 mA Active (RF working), RX, Bluetooth LE 25
Current consumption 802.15.4 TX 123 mA Active (RF working), TX, 802.15.4 @ 18.0 dBm 25
Current consumption 802.15.4 TX 54 mA Active (RF working), TX, 802.15.4 @ 7.0 dBm 25
Current consumption 802.15.4 TX 38 mA Active (RF working), TX, 802.15.4 @ -2.0 dBm 25
Current consumption 802.15.4 TX 28 mA Active (RF working), TX, 802.15.4 @ -22.0 dBm 25
Current consumption 802.15.4 RX 29 mA Active (RF working), RX, 802.15.4 25
Current consumption Light-sleep 85 µA CPU and wireless communication modules are powered down, peripheral clocks are disabled, and all GPIOs are high-impedance 26
Current consumption Deep-sleep 7 µA LP timer and LP memory are powered on 26
Current consumption Power off 1 µA CHIP_EN is set to low level, the chip is powered off 26
Relative EVM 802.15.4 transmitter EVM 3.8 % 802.15.4 Transmitter Characteristics - 250 Kbps 31

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing THERMOPLASTIC HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0; 36
contacts COPPER ALLOY gold CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; 36
shell COPPER ALLOY gold SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; 36

CAD (KiCad official)

  • Symbol: ESP32-H2-MINI-1U-N4
  • Footprint: PCM_Espressif:ESP32-H2-MINI-1U
  • 3D model: 61-SMD Module (KiCad packages3D, STEP)
  • 3D model files: esp32-h2-mini-1u-n4-etched.step / esp32-h2-mini-1u-n4-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esp32-h2-mini-1u-n4.step / esp32-h2-mini-1u-n4.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Espressif Systems datasheet (45 pp, sha256 33f21dd6428aa348, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF