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VB5222

Public Made by Adom

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VBsemi Elec MOSFETs, TSOP-6. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Contents

README

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VB5222

VBsemi Elec · MOSFETs · TSOP-6

VB5222 from VBsemi Elec, in a TSOP-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G1 input Gate of the N-channel MOSFET (Q1); gate-source voltage is rated ±20 V per the absolute maximum ratings.
2 S2 passive Source of the P-channel MOSFET (Q2); the P-channel drain-source voltage is rated -20 V.
3 G2 input Gate of the P-channel MOSFET (Q2); gate-source voltage is rated ±20 V per the absolute maximum ratings.
4 D2 passive Drain of the P-channel MOSFET (Q2); the P-channel drain-source voltage is rated -20 V.
5 S1 passive Source of the N-channel MOSFET (Q1); continuous source (diode) current is rated 1.05 A.
6 D1 passive Drain of the N-channel MOSFET (Q1); the N-channel drain-source voltage is rated 20 V.

Key specifications

Parameter Value
Manufacturer VBsemi Elec
Package TSOP-6
Category Transistors/Thyristors
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage (N-Channel) VDS 20 V 1
Drain-Source Voltage (P-Channel) VDS -20 V 1
Gate-Source Voltage (N- and P-Channel) VGS -20 20 V 1
Continuous Source Current (Diode Conduction) (N-Channel) IS 1.05 A 1
Continuous Source Current (Diode Conduction) (P-Channel) IS -1.05 A 1
Maximum Power Dissipation PD 1.15 W TA = 25 °C 1
Maximum Power Dissipation PD 0.73 W TA = 70 °C 1
Operating Junction and Storage Temperature Range TJ, Tstg -55 150 °C 1
Maximum Junction-to-Ambient RthJA RthJA 93 110 °C/W t ≤ 5 s 1
Maximum Junction-to-Ambient RthJA RthJA 130 150 °C/W Steady state 1
Maximum Junction-to-Lead RthJL RthJL 75 90 °C/W Steady state 1
Gate Threshold Voltage (N-Channel) VGS(th) 0.5 0.8 1.5 V VDS = VGS, ID = 250 µA 2
Gate Threshold Voltage (P-Channel) VGS(th) -1.5 -0.8 -0.5 V VDS = VGS, ID = -250 µA 2
Gate-Body Leakage (N-Channel) IGSS -100 100 nA VDS = 0 V, VGS = ± 8 V 2
Gate-Body Leakage (P-Channel) IGSS -100 100 nA VDS = 0 V, VGS = ± 8 V 2
Zero Gate Voltage Drain Current (N-Channel) IDSS 1 µA VDS = 16 V, VGS = 0 V 2
Zero Gate Voltage Drain Current (P-Channel) IDSS -1 µA VDS = -16 V, VGS = 0 V 2
Zero Gate Voltage Drain Current (N-Channel, hot) IDSS 5 µA VDS = 16 V, VGS = 0 V, TJ = 55 °C 2
Zero Gate Voltage Drain Current (P-Channel, hot) IDSS -5 µA VDS = -16 V, VGS = 0 V, TJ = 55 °C 2
On-State Drain Current (N-Channel) ID(on) 3.7 A VDS = 5 V, VGS = 10 V 2
On-State Drain Current (P-Channel) ID(on) -3 A VDS = -5 V, VGS = -10 V 2
Drain-Source On-State Resistance (N-Channel) RDS(on) 0.022 Ω VGS = 10 V, ID = 2.5 A 2
Drain-Source On-State Resistance (N-Channel) RDS(on) 0.03 Ω VGS = 4.5 V, ID = 2.0 A 2
Drain-Source On-State Resistance (P-Channel) RDS(on) 0.079 Ω VGS = -4.5 V, ID = -1.2 A 2
Total Gate Charge (N-Channel) Qg 2.1 3.2 nC VDS = 15 V, VGS = 5 V, ID = 1.8 A 2
Total Gate Charge (P-Channel) Qg 2.4 3.6 nC VDS = -15 V, VGS = -5 V, ID = -1.8 A 2
Gate Resistance (N-Channel) Rg 0.5 2.4 Ω 2
Gate Resistance (P-Channel) Rg 3 11 Ω 2
Turn-On Delay Time (N-Channel) td(on) 7 11 ns VDD = 15 V, RL = 15 Ω, ID ≅ 1 A, VGEN = 10 V, Rg = 6 Ω 2
Turn-On Delay Time (P-Channel) td(on) 8 12 ns VDD = -15 V, RL = 15 Ω, ID ≅ -1 A, VGEN = -10 V, Rg = 6 Ω 2
Rise Time (N-Channel) tr 9 14 ns VDD = 15 V, RL = 15 Ω, ID ≅ 1 A, VGEN = 10 V, Rg = 6 Ω 2
Rise Time (P-Channel) tr 12 18 ns VDD = -15 V, RL = 15 Ω, ID ≅ -1 A, VGEN = -10 V, Rg = 6 Ω 2
Turn-Off Delay Time (N-Channel) td(off) 13 20 ns VDD = 15 V, RL = 15 Ω, ID ≅ 1 A, VGEN = 10 V, Rg = 6 Ω 2
Turn-Off Delay Time (P-Channel) td(off) 12 18 ns VDD = -15 V, RL = 15 Ω, ID ≅ -1 A, VGEN = -10 V, Rg = 6 Ω 2
Fall Time (N-Channel) tf 5 8 ns VDD = 15 V, RL = 15 Ω, ID ≅ 1 A, VGEN = 10 V, Rg = 6 Ω 2
Fall Time (P-Channel) tf 7 11 ns VDD = -15 V, RL = 15 Ω, ID ≅ -1 A, VGEN = -10 V, Rg = 6 Ω 2
Source-Drain Reverse Recovery Time (N-Channel) trr 35 60 ns IF = 1.05 A, dI/dt = 100 A/µs 2
Source-Drain Reverse Recovery Time (P-Channel) trr 30 60 ns IF = -1.05 A, dI/dt = 100 A/µs 2
Diode Forward Voltage (N-Channel) VSD 0.81 1.1 V IS = 1.05 A, VGS = 0 V 2
Diode Forward Voltage (P-Channel) VSD -1.1 -0.83 V IS = -1.05 A, VGS = 0 V 2

CAD (KiCad official)

  • Symbol: VB5222
  • Footprint: Package_SO:TSOP-6_1.65x3.05mm_P0.95mm
  • 3D model: TSOP-6 (KiCad packages3D, STEP)
  • 3D model files: vb5222-etched.step / vb5222-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); vb5222.step / vb5222.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: VBsemi Elec datasheet (10 pp, sha256 7dec45926d30d798, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF