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Contents

README

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S3GB

Shandong Jingdao Microelectronics · Diodes - General Purpose · SMB(DO-214AA)

S3GB from Shandong Jingdao Microelectronics, in a SMB(DO-214AA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Cathode passive Cathode terminal of the rectifier diode (S3GB: 400 V VRRM, 280 V RMS, 400 V DC blocking, 3 A average forward current).
2 Anode passive Anode terminal of the rectifier diode (S3GB: 3 A average forward rectified current, 90 A peak forward surge current at 8.3 ms).

Key specifications

Parameter Value
Manufacturer Shandong Jingdao Microelectronics
Package SMB(DO-214AA)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum Repetitive Peak Reverse Voltage VRRM 400 V 1
Maximum RMS voltage VRMS 280 V 1
Maximum DC Blocking Voltage VDC 400 V 1
Maximum Average Forward Rectified Current IF(AV) 3 A Single phase half-wave 60 Hz, resistive or inductive load 1
Peak Forward Surge Current IFSM 90 A 8.3 ms Single Half Sine Wave Superimposed on Rated Load 1
Maximum Instantaneous Forward Voltage VF 1.1 V at 3 A 1
Maximum DC Reverse Current IR 5 μA Ta=25 °C, at Rated DC Blocking Voltage 1
Maximum DC Reverse Current IR 100 μA Ta=125 °C, at Rated DC Blocking Voltage 1
Operating and Storage Temperature Range Tj, Tstg -55 150 °C 1
Typical Junction Capacitance Cj 35 pF Measured at 1 MHz and applied reverse voltage of 4 V D.C 1
Typical Thermal Resistance RθJA 48 °C/W P.C.B. mounted with 2.0" X 2.0" (5 X 5 cm) copper pad areas 1
Typical Thermal Resistance RθJC 16 °C/W P.C.B. mounted with 2.0" X 2.0" (5 X 5 cm) copper pad areas 1

CAD (KiCad official)

  • Symbol: S3GB
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB(DO-214AA) (KiCad packages3D, STEP)
  • 3D model files: s3gb-etched.step / s3gb-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); s3gb.step / s3gb.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shandong Jingdao Microelectronics datasheet (3 pp, sha256 e7c97f83deec8f30, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF