component
SN75C3232EPWR
Public Made by Adomby adom
Texas Instruments Pre-ordered Chips, TSSOP-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownSN75C3232EPWR
Texas Instruments · Pre-ordered Chips · TSSOP-16
SN75C3232EPWR from Texas Instruments, in a TSSOP-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | C1+ | passive | Positive lead of the C1 charge-pump capacitor. |
| 2 | V+ | power_out | Positive charge pump output for a storage capacitor only; the datasheet absolute maximum for V+ is 7 V. |
| 3 | C1- | passive | Negative lead of the C1 charge-pump capacitor. |
| 4 | C2+ | passive | Positive lead of the C2 charge-pump capacitor. |
| 5 | C2- | passive | Negative lead of the C2 charge-pump capacitor. |
| 6 | V- | power_out | Negative charge pump output for a storage capacitor only; the datasheet absolute maximum for V- is -7 V. |
| 7 | DOUT2 | output | RS-232 line data output to the remote RS-232 system, rated ±15 kV HBM and ±15 kV IEC 61000-4-2 air-gap / ±8 kV contact ESD. |
| 8 | RIN2 | input | RS-232 line data input from the remote RS-232 system, rated ±15 kV HBM and ±15 kV IEC 61000-4-2 air-gap / ±8 kV contact ESD. |
| 9 | ROUT2 | output | Logic data output to the UART. |
| 10 | DIN2 | input | Logic data input from the UART; accepts 5-V logic with a 3.3-V supply. |
| 11 | DIN1 | input | Logic data input from the UART; accepts 5-V logic with a 3.3-V supply. |
| 12 | ROUT1 | output | Logic data output to the UART. |
| 13 | RIN1 | input | RS-232 line data input from the remote RS-232 system, rated ±15 kV HBM and ±15 kV IEC 61000-4-2 air-gap / ±8 kV contact ESD. |
| 14 | DOUT1 | output | RS-232 line data output to the remote RS-232 system, rated ±15 kV HBM and ±15 kV IEC 61000-4-2 air-gap / ±8 kV contact ESD. |
| 15 | GND | power_in | Ground reference for the device; the pin table labels it GRD while the pin figure labels it GND. |
| 16 | VCC | power_in | Supply voltage; connect to an external 3-V to 5.5-V power supply. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | TSSOP-16 |
| Category | Interface ICs |
| Pins | 16 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| VCC supply voltage range | VCC | -0.3 | 6 | V | 4 | ||
| Positive output supply voltage range | V+ | -0.3 | 7 | V | 4 | ||
| Negative output supply voltage range | V- | -7 | 0.3 | V | 4 | ||
| Supply voltage difference | V+, V- | 13 | V | 4 | |||
| Driver input voltage range | VI | -0.3 | 6 | V | Drivers | 4 | |
| Receiver input voltage range | VI | -25 | 25 | V | Receivers | 4 | |
| Driver output voltage range | VO | -13.2 | 13.2 | V | Drivers | 4 | |
| Receiver output voltage range | VO | -0.3 | V | Receivers | 4 | ||
| Operating virtual junction temperature | TJ | 150 | °C | 4 | |||
| Storage temperature range | Tstg | -65 | 150 | °C | 4 | ||
| Electrostatic discharge, human-body model | V(ESD) | -3000 | 3000 | V | HBM, per ANSI/ESDA/JEDEC JS-001 | 4 | |
| Electrostatic discharge, charged-device model | V(ESD) | -1500 | 1500 | V | CDM, per JEDEC JESD22-C101 | 4 | |
| Supply voltage | VCC | 3 | 3.3 | 3.6 | V | VCC = 3.3 V | 5 |
| Supply voltage | VCC | 4.5 | 5 | 5.5 | V | VCC = 5 V | 5 |
| Driver high-level input voltage DIN | VIH | 2 | V | VCC = 3.3 V | 5 | ||
| Driver high-level input voltage DIN | VIH | 2.4 | V | VCC = 5 V | 5 | ||
| Driver low-level input voltage DIN | VIL | 0.8 | V | 5 | |||
| Driver input voltage DIN | VI | 0 | 5.5 | V | 5 | ||
| Receiver input voltage | -25 | 25 | V | 5 | |||
| Operating free-air temperature | TA | 0 | 70 | °C | SN75C3232E | 5 | |
| Supply current | ICC | 0.3 | 1 | mA | No load, VCC = 3.3 V or 5 V | 6 | |
| High-level output voltage | VOH | 5 | 5.5 | V | DOUT at RL = 3 kΩ to GND, DIN = GND | 6 | |
| Low-level output voltage | VOL | -5.4 | -5 | V | DOUT at RL = 3 kΩ to GND, DIN = VCC | 6 | |
| High-level input current | IIH | -1 | 0.01 | 1 | μA | VI = VCC | 6 |
| Low-level input current | IIL | -1 | 0.01 | 1 | μA | VI at GND | 6 |
| Short-circuit output current | IOS | -60 | 35 | 60 | mA | VCC = 3.6 V, VO = 0 V | 6 |
| Short-circuit output current | IOS | -90 | 35 | 90 | mA | VCC = 5.5 V, VO = 0 V | 6 |
| Output resistance | ro | 300 | Ω | VCC, V+, and V- = 0 V, VO = ±2 V | 6 | ||
| Low-level output voltage | VOL | 0.4 | V | IOL = 1.6 mA | 6 | ||
| Positive-going input threshold voltage | VIT+ | 1.5 | 2.4 | V | VCC = 3.3 V | 6 | |
| Positive-going input threshold voltage | VIT+ | 1.8 | 2.4 | V | VCC = 5 V | 6 | |
| Negative-going input threshold voltage | VIT- | 0.6 | 1.2 | V | VCC = 3.3 V | 6 | |
| Negative-going input threshold voltage | VIT- | 0.8 | 1.5 | V | VCC = 5 V | 6 | |
| Input hysteresis (VIT+, VIT-) | Vhys | 0.3 | V | 6 | |||
| Input resistance | ri | 3 | 5 | 7 | kΩ | VI = ±3 V to ±25 V | 6 |
| Maximum data rate | 1000 | kbit/s | RL = 3 kΩ, one DOUT switching, CL = 250 pF, VCC = 3 V to 4.5 V | 7 | |||
| Pulse skew | tsk(p) | 300 | ns | CL = 150 pF to 2500 pF, RL = 3 kΩ to 7 kΩ | 7 | ||
| Slew rate, transition region | SR(tr) | 14 | 150 | V/μs | RL = 3 kΩ to 7 kΩ, CL = 150 pF to 1000 pF, VCC = 3.3 V | 7 | |
| Junction-to-ambient thermal resistance | RθJA | 108 | °C/W | PW (TSSOP) 16-pin package | 5 | ||
| Junction-to-case (top) thermal resistance | RθJC(top) | 39 | °C/W | PW (TSSOP) 16-pin package | 5 | ||
| Junction-to-board thermal resistance | RθJB | 54.4 | °C/W | PW (TSSOP) 16-pin package | 5 | ||
| Junction-to-top characterization parameter | ψJT | 3.3 | °C/W | PW (TSSOP) 16-pin package | 5 | ||
| Junction-to-board characterization parameter | ψJB | 53.8 | °C/W | PW (TSSOP) 16-pin package | 5 |
CAD (KiCad official)
- Symbol:
SN75C3232EPWR - Footprint:
Package_SO:TSSOP-16_4.4x5mm_P0.65mm - 3D model: TSSOP-16 (KiCad packages3D, STEP)
- 3D model files:
sn75c3232epwr-etched.step/sn75c3232epwr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);sn75c3232epwr.step/sn75c3232epwr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (31 pp, sha256
6de758a0c2727c38, retrieved 2026-10-28, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).