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THS4511RGTT

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Texas Instruments Low Noise Amplifiers (LNA) - RF, VQFN-16-EP(3x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Datasheet

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Contents

README

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THS4511RGTT

Texas Instruments · Low Noise Amplifiers (LNA) - RF · VQFN-16-EP(3x3)

THS4511RGTT from Texas Instruments, in a VQFN-16-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected No internal connection.
2 VIN- power_in Inverting amplifier input.
3 VOUT+ output Noninverting amplifier output; an output resistor is recommended close to the pin.
4 CM input Common-mode voltage input; set to midsupply internally, can be overdriven externally, and a 0.1-µF capacitor to ground is recommended near this pin.
5 VS+ power_in Positive amplifier power supply input.
6 VS+ power_in Positive amplifier power supply input.
7 VS+ power_in Positive amplifier power supply input.
8 VS+ power_in Positive amplifier power supply input.
9 CM input Common-mode voltage input; set to midsupply internally, can be overdriven externally, and a 0.1-µF capacitor to ground is recommended near this pin.
10 VOUT- output Inverted amplifier output; an output resistor is recommended close to the pin.
11 VIN+ power_in Noninverting amplifier input.
12 PD input Power-down; logic low puts part into low power mode, logic high or open for normal operation.
13 VS- power_in Negative amplifier power-supply input.
14 VS- power_in Negative amplifier power-supply input.
15 VS- power_in Negative amplifier power-supply input.
16 VS- power_in Negative amplifier power-supply input.
17 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package VQFN-16-EP(3x3)
Category Radio Frequency Chip/Antenna
Pins 17

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Offset Voltage VOS 1 4 mV TA = +25°C 4
Input Offset Voltage VOS 1 5 mV TA = -40°C to +85°C 4
Input Bias Current IB 1.75 8 15.5 µA TA = +25°C 4
Input Bias Current IB 8 18.5 µA TA = -40°C to +85°C 4
Input Offset Current IOS 0.5 3.6 µA TA = +25°C 4
Input Offset Current IOS 0.5 7 µA TA = -40°C to +85°C 4
Maximum Output Voltage High VOH 3.7 3.8 V TA = +25°C, each output with 100 Ω to midsupply 5
Maximum Output Voltage High VOH 3.6 3.8 V TA = -40°C to +85°C, each output with 100 Ω to midsupply 5
Minimum Output Voltage Low VOL 1.2 1.3 V TA = +25°C, each output with 100 Ω to midsupply 5
Minimum Output Voltage Low VOL 1.2 1.4 V TA = -40°C to +85°C, each output with 100 Ω to midsupply 5
Differential Output Voltage Swing 4.8 5.2 V TA = +25°C 5
Differential Output Voltage Swing 4.4 5.2 V TA = -40°C to +85°C 5
Maximum Quiescent Current IQ 39.2 42.5 mA TA = +25°C 5
Maximum Quiescent Current IQ 39.2 43.5 mA TA = -40°C to +85°C 5
Minimum Quiescent Current IQ 35.9 39.2 mA TA = +25°C 5
Minimum Quiescent Current IQ 35 39.2 mA TA = -40°C to +85°C 5
Power-Down Quiescent Current 0.65 0.9 mA TA = +25°C 5
Power-Down Quiescent Current 0.65 1 mA TA = -40°C to +85°C 5
Specified Operating Voltage 3.75 5 5.25 V 5
Enable Voltage Threshold 2.1 V Device assured on above 2.1 V 5
Disable Voltage Threshold 0.7 V Device assured off below 0.7 V 5
Supply voltage VSS 5.5 V VS- to VS+ 2
Differential input voltage VID 4 V 2
Output current IO 200 mA 2
Maximum junction temperature TJ 150 °C 2
Maximum junction temperature, continuous operation, long term reliability TJ 125 °C 2
Operating free-air temperature range TA -40 85 °C 2
Storage temperature range TSTG -65 150 °C 2
ESD HBM HBM 2000 V 2
ESD CDM CDM 1500 V 2
ESD MM MM 100 V 2
Thermal resistance, junction-to-case θJC 2.4 °C/W RGT (16) 2
Thermal resistance, junction-to-ambient θJA 39.5 °C/W RGT (16) 2
Power rating 2.3 W TA ≤ +25°C 2
Power rating 225 mW TA = +85°C 2

CAD (KiCad official)

  • Symbol: THS4511RGTT
  • Footprint: Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
  • 3D model: VQFN-16-EP(3x3) (KiCad packages3D, STEP)
  • 3D model files: ths4511rgtt-etched.step / ths4511rgtt-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ths4511rgtt.step / ths4511rgtt.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (36 pp, sha256 043f5b439f0bde46, retrieved 2026-11-02, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF