component
BS107PSTZ
Public Made by Adomby adom
Diodes Incorporated MOSFETs, TO-92-2.54mm. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
Open in new tab ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Symbol & Footprint
Schematic Symbol
Open full view ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
PCB Footprint
Open full view ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
Datasheet
Open in new tab ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
Contents
README
markdownBS107PSTZ
Diodes Incorporated · MOSFETs · TO-92-2.54mm
BS107PSTZ from Diodes Incorporated, in a TO-92-2.54mm. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | D | passive | Drain terminal of the 200V N-channel enhancement-mode VDMOSFET, rated for 120 mA maximum continuous drain current and 2 A pulsed drain current. |
| 2 | G | input | Gate terminal, with a gate-source voltage rating of ±20 V. |
| 3 | S | passive | Source terminal of the MOSFET. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Diodes Incorporated |
| Package | TO-92-2.54mm |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDSS | 200 | V | 2 | |||
| Gate-Source Voltage | VGSS | -20 | 20 | V | 2 | ||
| Continuous Drain Current | ID | 120 | mA | 2 | |||
| Pulsed Drain Current | IDM | 2 | A | 2 | |||
| Power Dissipation | PD | 500 | mW | Note 5: through-hole on minimum recommended pad layout, 12mm lead length, single-sided FR-4 PCB, still air | 2 | ||
| Thermal Resistance, Junction to Ambient | RθJA | 200 | °C/W | Note 5: through-hole on minimum recommended pad layout, 12mm lead length, single-sided FR-4 PCB, still air | 2 | ||
| Thermal Resistance, Junction to Leads | RθJL | 71 | °C/W | Note 6: junction to solder-point at seating plane, 2.5mm from bottom of package along drain lead | 2 | ||
| Operating and Storage Temperature Range | TJ, TSTG | -55 | 150 | °C | 2 | ||
| Drain-Source Breakdown Voltage | BVDSS | 200 | 230 | V | ID = 100µA, VGS = 0V | 2 | |
| Zero Gate Voltage Drain Current | IDSS | 30 | nA | VDS = 130V, VGS = 0V | 2 | ||
| Drain Cut-Off Current | IDSX | 1 | µA | VDS = 70V, VGS = 0.2V | 2 | ||
| Gate-Source Leakage | IGSS | -10 | 10 | nA | VGS = 15V, VDS = 0V | 2 | |
| Gate Threshold Voltage | VGS(TH) | 1 | 3 | V | ID = 1mA, VDS = VGS | 2 | |
| Static Drain-Source On-Resistance (typ 15, max 23 at VGS = 2.6V) | RDS(ON) | 15 | 23 | Ω | VGS = 2.6V, ID = 25mA | 2 | |
| Static Drain-Source On-Resistance (VGS = 5V) | RDS(ON) | 30 | Ω | VGS = 5V, ID = 100mA | 2 | ||
| Forward Transconductance | gfs | 100 | mS | VDS = 25V, ID = 250mA | 2 | ||
| Input Capacitance | Ciss | 85 | pF | VDS = 25V, VGS = 0V, f = 1.0MHz | 2 | ||
| Output Capacitance | Coss | 20 | pF | VDS = 25V, VGS = 0V, f = 1.0MHz | 2 | ||
| Reverse Transfer Capacitance | Crss | 7 | pF | VDS = 25V, VGS = 0V, f = 1.0MHz | 2 | ||
| Turn-On Delay Time | tD(ON) | 7 | ns | VDD = 25V, ID = 250mA | 2 | ||
| Turn-On Rise Time | tR | 8 | ns | VDD = 25V, ID = 250mA | 2 | ||
| Turn-Off Delay Time | tD(OFF) | 16 | ns | VDD = 25V, ID = 250mA | 2 | ||
| Turn-Off Fall Time | tF | 8 | ns | VDD = 25V, ID = 250mA | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | Terminals: Finish - Matte Tin Plated Leads, Solderable per MIL-STD-202, Method 208 | 1 |
CAD (KiCad official)
- Symbol:
BS107PSTZ - Footprint:
Package_TO_SOT_THT:TO-92_Inline - 3D model: TO-92-2.54mm (KiCad packages3D, STEP)
- 3D model files:
bs107pstz-etched.step/bs107pstz-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bs107pstz.step/bs107pstz.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Diodes Incorporated datasheet (5 pp, sha256
e089aa6deb26a2e6, retrieved 2026-10-20, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).