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Contents

README

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ESD5452E-3

WILLSEMI Will Semicon · ESD And Surge Protection (TVS/ESD) · SOT-23

ESD5452E-3 from WILLSEMI Will Semicon, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 I/O1 passive Protected line 1 of the bi-directional TVS, rated for ±5V max reverse stand-off voltage and ±30kV IEC61000-4-2 contact and air discharge.
2 I/O2 passive Protected line 2 of the bi-directional TVS, rated for ±5V max reverse stand-off voltage and ±30kV IEC61000-4-2 contact and air discharge.
3 GND power_in Common ground reference for both TVS lines, which clamp to about 9V typ. at IPP = 16A (TLP).

Key specifications

Parameter Value
Manufacturer WILLSEMI Will Semicon
Package SOT-23
Category Circuit Protection
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak pulse power (tp = 8/20μs) Ppk 80 W tp = 8/20μs 2
Peak pulse current (tp = 8/20μs) IPP 8 A tp = 8/20μs 2
ESD according to IEC61000-4-2 air discharge VESD -30 30 kV IEC61000-4-2 air discharge 2
ESD according to IEC61000-4-2 contact discharge VESD -30 30 kV IEC61000-4-2 contact discharge 2
Operation temperature TOP -40 85 oC 2
Storage temperature TSTG -55 150 oC 2
Lead temperature TL 260 oC 2
Reverse stand-off voltage VRWM -5 5 V 3
Reverse leakage current IR 100 nA VRWM = 5V 3
Junction capacitance CJ 17.5 22 pF VR = 0V, f = 1MHz 3
Junction capacitance CJ 11.5 16 pF VR = 5V, f = 1MHz 3
Reverse breakdown voltage VBR 5.1 V IBR = 1mA 3
Reverse holding voltage VHOLD 5.1 V IHOLD = 50mA 3
Clamping voltage (TLP) VCL 9 V IPP = 16A, tp = 100ns 3
Clamping voltage (ESD contact) VCL 9 V VESD = 8kV 3
Clamping voltage VCL 6.5 V IPP = 1A, tp = 8/20μs 3
Clamping voltage VCL 8.5 V IPP = 5A, tp = 8/20μs 3
Clamping voltage VCL 10 V IPP = 8A, tp = 8/20μs 3
Dynamic resistance RDYN 0.2 Ω 3

CAD (KiCad official)

  • Symbol: ESD5452E-3
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: esd5452e-3-etched.step / esd5452e-3-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esd5452e-3.step / esd5452e-3.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: WILLSEMI Will Semicon datasheet (6 pp, sha256 70e9aa2c67801336, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF