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Contents

README

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ASMD1210-200

Shenzhen JDT Fuse · Resettable Fuses · 1210

ASMD1210-200 from Shenzhen JDT Fuse, in a 1210. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive One terminal pad of the non-polarized resettable PTC fuse (tin-plated nickel-copper, 1.0±0.1 mm pad), rated 2.00 A hold / 4.00 A trip at 25°C, 6 V dc max and 100 A max fault current.
2 2 passive Second terminal pad of the non-polarized resettable PTC fuse, interchangeable with the other pad, spaced 2.0±0.1 mm from it on a 2.8±0.1 mm wide body.

Key specifications

Parameter Value
Manufacturer Shenzhen JDT Fuse
Package 1210
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum operating voltage (V max) V max 6 V dc At rated current (Imax) 3
Maximum fault current (I max) I max 100 A At rated voltage (V max) 3
Hold current (I hold) I hold 2 A @25°C, 25°C still air; maximum current device will not trip 3
Trip current (I trip) I trip 4 A @25°C, 25°C still air; minimum current at which device will always trip 3
Power dissipation in tripped state (Pd) Pd 0.8 W Typ.; tripped state, 25°C still air, rated voltage 3
Ambient operating temperature -40 85 °C Ambient operating conditions 4
Maximum surface temperature in tripped state 125 °C Device in tripped state 4
Storage temperature 0 35 °C Storage condition, ≤70%RH 5
Storage relative humidity 70 %RH Storage condition, 0°C to 35°C 5
Reflow peak temperature (Tp) Tp 260 °C Pb-free assembly reflow profile 5
Time from 25°C to peak temperature 8 min Pb-free reflow profile 5
Ramp-up rate (Ts max to Tp) 3 °C/s Pb-free reflow profile 5
Ramp-down rate 6 °C/s Pb-free reflow profile 5
Maximum recommended paste thickness 0.25 mm Reflow soldering 5
Resistance change, passive aging 5 % ±5% typical; +85°C, 1000 hrs 4
Resistance change, humidity aging 5 % ±5% typical; +85°C, 85% R.H., 168 hours 4
Resistance change, thermal shock 33 % ±33% typical; +85°C to -40°C, 20 times 4

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts Copper tin Terminal pad materials:Tin-plated Nickel-Copper 6

CAD (KiCad official)

  • Symbol: ASMD1210-200
  • Footprint: Fuse:Fuse_1210_3225Metric
  • 3D model: 1210 (KiCad packages3D, STEP)
  • 3D model files: asmd1210-200-etched.step / asmd1210-200-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); asmd1210-200.step / asmd1210-200.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shenzhen JDT Fuse datasheet (9 pp, sha256 c42b669570fcef47, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF