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Contents

README

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S-LBZX84C2V4LT1G

LRC · Zener Diodes · SOT-23

S-LBZX84C2V4LT1G from LRC, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Anode passive Anode terminal of the zener diode; the datasheet gives a forward voltage VF of 0.90 V max at IF = 10 mA.
2 NC unconnected No connection; the datasheet pinout note lists pin 2 as no connection.
3 Cathode passive Cathode terminal of the zener diode; the nominal zener voltage VZ is specified at test currents IZT1 = 5 mA, IZT2 = 1 mA and IZT3 = 20 mA.

Key specifications

Parameter Value
Manufacturer LRC
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener voltage (nominal 2.4 V, Z11) VZ1 2.2 2.4 2.6 V @ IZT1 = 5 mA (Note 3) 2
Zener dynamic impedance ZZT1 100 Ω @ IZT1 = 5 mA 2
Zener voltage at low test current VZ2 1.7 2.1 V @ IZT2 = 1 mA (Note 3) 2
Zener dynamic impedance at low test current ZZT2 600 Ω @ IZT2 = 1 mA 2
Zener voltage at high test current VZ3 2.6 3.2 V @ IZT3 = 20 mA (Note 3) 2
Zener dynamic impedance at high test current ZZT3 50 Ω @ IZT3 = 20 mA 2
Max reverse leakage current IR 50 µA @ VR = 1 V 2
Zener voltage temperature coefficient VZ -3.5 0 mV/k @ IZT1 = 5 mA 2
Diode capacitance C 450 pF @ VR = 0, f = 1 MHz 2
Forward voltage VF 0.9 V @ IF = 10 mA 2
Total device dissipation, FR-5 board PD 225 mW FR-5 Board (Note 1), TA = 25°C 1
Derating above 25°C, FR-5 board 1.8 mW/°C Derate above 25°C, FR-5 Board (Note 1) 1
Thermal resistance junction to ambient, FR-5 board RθJA 556 °C/W FR-5 Board (Note 1) 1
Total device dissipation, alumina substrate PD 300 mW Alumina Substrate (Note 2), TA = 25°C 1
Derating above 25°C, alumina substrate 2.4 mW/°C Derate above 25°C, Alumina Substrate (Note 2) 1
Thermal resistance junction to ambient, alumina substrate RθJA 417 °C/W Alumina Substrate (Note 2) 1
Junction and storage temperature TJ, Tstg -55 150 °C 1
Maximum case temperature for soldering 260 °C 10 seconds 1

CAD (KiCad official)

  • Symbol: S-LBZX84C2V4LT1G
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: s-lbzx84c2v4lt1g-etched.step / s-lbzx84c2v4lt1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); s-lbzx84c2v4lt1g.step / s-lbzx84c2v4lt1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: LRC datasheet (5 pp, sha256 b90ba094c94d24f4, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF